On-Site Masterclasses
On 9 June, the day before the conference and exhibition, you can participate in industry- and expert-led masterclasses as well as tours of local companies and research facilities.
In the morning (9:00 to 12:45) you can participate in the masterclasses. You will have a choice of 8 classes, organised in two parallel sessions. You can attend 4 classes in person but the other classes will be available on our platform after the event for you to view.
Each 45-min masterclass will cover a technology or application in detail, offering an insightful blend of practical, technical and application knowledge. These masterclasses will be delivered by industry experts and some may involve live demonstrations.
After lunch, you can participate in one of two tours. We will take you to the facility by bus and bring you back to the conference venue at around 4:30pm. Contact christoph@techblick.com if you have any queries.
Masterclasses | Track 1
9:00AM
Henkel
Materials & Processes for Printed Antennas
Julie Ferrigno
Printed antennas now deliver reliable low to mid frequency performance using high conductivity silver inks, which offer precise features and scalable processing. Emerging silver plated copper (SPC) inks provide a lower cost option with similar RF behavior. At higher frequencies, Henkel’s silver filled inks achieve low roughness and uniform thickness needed for efficient RF designs. Pad printing further enables additive, high throughput manufacturing of 3D antenna structures. Key results and examples will be presented.
11:00 AM
Screentec
Future of medical electrodes supply chains
Antti Tauriainen
The presentation will cover how to start development of new wearable medical sensors and how to take into account Technical, Usability, Quality and Environmental requirements for disposable goods.
In the changing requirements of medical regulations, environmental needs and material supply chains - more focus on ensuring working and steady supply of products requires new approaches to design, manufacturing and supply chain management.
12:00 PM
Auburn University
In-Mold Electronics (IME): Reliability, Design Rules, and Harsh-Environment Performance
Pradeep Lall
In-Mold Electronics (IME) represents an innovative approach that significantly enhances the integration of design and functionality by merging printed decorations and electronic circuitry with structural components through advanced techniques such as thermoforming and molding. A major contributor to the overall weight of mobility electronics in both ground and airborne vehicles is the extensive use of wire harnesses. These harnesses are crucial for transmitting signals from an array of sensors, cameras, and touch surfaces to central processing units, including the engine control unit (ECU) and powertrain control units (PCUs). In typical vehicles, these wire harnesses can span 2-3 kilometers, adding considerable weight and complexity. However, by adopting lightweighting strategies for the automotive platform,manufacturers can realize substantial weight savings. One of the most effective methods involves eliminating traditional wire harnesses and integrating wiring directly into structural plastics or body panels. This transformative approach fosters the development of "smart plastics" that not only supportstructural integrity but also enable essential electronic functions. Moreover, manufacturers can achieve additional cost efficiencies by using additive manufacturing techniques to integrate sensors and circuits directly into the plastics. The shift to IME techniques substantially reduces reliance on conventional printed circuit board (PCB) manufacturing and assembly practices, as well as on traditional snap-lock connectors for wire-harness interconnections. This integration has the potential to significantly reduce the overall size and weight of electronic systems in vehicles. The transition to IME processes can yield impressive results, with potential reductions in size and weight of up to 70 percent. This reduction translates into increased operational efficiency, providing electric vehicles with extended mileage per charge and enhancing fuel efficiency in internal combustion engine vehicles. In addition to these
performance gains, adopting IME technology reduces manufacturing tooling requirements by up to 80 percent, simplifying production setup. The streamlined bill of materials and decreased part count also facilitate easier logistics support, making the overall manufacturing process more efficient and cost-effective. This presentation aims to demonstrate the various process recipes and practical applications of additive in-mold techniques. Additionally, it will delve into the interactions between these innovative processes and their impact on product performance, showcasing the future of automotive electronics integration.
BIOGRAPHY
Pradeep Lall
MacFarlane Distinguished Professor, Alumni Professor and Director, Auburn University
Bio: Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Department of Mechanical Engineering. He is Director of Auburn University’s Electronics Packaging Research Institute and Director of the Alabama Node of NextFlex. He holds Joint Courtesy Appointments in the Department of Electrical and Computer Engineering. He is a member of the technical council, governing council and academic co-lead of the automotive and asset monitoring TWGs of NextFlex Manufacturing Institute. He is the author and co-author of over 1,000 journal and conference papers, 2 books, and 15 book chapters in the field of electronics. Dr. Lall is a fellow of the ASME, a fellow of the IEEE, a Fellow of NextFlex Manufacturing Institute, and a Fellow of the Alabama Academy of Science. He is a recipient of SEMI’s FLEXI R&D Achievements Award for landmark contributions to Additive
Printed Electronics, ASME Avram Bar-Cohen Memorial Medal, IEEE Biedenbach Outstanding
Engineering Educator Award, IEEE Sustained Outstanding Technical Contributions Award, NSF Alex Schwarzkopf Award, Alabama Academy of Science Wright A, Gardner Award, IEEE Exceptional Technical Achievement Award, ASME-EPPD Applied Mechanics Award, Three-Motorola Outstanding Innovation Awards, Five-Motorola Engineering Awards, and over Fifty Best-Paper Awards.
Masterclasses | Track 2
9:00AM
Komori America Corporation
High-Resolution Gravure Offset Printing in Printed Electronics: Process Control, Applications, and Manufacturing
Reza Kazemi & Doug Schardt
This masterclass provides a general technical overview of gravure offset printing, including its working principle, key process steps, and main application considerations. The session will explain how gravure offset differs from conventional gravure printing and discuss the factors that influence print quality, consistency, and material compatibility.
The talk will also review the general advantages and limitations of the process, along with common application areas and important considerations related to plates, blankets, pattern design, and process parameters. The objective is to provide attendees with a clear understanding of gravure offset printing as a manufacturing and development method for high-quality patterned deposition.
10:00 AM
Swansea University
Challenges and Opportunities in High‑Resolution Screen Printing
John Lau
This masterclass examines advanced functional screen printing from a process‑level perspective, focusing on how accuracy, consistency, and reliability arise from control of the overall printing system rather than individual parameters.
It considers the interaction between mesh, ink–substrate behaviour, and tooling and equipment setup, outlining how materials choices and press configuration influence print definition, repeatability, and process limits.
By linking fundamental understanding with industrial observation, the session offers insight into the development and application of robust, high‑accuracy functional screen‑printing processes.
11:00 AM
Iowa State University
Aerosol Printing in Electronics: Bridging Process Science to Practical Implementation
Ethan Secor
This masterclass will center on translating fundamental principles for aerosol printing to support practical implementation. Drawing on examples from recent literature and our own work, we will briefly describe a framework for understanding the aerosol printing process, and then explore its impact across material and process development. We will specifically focus on key challenges, connecting underlying mechanisms to practical solutions and ongoing development, in four primary areas: process reliability, overspray, process optimization, and conformal patterning. For process reliability, we will discuss drift mechanisms and the development of real-time process monitoring and closed loop control tools. For overspray, we will highlight a key mechanism of overspray related to in-line drying, the broader implications of this for material formulation, and research results demonstrating significant overspray mitigation. On the topic of process optimization, we will highlight ongoing efforts to incorporate theoretical principles in data-driven approaches for efficient process development. Finally, development of motion planning strategies for conformal patterning will highlight opportunities to exploit key advantages of the printing process. Altogether, this will aim to leverage an evolving understanding of process fundamentals to enable more efficient and effective use across various end-use applications of aerosol printing.
Masterclasses | Track 1
9:00AM
Henkel
Materials & Processes for Printed Antennas
Julie Ferrigno
Printed antennas now deliver reliable low to mid frequency performance using high conductivity silver inks, which offer precise features and scalable processing. Emerging silver plated copper (SPC) inks provide a lower cost option with similar RF behavior. At higher frequencies, Henkel’s silver filled inks achieve low roughness and uniform thickness needed for efficient RF designs. Pad printing further enables additive, high throughput manufacturing of 3D antenna structures. Key results and examples will be presented.
11:00 AM
Screentec
Future of medical electrodes supply chains
Antti Tauriainen
The presentation will cover how to start development of new wearable medical sensors and how to take into account Technical, Usability, Quality and Environmental requirements for disposable goods.
In the changing requirements of medical regulations, environmental needs and material supply chains - more focus on ensuring working and steady supply of products requires new approaches to design, manufacturing and supply chain management.
12:00 PM
Auburn University
In-Mold Electronics (IME): Reliability, Design Rules, and Harsh-Environment Performance
Pradeep Lall
In-Mold Electronics (IME) represents an innovative approach that significantly enhances the integration of design and functionality by merging printed decorations and electronic circuitry with structural components through advanced techniques such as thermoforming and molding. A major contributor to the overall weight of mobility electronics in both ground and airborne vehicles is the extensive use of wire harnesses. These harnesses are crucial for transmitting signals from an array of sensors, cameras, and touch surfaces to central processing units, including the engine control unit (ECU) and powertrain control units (PCUs). In typical vehicles, these wire harnesses can span 2-3 kilometers, adding considerable weight and complexity. However, by adopting lightweighting strategies for the automotive platform,manufacturers can realize substantial weight savings. One of the most effective methods involves eliminating traditional wire harnesses and integrating wiring directly into structural plastics or body panels. This transformative approach fosters the development of "smart plastics" that not only supportstructural integrity but also enable essential electronic functions. Moreover, manufacturers can achieve additional cost efficiencies by using additive manufacturing techniques to integrate sensors and circuits directly into the plastics. The shift to IME techniques substantially reduces reliance on conventional printed circuit board (PCB) manufacturing and assembly practices, as well as on traditional snap-lock connectors for wire-harness interconnections. This integration has the potential to significantly reduce the overall size and weight of electronic systems in vehicles. The transition to IME processes can yield impressive results, with potential reductions in size and weight of up to 70 percent. This reduction translates into increased operational efficiency, providing electric vehicles with extended mileage per charge and enhancing fuel efficiency in internal combustion engine vehicles. In addition to these
performance gains, adopting IME technology reduces manufacturing tooling requirements by up to 80 percent, simplifying production setup. The streamlined bill of materials and decreased part count also facilitate easier logistics support, making the overall manufacturing process more efficient and cost-effective. This presentation aims to demonstrate the various process recipes and practical applications of additive in-mold techniques. Additionally, it will delve into the interactions between these innovative processes and their impact on product performance, showcasing the future of automotive electronics integration.
BIOGRAPHY
Pradeep Lall
MacFarlane Distinguished Professor, Alumni Professor and Director, Auburn University
Bio: Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Department of Mechanical Engineering. He is Director of Auburn University’s Electronics Packaging Research Institute and Director of the Alabama Node of NextFlex. He holds Joint Courtesy Appointments in the Department of Electrical and Computer Engineering. He is a member of the technical council, governing council and academic co-lead of the automotive and asset monitoring TWGs of NextFlex Manufacturing Institute. He is the author and co-author of over 1,000 journal and conference papers, 2 books, and 15 book chapters in the field of electronics. Dr. Lall is a fellow of the ASME, a fellow of the IEEE, a Fellow of NextFlex Manufacturing Institute, and a Fellow of the Alabama Academy of Science. He is a recipient of SEMI’s FLEXI R&D Achievements Award for landmark contributions to Additive
Printed Electronics, ASME Avram Bar-Cohen Memorial Medal, IEEE Biedenbach Outstanding
Engineering Educator Award, IEEE Sustained Outstanding Technical Contributions Award, NSF Alex Schwarzkopf Award, Alabama Academy of Science Wright A, Gardner Award, IEEE Exceptional Technical Achievement Award, ASME-EPPD Applied Mechanics Award, Three-Motorola Outstanding Innovation Awards, Five-Motorola Engineering Awards, and over Fifty Best-Paper Awards.
Masterclasses | Track 2
9:00AM
Komori America Corporation
High-Resolution Gravure Offset Printing in Printed Electronics: Process Control, Applications, and Manufacturing
Reza Kazemi & Doug Schardt
This masterclass provides a general technical overview of gravure offset printing, including its working principle, key process steps, and main application considerations. The session will explain how gravure offset differs from conventional gravure printing and discuss the factors that influence print quality, consistency, and material compatibility.
The talk will also review the general advantages and limitations of the process, along with common application areas and important considerations related to plates, blankets, pattern design, and process parameters. The objective is to provide attendees with a clear understanding of gravure offset printing as a manufacturing and development method for high-quality patterned deposition.
10:00 AM
Swansea University
Challenges and Opportunities in High‑Resolution Screen Printing
John Lau
This masterclass examines advanced functional screen printing from a process‑level perspective, focusing on how accuracy, consistency, and reliability arise from control of the overall printing system rather than individual parameters.
It considers the interaction between mesh, ink–substrate behaviour, and tooling and equipment setup, outlining how materials choices and press configuration influence print definition, repeatability, and process limits.
By linking fundamental understanding with industrial observation, the session offers insight into the development and application of robust, high‑accuracy functional screen‑printing processes.
11:00 AM
Iowa State University
Aerosol Printing in Electronics: Bridging Process Science to Practical Implementation
Ethan Secor
This masterclass will center on translating fundamental principles for aerosol printing to support practical implementation. Drawing on examples from recent literature and our own work, we will briefly describe a framework for understanding the aerosol printing process, and then explore its impact across material and process development. We will specifically focus on key challenges, connecting underlying mechanisms to practical solutions and ongoing development, in four primary areas: process reliability, overspray, process optimization, and conformal patterning. For process reliability, we will discuss drift mechanisms and the development of real-time process monitoring and closed loop control tools. For overspray, we will highlight a key mechanism of overspray related to in-line drying, the broader implications of this for material formulation, and research results demonstrating significant overspray mitigation. On the topic of process optimization, we will highlight ongoing efforts to incorporate theoretical principles in data-driven approaches for efficient process development. Finally, development of motion planning strategies for conformal patterning will highlight opportunities to exploit key advantages of the printing process. Altogether, this will aim to leverage an evolving understanding of process fundamentals to enable more efficient and effective use across various end-use applications of aerosol printing.
Masterclasses | Track 3
Company Tours | 9 June 2026
Silicon Valley is a region in Northern California that is a global center for high technology and innovation.
In the afternoon of 9 June, we will be organising several guided tours to the state-of-the-art research centres and companies in and around Silicon Valley, allowing you to experience the best-in-class facilities first hand.
These tours are open to attendees on the morning masterclasses. Places on the tours will be allocated on a first come, first served basis.
The tours will leave at 1.30pm and attendees should meet at the registration desk. Transportation will be provided and the tours are expected to return to the Computer History Museum by 4.30pm.
Ensurge Micropower | 2026
Tour to Ensurge Micropower
Visit Ensurge Micropower — where solid-state microbattery innovation is moving from development toward scalable manufacturing. This guided tour offers an inside look at Ensurge’s thin-film, all-solid-state microbattery technology platform and the manufacturing approach behind next-generation energy storage for wearables, hearables, medical devices, industrial IoT, and connected electronics. Guests will learn how Ensurge is advancing high-energy-density, rechargeable microbatteries through materials innovation, process development, product validation, and roll-to-roll manufacturing capabilities designed to support future commercial scale-up.
NextFlex
Tour to NextFlex
Visit the NextFlex Technology Hub - where ideas become prototypes and innovation comes to life. This guided tour offers an inside look at how advanced manufacturing, next-generation workforce training, and collaboration across industry, academia, and government support the mission of NextFlex, America’s Hybrid Electronics Manufacturing Innovation Institute.
To join this tour, please email Christoph@techblick.com until 5th of June 2026 with the following information:
Full Name
Company
Email Address
Country of Citizenship
Guests will gown up and enter our manufacturing spaces including Print and Assembly, and a look into our Test and Automation Lab. See emerging technologies in action and meet the team shaping the future of hybrid electronics and intelligent systems.
The tour also includes our demonstrator area, showcasing project work completed by NextFlex and our network of 200+ members and partners across application areas such as aerospace and automotive, industrial and communications, and healthcare and wearables.
Whether you’re an industry leader, innovator, educator, or policymaker, the NextFlex Technology Hub tour delivers insight, inspiration, and real-world impact.
Discover how NextFlex is accelerating innovation - from concept to commercialization.