We highlight important advancements in MicroLED and/or QD displays in this article using technology slides. More specifically, we cover 3600PPI “Silicon” Displays | Gravure printed microbumps | Electrohydrodynamically printed QD color converters | Laser LLO and Transfer for MicroLEDs | QD vs Phosphors | Energy saving credentials of MicroLED These advancements of the art will be presented at TechBlick’s 2-day global conference on “Mini- & Micro-LED Displays: Markets, Manufacturing Innovations, Applications, Promising Start-ups” taking place online in TechBlick’s ‘in-person virtual’ platform on 30 Nov - 1 Dec 2022. The agenda includes the likes of Samsung, Sharp, AUO, Coherent, ASMPT, Komori, CEA, Micledi, 3D Micromac, Allows Semiconductors, and many more. Full agenda can be seen here www.TechBlick.com/microLEDs. “Silicon” Displays with an incredible 3600ppifull color using microLED and QD technology? Sharp (HIRANO Yasuakie et al) has developed this technology. As shown in the slide below, first blue-only uLEDs are formed on a sapphire substrate. Here, one LED array contains 352 x 198 micro LED dies of 24 um x 8 um in size. In parallel, an LSI chip containing the driving circuitry is formed on a silicon wafer. Here, the cathode (N-type electrode) and anode (P-type electrode) are fabricated for each micro-LED die to apply driving voltage independently to each die. The Au bump electrodes are fabricated in accordance with the pitch of the LED dies. The two substrates are flip-chi...

Speaker: Franz Vollman | Company: Heraeus | Date: 10-11 March 2021 | Full Presentation Electromagnetic interference (EMI) is increasingly becoming a problem in design of electronic devices – especially in 5G mobile phones. Higher frequencies, reduced height and real estate in the phone and increasingly dense packaging of sensitive components causes interferences and requires new solutions. To meet this challenge Heraeus now offers an innovative digital system solution based on a particle-free Ag-ink and inkjet printing technology. This provides excellent shielding performance, high thru-put on mass manufacturing equipment, the possibility to apply selective shielding without the need for any masking and thus the most cost effective EMI shielding solution. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

Speaker: Andreas Friedrich | Company: Geely | Date: 10-11 March 2021 | Full Presentation Printed Electronics is one of the game changing technologies that will be a design enabler for future lightweight and smart solutions in many areas of Automotive. In this presentation we look at some of those, with the viewing angle of a designer and see what opportunities they might bring us and what challenges are still left to be solved. Andreas Friedrich Chief Designer @ Geely Design Bio Andreas Friedrich has a long track record in the automotive industry. He has worked with various customers, amongst others 8 years with Volvo Interior design during his 20 years with Consultancy company Semcon. Since 2013 he is part of Lynk & Co Design in Sweden where they design the Lynk & Co cars. There he has been working with Interior Design of the first car and was employed in 2016 as Chief Designer for Advanced Interior. Now he is Chief Designer for New Tech & Innovation and supports the whole GeelyDesign community of brands. As a trained Architect and Industrial Designer he has always had a big interest in New Technologies and how that can be used to enhance the user experience. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Re...

Printed electronics and power electronics? There is a direct link via die attach materials. Indeed, this is a success story but as with many other such stories in printed electronics, it gets called something else once it reaches the market. So what is this story? Many die attach systems in power electronics (IGBT Mosfets, SiC, GaN, LEDs, etc) continue to use solder. Thanks to wide band semiconductors *WBS), the trend is towards ever higher areal power densities which translates into higher junction temperature. Indeed this shift to WBS means that the semiconductor is no longer the limiting factor, but the packaging materials. One such material that falls short is lead-free solder. At operating temperatures like 175C (target is 200C and beyond), the max temperature of the solder should be 265C if the homologous temperature is to be 50% or less. The first slide below shows that lead-free solders do not have a high enough melting temperature. The common SAC solder falls clearly short. AuSn or SnAgSb might be options, but even they are forced to operate near their limit.
To solve this shortcoming, sintered metal die attach materials (Ag and Cu) offer a good alternative. The table in slide 2 table shows that sintered Ag (also Cu) has a bulk-like melting temperature, enabling very high operating/junction temperatures. The thermal conductivity – depending on the sintering- can be very high, even much higher than AuSn.
The technology is already commercial for many years in plac...

Speaker: Dave Rice | Company: TactoTek | Date: 10-11 March 2021 | Full Presentation Brands increasingly use electronic functions and styling to delight their customers and reflect their design language. However, conventional electronics assemblies often come with design constraints and integration challenges that limit innovation. TactoTek develops and licenses in-mold structural electronics (IMSE™) technologies that merge mechanics and electronics into smart molded structures. IMSE parts deliver electronic functions in light, thin, 3D structures that are economically mass produced and environmentally friendly. TactoTek will introduce IMSE technology, discuss functional capabilities and key processes for making IMSE parts. Dave Rice SVP Marketing & Business Development @ TactoTek Bio Dave Rice leads marketing and product management at TactoTek®. He has built a career of transforming technology innovation into high value solutions for electronics and software markets for start-ups and mature public companies. He and his team engage prospects to identify market needs aligned with TactoTek’s in-mold structural electronics (IMSE™) technology, help focus internal technology development and collaborate with ecosystem partners for a full product solution. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.t...

Written by: Tessa Reder and Kate Laing | Voltera Experimenting in the world of Flexible Hybrid Electronics (FHE) comes with a variety of hurdles. Printing technologies are vastly different in terms of materials compatibility and have pros and cons that make them suitable for particular applications. Choosing materials that match the printing technology you intend to use is the most important decision you’re going to make.

NOVA, Voltera’s new direct-ink write (DIW), precision dispensing, and 3D printing platform for printed electronics, changes the landscape on which the field of FHE is built. Providing the opportunity to experiment with any screen printable material, and customize and re-design patterns on the fly, NOVA allows a materials flexibility that has never been experienced before. “Additive manufacturing is transforming what electronics are, as well as their role in the world around us. If you want to print on a thermoplastic stretchable elastomer, like a rubbery material, with NOVA — you can do that. And all of a sudden you have an electronic device that has the mechanical properties of the skin. This is something that was never possible before with traditional electronics,” said Matt Ewertowski, Product Manager at Voltera, during a Made in Ontario podcast interview with Professor Gerd Grau, Director of the E-AM lab at York University. As additive electronics technology evolves, researchers like Professor Grau and his group are pushing the boundaries of how the ad...

This is an interesting development in the world of printed electronics introduced by Prof.Ana Claudia Arias from University of California Berkeley at the ePrint Swiss conference which took place a few weeks ago in Buchs, Switzerland. This technology is now being commercialized by InkSpace Imaging


As shown in slide one, the basis of this technology are coils composed of a loop of wires (inductance) and four capacitors, two of which are used to match RF power of MRI and two are used to tune for skin frequency. The current non-printed incumbent manufacturing process for commercial coils is based on high-quality electronic components such as porcelain capacitors, thick copper traces (75um or so) and low-loss substrate (e.g., 75-μm-thick Pyralux AP low-loss substrate)


The challenge with the current technology is that the current coil arrays are made for adults, as shown in slide two. As such, they do not fit well to the contours of the pediatric body. The misfit adds to discomfort for babies who may have to be subjected to MRI once a week because MRI is the safe option since it does not exposure patient to ionization radiation. Furthermore, the poor physical fit also means a poor signal-to-noise ratio, meaning that long scan times (e.g., 2 hours) will be needed to obtain images with sufficient resolution (note: typical exposure times are 20-30min for adults). This makes it very difficult for pediatric patients in particular who may need to be sedated to prevent motion artefact...

microLEDs can be directly integrated with CMOS drivers (instead of usual TFT backplane) enabling high-PPI displays suited to AR/MR glasses, metaverse, and even in some cases large-area displays. The key technological challenge for this is the hybridization and/or monolithic integration of GaN microleds and CMOS. This is no easy feat as it involves heterogenous hybridization or integration of two different material systems: GaN and Si. Over the years, several technologies have been proposed by companies and institutions to hybridize the two parts. They are ranging from hybridization techniques to full monolithic 3D integration. These options – explored from over the last decade from 2011 to 2022- are depicted in the slide below, which offers a clear categorization of the techniques, e.g., hybridization vs monolithic integration, direct vs indirect bonding, align vs non-aligned, etc. In this presentation, François Templier from CEA-Leti will review these techniques and explain challenges for their fabrication at TechBlick's specialist event on microLEDs on 30NOV-1Dec www.TechBlick.com/microLEDs . Some examples of solutions will be given, such as microtube technology and recent results with hybrid bonding. More info www.TechBlick.com/microLEDs...