Speaker: Franz Vollman Company: Heraeus Lets reshape the future of Selective Metallic Coatings. Inkjet printing of 2.5D selective coatings becomes reality with our novel solution consisting of a special particle-free silver ink, an industrial hi-tech printer for mass production and a manufacturing process that translates any standard CAD format of a coating drawing into accurate selectively coated components. Our system adds a new dimension to package design, empowering package designers to create varied pattern layouts efficiently. Customized thin metallization films are possible in the range of 150 nm to 3 μm with a conductivity of 20-50% of bulk silver. The equipment fulfills the standards of the semiconductor industry, and its mass production capability is proven. This additive manufacturing method is especially suited for EMI shielding of semiconductor packages to secure signal integrity in 5G applications. Digital printing via inkjet enhances the design freedom thanks to maskless selective coating of package topsides, sidewalls (e.g. with stand-off), as well as trenches for compartmental shielding. Shielding effectiveness studies run at a specialized renowned institute confirm that the applied silver film with 2 μm thickness, which is inkjet-coated at the ideal, material saving aspect ratio of 1:1 (side wall to top side), provides excellent shielding performance. The maskless selective and precise deposition of the silver ink onto specific areas of the components avoid...

The 3D Printed Electronics market is rapidly growing and, according to several research and marketing studies, is estimated to reach multi-billion dollars annually over the next several years with double-digit growth. The 3rd dimension is more than just an additional space to add electronics; it implies a more optimized use of the space, it becomes a powerful tool to enhance products that are currently limited due to shape and size requirements. Adding planar electronics to non-planar or round objects means making the object larger and using bolts, wires and mounts to hold the electronics in place. This is a standard, and even state of the art method, to make an object electrically functional. However, it wastes space, decreases the durability, adds additional steps in manufacturing for integration and imposes constraints on the users. In many cases, adding electronics is not viable given the size constraints or the complexity imposed when adding. 3D Printed Electronics combines electronic packaging with electronic integration. Adding actives with 3D printing implies that electronics can be a part of any 3D printed object. The value of this has not been fully articulated or even imagined, but early demonstrations and the imagination of some reveal that 3D Printed Electronics will not only be the next-generation of electronic packaging, but it will also revolutionize next-generation products. The discussion on CHIPS and the impact is muted without next-generation packaging. 3D...

Rechargeable anode-less solid-state lithium microbattery technology has numerous advantages over conventional alternatives. These include higher volumetric energy density (VED), significantly faster charging with a simpler charging infrastructure and the ability to deliver higher discharge pulses than Li-ion alternatives. These flexible form factor, multi-layer stacked batteries built on stainless steel are key to enabling space constrained wearables, hearables and IoT applications. Addressing the difficult challenges of manufacturing scale-up on the path to commercialization requires addressing a number of challenges ranging from materials supply chain and roll-to-roll battery fabrication management to high-speed test and novel ultrathin packaging. Some examples of these coupled with battery performance will be presented. SAVE THE DATE...

TechBlick, the leading platform for emerging technologies, has reported high demand for attendee places at the second version of its in-person event which takes place on 17 & 18 October at The Estrel, in Berlin - https://www.techblick.com/electronicsreshaped

The Future of Electronics RESHAPED conference and exhibition is the most important upcoming industry event in additive, sustainable, flexible, hybrid, wearable, structural and 3D electronics. As well as a world-class agenda and exhibition the event will also feature expert-led masterclasses and company tours to some of the innovative organisations in the Berlin area.

The exhibition booths sold out in early June and t he exhibition floor has grown by 50% compared to the 2022 event. Over 78 exhibitors from around the world, representing the entire value chain and innovation spectrum, will be in Berlin. See a full list of exhibitors here
Khasha Ghaffarzadeh, CEO of TechBlick reported "We were surprised at the high demand for exhibition booths and fortunately we were able to secure some additional exhibiting space. We have seen the same high demand for attendee places with companies excited by the quality of the speaker programme, and exhibitors. This event will be where the world’s printed electronics industry connects and does business and is an important event in the emerging technologies calendar"
The world-class agenda represents all the key research institutes and companies from around the world and ...

SAVE THE DATE...

In the dynamic landscape of retail stores, bars, clubs, and seasonal markets, the need for effective product visibility becomes even more evident. Illumination technologies are amongst the highly effective means for brand distinction and impactful visual communication. As consumer awareness around sustainability continues to grow, conventional electronics integration in product packaging faces criticism due to concerns about electronic waste and its environmental impact. Commercialization of printed and hybrid electronics provided an alternative solution offering the potential to minimizing electronic waste. Join us at TechBlick's Future of Electroncis RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped Hybrid and printed electronics use various light technologies and easily integrate into different package forms and in-store marketing tools. Within this context, there is a huge demand for ultra-thin flexible labels with preferred OLED lighting technology. Brand managers, package designers and developers face the challenge of seamlessly integrating OLED illumination into the visual language of products, particularly for bottles’ flexible labels. Years of effective market adoption of our technology platform SaralLight© with LED, EL or OLED embedded illumination approaches, brought us to the point to evaluate today’s market readiness enough for taking a step back and embracing the broader industry view. This perspective led to ...

Harsha Kolli Company: Printed Energy Printed Energy, early-stage US based hard science company with deep expertise in electro chemistry, printed electronics, and manufacturing automation. The current focus is on flexible, printed, and thin batteries integrated into fully built-up circuits for a complete device such as active RFID. These batteries are non-toxic, environmentally friendly and can be manufactured in any shape and size based on customer requirements. Some of the applications include, smart tags and labels, wearables, medical supplies, tags for timed sporting events, and many other internet of things (IoT) uses. Even though Printed Energy is starting to enter the market, the team has been working on development of thin printed batteries for many years. The unique value that Printed Energy brings to its customer is the ability to manufacture fully integrated device that is cost competitive with coin-cell battery devices. Our proprietary manufacturing line allows us to enter the market and deliver high quality devices at a highly competitive price. Printed Energy’s initial product offering includes delivering disposable Active RFID tag solutions to an existing market with roadmap that includes Semi-Passive tags, temperature loggers and wearable cosmetic/medical patches. SAVE THE DATE...

Voltera Jesus Zozaya For years, researchers and product developers have searched for tools that will help get ideas out of their heads and into their hands. About a decade ago, we began to see the emergence of materials that showed promise for bringing these ideas to life. The term “flexible hybrid electronics” (or FHE) gave a name to what was trying to be accomplished. This growing field crosses a number of verticals and is utilized across seemingly endless applications, but there are still challenges that remain, including an incohesive value chain. At Voltera, we believe that collaboration is the answer. Since launching NOVA, our modular dispensing platform last year, we have been working with researchers, companies, and government agencies to collaborate and build a cohesive value chain. We believe that collaboration not only solves problems, but is also a catalyst for innovation. Behind every new idea is a team of people working to overcome obstacles. They are the academics researching new applications, scientists developing new materials, and hardware companies, like Voltera, who are developing the printing technology required to put your ideas into your hands.Voltera Jesus Zozaya SAVE THE DATE...