The status quo of additive manufacturing and inkjet printing  How EHD technology is pushing the boundaries  EHD in practice – applications for industry  Implementation of EHD technology into the Notion Systems ecosystem  The status quo of additive manufacturing and inkjet printing Author: Simon Rihm | Notion Systems | https://www.linkedin.com/in/rihmsimon/ (1)    The status quo of additive manufacturing and inkjet printing Over the past two decades, additive manufacturing has undergone a profound transformation, evolving from a technology primarily confined to prototyping into a cornerstone of modern industrial production. This transformation is driven by its high flexibility, strong potential for customization, shorter development cycles, and efficient use of materials. By depositing material only where needed, additive processes significantly reduce waste compared to conventional methods - an advantage that is particularly important for expensive or scarce materials such as titanium alloys or high-purity metals. Additionally, additive manufacturing enables the production of complex structures that are difficult or impossible to achieve with traditional techniques, leading to lighter and higher-performance components. The growing significance of additive manufacturing is especially evident in the electronics and semiconductor industries. These fields are defined by ongoing miniaturization, increasing integration density, and extremely stringent precision requirements. Conven...

Applications: Antennas · Electrodes · Conductors · Heaters · Circuit Boards Conventional flex-PCB production is still dominated by wet chemical etching or printed conductive inks—processes built around multiple material steps, hazardous chemicals, and inherently unstable cost structures driven by silver and other volatile inputs. While widely adopted, these methods are increasingly misaligned with what the market now demands: scalable production, supply chain resilience, regulatory compliance, and verifiable sustainability. Across industries, regulatory pressure is tightening. ESG (Environmental, Social and Governance) reporting requirements, restrictions on hazardous substances, and increasing scrutiny of chemical-intensive manufacturing processes are forcing companies to rethink not only what they produce, but how  it is produced and documented. At the same time, geopolitical uncertainty and material volatility are exposing the fragility of globalized, chemistry-dependent supply chains. DP Patterning’s patented Dry Phase Patterning (DPP)  technology was developed to remove these constraints entirely. At its core, DP Patterning replaces chemistry-based etching processes with a fully dry, mechanical roll-to-roll method. Instead of defining circuit geometry by selectively removing material through etchants and chemical processes, the pattern is formed directly in a metal-clad flexible substrate—typically aluminum or copper-based laminates—using mechanical processing. The proce...

The Future of Electronics RESHAPED USA   conference and exhibition ( 10 & 11 JUNE 2026, Mountain View ) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum , this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks  from around the world, 8 industry- or expert-led masterclasses , 2 tours , and over 75 onsite exhibitors . In this article, we discuss and highlight various innovative talks at the event around the theme of Material Innovations in Printed Electronics . In previous articles we covered process advancements, R2R manufacturing, smart surfaces and sensing, printed photovoltaics and more. Explore the   full agenda  now and join the global industry in Mountain View on 10 & 11 JUNE 2026 . Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire Tatsuta – Robert Wilson  discusses silver-coated copper particle conductive pastes . Robert explores the critical challenge of copper oxidation, which severely impacts the reliability of low-cost interconnects when replacing expensive silver. By engineering silver-coated copper particles, Tatsuta combines the cost adv...

The Future of Electronics RESHAPED USA  conference and exhibition ( 10 & 11 JUNE 2026, Mountain View ) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum , this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks  from around the world, 8 industry- or expert-led masterclasses , 2 tours , and over 75 onsite exhibitors . In this article, we discuss and highlight various innovative talks at the event around the theme of Additive Electronics in Packaging and PCB Manufacturing . In other articles we cover themes like materials innovation, hybrid electronic manufacturing and scale-up, wearables and sensors, soft robotics, additive and 3D electronics, sustainable electronics, and more. Explore the   full agenda  now and join the global industry in Mountain View on 10 & 11 JUNE 2026 . Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire GE Aerospace Research – David Lin  discusses 3D MEMS IMU enabled by additive packaging . In this session, David explores how traditional 3D assembly is highly susceptible to long-term drift driven by package-induced stress. By utilizing an additively...

The Future of Electronics RESHAPED USA   conference and exhibition ( 10 & 11 JUNE 2026, Mountain View ) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum , this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks  from around the world, 8 industry- or expert-led masterclasses , 2 tours , and over 75 onsite exhibitors . In this article, we discuss and highlight various innovative talks at the event around the theme of Wearable Sensors, Actuators and Soft Robotics .  In other articles we cover themes like materials innovation, additive electronics in packaging and PCBs, wearables and sensors, soft robotics, additive electronics in packaging and PCB production, sustainable electronics, and more. Explore the   full agenda  now and join the global industry in Mountain View on 10 & 11 JUNE 2026 . Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire GE Healthcare – Gurvinder Singh Khinda  discusses sustainability in single-use medical sensors and devices . Gurvinder explores the significant environmental burden of biohazardous single-use products and the sanitati...

The Future of Electronics RESHAPED USA  conference and exhibition ( 10 & 11 JUNE 2026, Mountain View ) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum , this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks  from around the world, 8 industry- or expert-led masterclasses , 2 tours , and over 75 onsite exhibitors . In this article, we discuss and highlight various innovative talks at the event around the theme of Hybrid Electronic Manufacturing and Scale-Up . In other articles we cover themes like materials innovation, additive electronics in packaging and PCBs, wearables and sensors, soft robotics, additive and 3D electronics, sustainable electronics, and more. Explore the   full agenda  now and join the global industry in Mountain View on 10 & 11 JUNE 2026 . Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire NextFlex – Dan Gamota  discusses manufacturing readiness for hybrid electronics . In this session, Dan explores the lack of standardized data and validated qualification pathways that currently slow the transition from lab innovation to industri...

The Future of Electronics RESHAPED USA   conference and exhibition ( 10 & 11 JUNE 2026, Mountain View ) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic  Computer History Museum , this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with  over 75 superb invited talks  from around the world,  8 industry- or expert-led masterclasses ,  2 tours , and  over 75 onsite exhibitors . In this article, we discuss and highlight various innovative talks at the event around the theme of  Additive, Digital and/or 3D Electronics: Process Innovation .  In other articles we cover themes like materials innovation, additive electronics in packaging and PCBs, wearables and sensors, soft robotics, additive electronics in packaging and PCB production, sustainable electronics, and more. Explore the  full agenda  now and join the global industry in  Mountain View on 10 & 11 JUNE 2026 . Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire Lockheed Martin – Paul Gaylo  discusses  enabling high-temperature antennas with additive manufacturing . Paul explores why material availability alone fails to solve high-temperature design, as tr...

Andrew Stemmermann & John Yundt SunRay Scientific Inc. Wall Township, NJ USA andrew@sunrayscientific.com   johny@sunrayscientific.com SunRay Scientific Inc of Wall Township, NJ, USA continues to develop new and innovative technologies for electronic component assembly with their portfolio of novel ZTACH® ACE anisotropic conductive adhesives, printed conductive inks and dielectric and encapsulation materials. Introduction Today’s electronics manufacturers are confronted with a growing need for higher performance, lightweight, cost competitive, printed flexible hybrid electronics. This often requires the bonding of fine pitch components in high density and volumes. Factors for success include the capability of the conductive bonding technology to manage the pitch, bond strength requirements, cost constraints, and manufacturing throughput needs. Most available technologies employed in today’s FHE environment have limitations that can either hamper one or more of these important factors. Traditional component bonding technologies can struggle with the requirements for printed FHE applications. Solder, while very low cost and highly conductive, has limitations due to the required processing temperatures, brittle properties, and low bond strength. As a result, it will always require secondary encapsulation of the bonded component to ensure structural integrity. Silver-filled conductive adhesives (ECA) require patterning, which drastically limit component size and pitch, are heavil...