Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. This year the program features a world-class agenda with over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors. In this article, we discuss and highlight various innovative talks at the event around the theme of smart surfaces and sensors. In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. Explore the full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨Register before 12 September to save 200 Euros on top of early bird discounts. This is a one-time offer. The coupon can be obtained here🚨 Toyota – Michael Rowe presents technology opportunities beyond automotive, showcasing cross-industry applications of actuator, sensor, and material innovations. Highlights include shape memory alloy (SMA) wire actuators delivering lightweight, translational motion with integrated feedback; near-IR reflective pigments enabling hidden data transfer for a...

We cover these points by sharing short (1min or so) handpicked snippets from their live recent talks at TechBlick and MicroLED Connect conferences and exhibitions In this newsletter we cover the following MicroLED Wafer Metrology and Calibration Strategies Assessing the Practicality of MicroLED Displays for Mass Production Stamp-Based Imprinting for AR Waveguide Manufacturing Advances in Mass Transfer Processes for MicroLED Chip Integration VR vs. AR: Market Outlook and Growth Limitations Perovskite Quantum Dots for High-Density Color Conversion Challenges and Advances in Native Red MicroLED Efficiency Etching and Deposition Solutions for MicroLED Materials Progress Toward Emissive Quantum Dot–EL Displays Cubic GaN as a Novel Platform for Scalable MicroLEDs Wafer-to-Wafer Integration for MicroLED Microdisplays MicroLED Smart Glasses and Market Update for AR Applications Integrated Production Platforms for Scalable MicroLED Manufacturing Join the MicroLED Connect + AR/VR Connect 2025 on 24 & 25 Sept 2025 at the High Tech Campus in Eindhoven (Netherlands). Explore full agenda here and register before 12 Sept when the FINAL early bird rates expire https://www.microledconnect.com/ https://www.microledconnect.com Manufacturing Processes & Integration Advances in Mass Transfer Processes for MicroLED Chip Integration Mass transfer remains one of the biggest hurdles for cost-effective microLED displays. At MicroLED-Connect 2024, Toray Engineering presented a new transfer method combi...

Authors: Alan Brown, Dr. Jay R Dorfman, Zac Hudson, Brandon Peters Contact: abrown@nagasechemtex.com, Nagase ChemteX America, LLC In the rapidly evolving field of Printed Electronics, the demand for robust, durable, and highly stretchable conductive inks is paramount for advancing applications in wearable technology and hybrid electronics. While existing conductive inks offer some degree of stretchability, they often exhibit a trade-off between mechanical resilience and electrical performance, leading to a significant increase in resistivity under strain. This limitation poses a critical challenge for engineers designing products that require consistent electrical conductivity across a wide range of motion. Nagase ChemteX America, LLC. (NCU) has developed a next-generation conductive ink, CI-1096, that is formulated to address this gap by providing superior stretchability while maintaining excellent and stable electrical resistivity. Our work constitutes a novel material solution that enables the development of more reliable and versatile stretchable electronic devices, paving the way for future innovations in biomedical sensors, smart textiles, and flexible displays. Stretch Ink Wearable Electrode NCU began this project with the goals of developing a Ag ink with increased stretchability, superior durability and high conductivity compared to CI-1036, an NCU Ag ink that has been on the market >10 years. This paper will document some of the challenges incurred during develo...

Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. This year the program features a world-class agenda with over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors. In this article, we discuss and highlight various innovative talks at the event around the theme of Additive and 3D Electronics Manufacturing Process Innovation. In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. In previous articles we introduced other innovations in Additive and 3D electronics (see here) and also key material related innovations which will be showcased at the show (see here) Explore the full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. Explore the Full Agenda and Register before 12 September 2025 for the best rates GE Aerospace – Felippe Pavinatto presents additive electronics for aerospace applications in harsh environments. Examples include direct-write 3D printed passive RF sensors operating up to 1000 °...

22 & 24 October 2025 | ECC, Berlin | Conference & Exhibition This is the must-attend event of the year, focusing on additive, printed, 3D sustainable, wearable, flexible, hybrid, soft, stretchable, textile, structural and R2R electronics. This year the event will feature:

✅ 100+ speakers
✅ 90+ exhibitors showcasing all the key innovations
✅ 12 expert- and industry-led masterclasses
✅ 3 guided tours
✅ Networking with 600+ global participants
✅ Annual access to all TechBlick online events, on-demand version of all onsite events, as well as an on-demand library featuring over 1500 talks and masterclasses.
🚨Register before 12 September to save 200 Euros on top of early bird discounts. This is a one-time offer. The coupon can be obtained here🚨
Explore The Agenda See the most up-to-date conference agenda here 22 October | Conference Day 1 Track 1 09:00 | TechBlick | Welcome & Introduction 09:10 | Toyota | Technology Opportunities That Go Beyond Automotive 09:30 | Fuji Corporation | Additively manufactured multi-layer and stacked circuits with embedded electronics components 09:50 | Lockheed Martin | Flexible Hybrid Electronics in the Wild: How Copper Printing and Flexible RF Circuits Made it Out of the Lab and Into the Field 10:10 | NanoPrintek | Inkless Multimaterial Printing Directly from Raw Materials - Breaking the Barriers in Cost, Time, Pollution, and Supply Chain Networking Break 11:15 | University of Rome Tor Vergata | Scalable and Ambient-Air Processing of...

#PerovskiteSolarCells #OLED #OrganicPV #PrintedElectronics #NanoInks #ElectronTransportLayer #FlexibleElectronics #Optoelectronics #RollToRoll #SmartMaterials #EnergyTech #SolarInnovation #DisplayTechnology #NextGenMaterials #SustainableElectronics
Author: Maryam Bari & Ashwani Jain PINA CREATION Unlocking printable, low-temperature charge transport layers for next-generation optoelectronics As next-generation optoelectronic technologies—such as Perovskite solar cells (PSCs), OLED displays, and Organic photovoltaics (OPVs)—move from lab to large-scale manufacturing, the pressure is on to find materials that are not only high-performing, but scalable, stable, and compatible with printed device architectures. A critical bottleneck remains the Electron Transport Layer (ETL) and Hole Transport Layer (HTL). For technologies relying on delicate or flexible substrates, traditional materials such as Organic Semiconductors and traditional metal oxide inks pose serious limitations. High-temperature processing, moisture sensitivity, high cost, and limited lifetime all threaten the viability of commercial deployment. At PINA Creation, we’ve developed a line of ready-to-use SnO₂, NiO and ZnO nano inks that overcome these barriers and unlock practical, large-area fabrication for flexible and rigid optoelectronics. We are Exhibiting in Berlin. Visit our booth at the TechBlick Perovskite Connect event co-located with the Future of Electronics RESHAPED on 22-23 October 2025 in Berlin...

Perovskite Connect conference and exhibition | 22 & 23 OCT 2025, ECC, Berlin | Co-located with the Future of Electronics RESHAPED Berlin 2025 Perovskite Connect 2025 is shaping up to be the must-attend event for the perovskite industry, bringing together leading innovators, researchers, and manufacturers from across the globe. Taking place on 22–23 October 2025 at the ECC in Berlin, this specialist conference will run alongside the flagship Future of Electronics RESHAPED show. This article highlights some of the key talks that will take place during this conference. Explore the Full Agenda and Register before 12 September 2025 for the best rates Oxford PV – Edward Crossland presents the world’s first commercial perovskite-silicon tandem module. Breaking silicon’s efficiency limits, tandem technology delivers higher performance with minimal changes to existing production lines. The talk highlights Oxford PV’s milestone 2024 shipment, recent advances, and solutions for durability, scalability, and environmental compliance, demonstrating readiness for large-scale deployment. Hangzhou Microquanta Semiconductor – Yang Chen discusses the commercial readiness of perovskite PV. Drawing on lessons from industrial validation and field deployment, the talk addresses solutions to challenges in stability, efficiency, and scalable manufacturing. Insights into certification and real-world testing show how perovskite PV is evolving into a commercially viable alternative to silicon. Swift So...

Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics.

This year the program features a world-class agenda with over over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors. In this article, we discuss and highlight various innovative talks at the event around the theme of Material, Ink and Paste Innovations.

In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond.

Explore the full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. Heraeus Electronics – Ryan Banfield presents bridging additive and subtractive technologies through solderable polymer thick films. The talk highlights advances in polymer thick-film conductors that overcome long-standing barriers of poor solderability and thermal stability. This breakthrough enables flexible, low-cost circuits while reducing reliance on environmentally intensive subtractive manufacturing processes.

Blackleaf – Michael Friess presents graphene-based el...