We are delighted to announce a fresh, cutting-edge and exciting agenda covering the entire spectrum of innovations, manufacturing, and applications. We invite you to explore this agenda featuring 70+ speakers including the likes of Forvia, European Space Agency, Meta, Decathlon, Airbus, Air Force Research Laboratories, Fuji, Datwyler, Motherson Innovations, Würth Elektronik, Avery Dennison, LPKF, Marquardt, Louisenthal Papierfabrik, imec, NExtflex, and many others. In addition, you can enjoy an exhibition floor featuring ca. 80 onsite exhibitors and network with over ca. 650 participants from around the world. Book your ticket before 12 July 2024 and save upto 700 EUR Coupon: Save100Euro Explore Agenda and  Book Before 12 July Conference Agenda: You can browse the agenda below. For the most up-to-date version please refer to https://www.techblick.com/electronicsreshaped 23.OCT.2024 | Track 1 TechBlick | Welcome & Introduction Forvia | Smart surfaces in automotive interiors* European Space Agency | Unlocking the Future of Space Electronics with Advanced Manufacturing Networking Break Flexoo | Mass customization & mass production of Smart Sensors Beckermus Technologies | Challenges of interconnections between chips and flex substrates Avery Dennison Smartrac | Green Printing in the Digital Landscape - from fab to mass production SPGPrints | The 3 C’s of de-risking industrialized Printed Electronics production TU Eindhoven | The road ahead for integrated photonics Lunch & Exhibition Break Motherson Innovations | From Heating to Transparent Sensing to Lighting Elements in Smart Surfaces Würth Elektronik Group | State of the art of the industrial stretchable PCB and its potential for future development Metafas | InMold Electronics: Technical and Business Transition from Membrane Switches to 3D InMold Electronics* Kimoto | Next-generation 3D Formable Substrates* Exhibition & Refreshment Break Marquardt GmbH | Printed electronics: why is it difficult to leave the ‘trough of disillusionment’? Semikron Danfoss | Classifying Additive Electronic Manufacturing Technology: From 2D to 3D and From Simple to Complex System ------------------------------- 23.OCT.2024 | Track 2 BSC Computer / Momentive | Sustainable Motion based on Silicone X-Trodes | Soft electrode array for skin electro-physiology: New opportunities in sleep studies and rehabilitation Creative Materials | Advances in Materials for Additively Manufactured Electronics Skin Patches MacDermid Alpha Electronic Solutions | Novel substrates for InMold Electronics* Printed Electronics Ltd | TBC Lunch & Exhibition Break DECATHLON | How Plastronic LDS process can reduce CO² emissions for Electronics devices Horizon Microtechnologies | Hybrid Microfabrication by 3D printing and subsequent Coating for Electronics and Radio-Frequency Applications LPKF Laser & Electronics | LPKF Laser & Electronics SE Exxelia Micropen | Functionalization of Medical Devices Using Additive Dispense Technology Exhibition & Refreshment Break ------------------------------- 23.OCT.2024 | Track 3 Fuji Corporation | New era of additive manufactured electronics with the integration of SMT process and machine. Elephantec | Printed Electronics as sustainable solutions Nano OPS | Fully Additive Manufacturing of Electronics at the Nano and Microscale for Making Active Components and Integrated Circuits Notion Systems | Advancing Additive Processes into Electronics Mass Production - Breaking Boundaries One at a Time Henkel | Advancing Pad Printable Solutions with Henkel Materials Teca-Print | Advancing Pad Printable Solutions with Henkel Materials Lunch & Exhibition Break imec | Sustainable Electronics: A detailed comparison of additive manufacturing and subtractive PCB processing* Pragmatic Semiconductor | Bringing flexible intelligence to Medicine 3.0 Essemtec | Enhancing circular economy by facilitating the repair of electronic components Jiva Materials Ltd | Fully recyclable PCB substrate ----------- 24.OCT.2024 | Track 1 Binghamton University | Fabrication of Multi-Sensor Vital Sign Patches for Ambulatory Care* NextFlex | Flexible Hybrid Electronics: Challenges in Technology Transition from Lab to Product Ceradrop | TBC Voltera | Multi-layer Printed Battery for Versatile Integration in Wearables, Medical Applications, Smart Packaging, Smart Sensors & more Exhibition & Refreshment Break Texavie | Empowering Personalized Therapy and Wellness Anywhere with Texavie’s MarsWear Smart Apparels Danish Technological Institute | DTI Printed Electronics: On body eTextile sensors for physiological and neurological monitoring Datwyler | Smart Elastomer based Sensors and Actuators Nanoleq | Unique Sticky Dry Electrode for Innovative Textile Integration (reusable, washable, stretchable) PROFACTOR | Concept for direct integration of electronic circuits and sensors on textiles using inkjet printing. Lunch & Exhibition Break Fuelium | Fit-To-Purpose batteries for responsible portable electronics. Sungkyunkwan University | Sustainable Roll-to-Roll Printing Foundry for Realizing 4 Things: Internet of Things (IoT), Display of Things (DoT), Vision of Things (VoT), and Care of Things (CoT) Papierfabrik Louisenthal GmbH | Large-scale fabrication of low-haze transparent metal mesh foils AdapTronics | Thin-layer electro-adhesive gripper technology with printed flexible electronics* ------------------------------ 24.OCT.2024 | Track 2 Technische Hochschule Ingolstadt | Particle Free Copper Inks Tesa | TBC Air Force Research Laboratory | Liquid Metal Inks for Printed Stretchable Electronics Ames Goldsmith | Advances in metallic particle development and manufacturing: impact on paste and final application Exhibition & Refreshment Break Coatema | Tech Pillars of the green hydrogen economy – how to scale the production methods for PEM Fuel cells from lab2fab. Panacol | Adhesive Solutions for Perovskite-based and Organic Photovoltaic Applications Fraunhofer ISE | Thinner than a human hair - fine line metallization for next-generation silicon solar cells ISC Konstanz | Copper ink and electrically conductive adhesives for future PV production FOM Technologies | The role of slot-die coating in the future of photovoltaics. Lunch & Exhibition Break University of Texas at El Paso | Additive Manufacturing of Elastomer, Ceramic and Metal Multi-functional Structures* Hasselt University | ACT-3D_Assembly and Connection Technology for 3D plastic carriers Hahn-Schickard Institute | Hybrid 3D printing of conductive bulk metal and dielectric polymer for sustainable and smart 3D electronics Karlsruhe Institute of Technology | The Aerosol-on-Demand (AoD) jet-printing principle: a novel concept for 3D-printed electronics ------------------------------- 24.OCT.2024 | Track 3 Global Access Diagnostics (GADx) | Advancing Innovative Diagnostics for Global Health Meta | Noninvasive Biopotential Sensors for Future Wearable Electronics Nagase Chemtex | Recent Developments of Conductive Inks for Printed Electronics* Exhibition & Refreshment Break Hamamatsu Photonics | Thermal Laser Processes in Printed Electronics PERC | Additive Manufacturing for Advanced Microwave and RF Applications Sun Chemical | Biosensor Materials Requirements – Challenges and Opportunities Airbus | 3D printed and hybrid electronics durability under aeronautic conditions Neotech AMT | TBC Lunch & Exhibition Break Alpha Micron | Liquid Crystal Smart Eyewear: How to achieve fastest tint-changing worldwide* Light Tree Ventures Group | Large-area wearable LED light therapy* PolyPhotonix | Saving Sight With OLED Light: Treatment for Diabetic Eye Disease* Book your ticket before 12 July 2024 and save upto 700 EURCoupon: Save100Euro Dynamic Exhibition Floor The event includes a tabletop exhibition floor featuring over 80 exhibitors. You can explore the confirmed exhibitors below. The exhibition stands are ca.90% sold out out. Explore Exhibition Floor and Book Before 12 July to Save Upto 700 EUR Book your ticket before 12 July 2024 and save upto 700 EURCoupon: Save100Euro Explore Agenda  and Book Before 12 July

In this newsletter, you can learn about the following technologies in the field of printed electronics, additive electronics and conductive inks and conductive pastes. We will have the opportunity to download the full slides. Copprint | Conductive Copper Inks Enabling Sustainable PCBs and Printed Electronics Namics Technologies Inc | Low-temperature sintering nano silver paste Elantas | Overview Of ELANTAS High Potential Functional Inks And Application Cases Celanese Micromax | Silver Sintering Pastes - Improved Bond Performance and Simplified Handling ACI Materials | Breakthrough Conductivity and Sensing With Semi­-Sintered Silver Ink The Future of Electronics RESHAPED Europe is the flagship TechBlick event. This event will take place at the Estrel Hotel and Convention Center (ECC) in Berlin on 23-24 October 2024. Explore the preliminary agenda here. 1. Conductive Copper Inks Enabling Sustainable PCBs and Printed Electronics Copprint | April 2024 In these slides you will learn about the following: Background to the history behind calling PCBs "Printed" Circuit Boards Example of the first printed conductive line Printed proximity fuses in 1943! Disadvantages of etched Cu Advantages of printed copper for PCBs Comparing printed silver vs printed copper Application examples include RFID tags, IBC Si solar cells, greener double-sided PCBs with printed copper lines and vias Benchmarking Copprint's screen printable copper inks on various substrates (PET, PC, FR4, PV, Glass, Aluminium PI, etc=vs other silver inks on the basis of conductivity vs sintering time. Download Presentation Slides 2. Low-temperature sintering nano silver paste Namics Technologies Inc |  December 2022 In this presentation you will learn the following: Low-temperature sintering pastes based on nanosilver Technical features including sintering conditions, viscosity, printing width, resistivity, adhesion, thickness, flex test, shelf life, etc Sinterability and conductivity of sintering paste vs conventional Ag pastes (comparing resistance and particle packing) Flex resistance (resistance change with bending cycle with repeated bending at various radii of curvature) Adhesion results on PC, PET, PI, CNT Film, ITO Film, etc Screen printing results Fineline printing (60um lines) Reliability tests Detailed application example: Heaters Results of printed heaters (temperature vs voltage, uniformity, stability, etc) Download Presentation Slides 3. Overview Of ELANTAS High Potential Functional Inks And Application Cases Elantas |  June 2023 In this presentation you can learn the following: Printed heaters on 3D thermoformed smart surfaces made with InMold Electronics Processing parameters and properties of various formable inks including silver, insulating and carbon inks Results: Adjusting conductivity of heater inks with graphite loading Screen printable inks (conductive + insulating) for HIGH TEMPERATURE applications on substrates like Kapton Download Presentation Slides 4. Silver Sintering Pastes - Improved Bond Performance and Simplified Handling Celanese Micromax | October 2023 In this presentation, you will learn about sintering pastes, especially for power electronic applications. In particular, you can learn the following: A short introduction to wide bandgap semiconductors SiC power inverters and how silver paste sintering is used on Si MOSFET power devices Processing conditions from stencil printing to drying to sintering Process flexibility including impacts of pressure, temperature, time, etc Paste properties including solid content, viscosity, particle size, volume resistivity, thermal conductivity, etc Cross-sectional SEM images of sintered surfaces Reliability results and stability data Working time on screen under various conditions Properties after drying Download Presentation Slides 5. Breakthrough Conductivity and Sensing With Semi­-Sintered Silver Ink ACI Materials |  April 2024 In this presentation, you can learn about semi-sintered silver inks including: Ability to use finer meshes with 20um openings Application in additively manufactured PCBs as a replacement for etched Cu Download Presentation Slides

Author: Ron Hayden, Founder and President at RH Solutions LLC. | ron@rhsolutionsllc.com #InMoldElectronics #WearableElectronics #TextileElectronics #StretchableElectronics #MedicalElectronics Precision screen printing machines have emerged as the premier choice for manufacturing printed electronics due to their unparalleled accuracy, efficiency, and versatility. These machines are essential in producing high-quality electronic components on flexible substrates, which are increasingly in demand in various industries, from consumer electronics to medical devices. One of the key advantages of precision screen printing is its ability to achieve fine-line patterns necessary for modern electronic devices. Automatic screen printing machines enable the precise application of conductive inks, solder pastes, and adhesives, which are critical for the functionality and reliability of printed electronics[2]. This high precision minimizes errors and ensures consistent production quality, reducing waste and production time. Figure 1: ATMALINE RR5060/C - Automatic CCD registration corrects alignment of the coiled material substrate on each printing pass for unrivaled accuracy. A prime example of innovation in this field is the ATMA CCD camera screen printing machine. These machines utilize advanced camera optics combined with servo-driven components to enhance precision and alignment, which is crucial for the intricate patterns required in flexible electronics. The ATMAOE model, for instance, eliminates the need for the I-cut process after digital printing, streamlining the manufacturing process and further enhancing efficiency[3] Figure 2 - Suitable for high precision screen printing on the coiled flexible (or film) material, such as conductive films, biotech sensors, blood glucose testers, etc. The versatility of precision screen printing machines is evident in their application across various substrates, including flexible printed circuits (FPCs) and ITO conductive films. These machines are designed to handle the unique challenges posed by flexible materials, ensuring that the electronic components maintain their integrity and performance even under bending and stretching conditions[1]. In conclusion, precision screen printing machines, exemplified by ATMA's advanced models, are the optimal choice for manufacturing printed electronics. Their ability to deliver high-precision, consistent, and efficient production makes them indispensable in the rapidly evolving electronics industry. Sources rhsolutionsllc.com – ATMALINE RR5060/C linkedin.com - Global Automatic Screen Printing Machines for Electronics cubbison.com - Being Close Doesn't Cut It! Perfecting Precision with Screen Printing Technology We are Exhibiting in Boston. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Visit our booth at this long-awaited TechBlick US event on 12-13 June 2024 in Boston. This is the most important industry and research meeting in our field in the US.

#InMoldElectronics #WearableElectronics #TextileElectronics #StretchableElectronics #MedicalElectronics Innovation and collaboration are the driving forces behind taking a novel idea from concept to commercialization. Innovation requires change and improvement, in raw materials, and in the manufacturing process, which leads to new and improved products that are shaping the future of the medical and industrial markets. Within the innovation process, contract manufacturers play a pivotal role, serving as the driving force behind the realization of novel ideas. As a contract manufacturer, Innovation is at the root of CTI’s success. Here, we will discuss the intricacies of innovation from our unique perspective as a contract manufacturer to the medical and industrial markets. Author: Alicen Pittenger | Director of Sales apittenger@conductivetech.com Collaborating on Innovative Novel Ideas: Contract manufacturers are positioned at the center of the innovation process, bridging the gap between ideation and commercialization. We can translate concepts designed at the bench into mass-produced commercial goods. As the glucose testing market migrated from traditional glucose testing, with strips and meters, companies looked to us, once a leading manufacturer of glucose strips, for the development, and production, of components for continuous glucose monitoring devices. Identifying and Integrating New Materials: Innovation is a constantly evolving process, as a contract manufacturer, We are assisting in the ever-changing demands of new products and new technologies. Contract manufacturers must exhibit the ability to adapt to the changes and emerging trends in the technical advancements of raw materials. We stays at the forefront of the advancement of new materials through relationships with material manufacturers and suppliers. As a leading contract manufacturer, in both the medical device and industrial markets, we are a leading partner with manufacturers of substrates and conductive inks. Our access to the latest technologies available on the market provides a path to successful innovation. PET and polyester continue to be the most popular materials for printed electronics. CTI can print on 3 mil material before having to add a backer material for printing. We are Exhibiting in Berlin! Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Visit our booth at this TechBlick Europe event on 23-24 October 2024. This is the most important industry and research meeting in our field in Europe. Global Reach and Local Expertise: We operate within a global framework, leveraging a network of resources and expertise to advance innovation. Global reach coupled with local expertise remains invaluable during times of procurement constraints brought on by world events. This combination of global reach and local expertise places CTI in a unique position as a contract manufacturer, one that can incorporate global resources into a domestic manufacturing facility, mitigating any risks associated with off-shoring. Engineering and Manufacturing: At the core of every innovative product lies a blend of engineering and manufacturing excellence. CTI invests heavily in engineering and new manufacturing techniques. We have been at the forefront of advancements in printed electronics with manufacturing components that require multi-layered fine-line screen printing with a tolerance of .3 mil and .05 mil feature of size and laser ablation at tolerances of 10 microns. Each project presents a new challenge, demanding innovative solutions and meticulous attention to detail. Point-of-care laboratory testing continues to grow the need for printed electrochemical test strips. In addition to printing the strips, CTI specializes in reagent deposition. Regent deposition can be placed in amounts from 1 – 5 microliters. After reagent deposition, CTI can place the lids and spacers on the test strip and deliver a fully functionalized product. Scalable for Commercialization: The path to innovation starts with work at the bench in a research laboratory with the finish line being full-scale commercialization. Along the way to commercialization, there are going to be pitfalls and hurdles to overcome which will require skill, experience, and resourcefulness that have been outlined above. With over 50 years of working to bring innovative products to market, We have a proven track record of innovation because if a contract manufacturer fails to innovate, they fail to exist. Join Us in Berlin! Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Visit our booth at this TechBlick Europe event on 23-24 October 2024. This is the most important industry and research meeting in our field in Europe.

Steve Paschky | Managing Director Sales & Marketing at SARALON GmbH Among the emerging areas for Printed Electronics (PE), wearables and automotive industries are rapidly adopting this technology on a commercial scale. These sectors are heavily investing in PE due to its several advantages mainly: PE supports invisible electronics PE eliminates the complexities of bulky electronics integrations PE allows direct printing on lightweight substrates, leading to substantial weight reduction #InMoldElectronics #WearableElectronics #TextileElectronics #StretchableElectronics #MedicalElectronics Stretchable electronics: A significant driver of Printed Electronics industry The transformative impact of PE is not only due to enabling experimentation with various ink materials and functionalities, but also encouraging the use of div erse substrate materials. More specifically in the wearables and automotive sectors, electronics printing on stretchable substrates is highly desirable: Stretchable electronics easily flex to fit complex car interior geometries. They offer excellent conformity to the human body ideal for health monitoring wearables and medical patches Fully integrated PE on textiles offer comfort and movement flexibility in smart garments They adopt easily to 3D shapes or thermoformed in the IME process perfect for automotive electronics To support these needs, Saralon GmbH has developed all the essentials for producing stretchable Printed Electronics. Stretchable Saral Inks© include Silver, Carbon-based and non-conductive inks for different stretchable and bendable substrates. On ink targets textile materials by containing larger silver particles to reduce unwanted permeation; the other is designed for printing on paper and thus doesn’t require high-temperature curing. Stretchable Saral Inks© are formulated to adhere to various substrates such as TPU, PC, PET, textile, paper, and other elastic or bendable materials. An inclusive system of compatible stretchable inks Stretchable Saral Inks© can be printed on top of each other, allowing for integrated printing in diverse combinations and stretchable overlays for healthcare and sports wearables, smart textiles, stretchable heaters, 3D smart objects, and high resistance stretchable Printed Electronics: Saral StretchSilver 800: for TPU and other plastics such as PC for thermoforming and IME Saral StretchSilver 500: Solvent-based stretchable conducting ink for textiles and other rough substrates Saral StretchSilver H2O 600: for sustainable paper and other bendable applications Saral StretchCarbon 100 for low-conductive bendable electronics (e.g. heaters) Saral StrecthDielectric 100 for encapsulation and protection of conductive layers Stretchable EL ink set for stretchable electroluminescent on TPU (e.g. wearables, security or promotional textile applications) Full compatibility of Saral Inks© is guaranteed leading to significant time and cost reduction in RnD at PE developers' end. All Saral Inks© are suitable for all types of screen printing and other printing processes, e.g., flexographic printing, pad printing, dispense and gravure printing. Ink adjustments based on request is also possible to meet the specific demands of innovative projects. Next, let’s move on to a brief overview of each ink, their properties and target applications. Saral StretchSilver 800: Solvent-based stretchable conducting ink for direct printing on TPU and other plastic stretchable surfaces. When printed on TPU and dried at 120°C for 10 min, it shows a good initial sheet resistance of 30 mΩ/sq/25 μm and very good adhesion on the surface. Printed Saral StretchSilver 800 conductive ink on PC withstands high temperatures, pressure, and elongation during the thermoforming process. This simplifies the fabrication of highly customizable and conformal 3D electronics for HMI applications e.g., in automotive and white industries. As the demand for IME continues to grow, manufacturers are looking for innovative ways to create products that meet both functional and aesthetic requirements. Presenting stretchability and thermoformability properties, SaralStretch Silver 800 offers greater design flexibility, easier electronics integration in 3D shapes and complex geometries, and significant weight and cost reduction due to the elimination of bulky conventional wiring systems. Compatibility with our screen-printable conductive adhesive – Saral SilverGlue Alpha 600 – makes it easy to apply SMD components on TPU/PC substrates and create stretchable/thermoformable hybrid electronics. Figure 1- Saral StretchSilver 800 printed on TPU Saral StretchSilver 500: Solvent-based stretchable conducting ink specifically designed for textiles and other rough surfaces. When printed on knitted fabric of PET/EL blend and dried at 120°C for 10 min, the initial sheet resistance is 25 mΩ/sq/25 μm. Bigger silver particle size in this ink prevents its penetration into the porous surface, resulting in good conductivity preservation upon stretch and after tension release. Performance tests conducted by STFI (Renown independent textile research institution in Saxony) benchmarking Saral StretchSilver 500 against an alternative stretchable ink available in the market indicated its superior properties in terms of stretchable conductivity, controllable printing thus process reliability and reproducibility. This ink is the optimised solution for smart textiles in sports, therapeutical, protective garments and other innovative applications. Figure 2- Saral StretchSilver 500 printed on textile Saral StretchSilver H2O 600: Water based stretchable conducting ink developed to withstand creasing lines in paper electronics thus doesn’t require high-temperature curing. Direct printed on paper and dried at 120°C for 2 minutes in oven, the ink shows a good sheet resistance of 40 mΩ/sq/25 μm. This ink is the specialty solution to the growing demand for more sustainable non-solvent and paper-based print applications. Due to its low temperature curing and bendability characteristics (creasing lines), Saral StretchSilver H2O 600 is ideal for paper-based and disposable electronics – smart labels for track-trace and logistics monitoring, medical applications e.g. lab-on-a-chip for diagnostics, diabetes sensors, etc. Figure 3- Saral StretchSilver H2O 600 printed on paper Saral StretchCarbon 100: Solvent-based stretchable carbon ink suitable for direct printing on different substrates such as TPU or bendable plastics. Characterized with high sheet resistance of 100 Ω/sq/25 μm (printed on PET and dried at 120°C for 5 minutes in oven), this ink is a promising candidate for stretchable electronic devices including resistors, sensors, or heating elements. Examples of such applications are wearables for sweat (moisture) sensing, heating bandages, and smart sportswear. Figure 4- Saral StretchCarbon 100 printed on TPU Saral StrecthDielectric 100: Solvent based stretchable insulating ink for protecting stretchable conductive layers. Saral StrecthDielectric 100 is fully compatible with all Saral Inks© therefore smoothly printable on top of and in combination with any of our silver- or carbon-based stretchable inks on paper, plastic, or textiles. After printing a transparent encapsulating layer is achieved that offers additional protection e.g. for electronic wearables. Recommended drying temperature is 120°C for 5 minutes. About Saralon Saralon GmbH is an industry leader in the development of functional and conductive inks and ready-to-use printed electronic boards for specific applications: Saral Inks©: A comprehensive range of individual conductive and functional inks that gives printed electronics developers the freedom to choose based on their desired functionality (e.g. stretchability, conductivity, adhesives, sensing, etc.) and end use. Saral Inks© sets: Specifically designed and developed sets of compatible inks for effortless integrated printing of high value, high demand electronic applications such as printable batteries, electroluminescent & electrochromic displays, etc. With Saral Inks© sets, Saralon eliminates the need for investing extra time and cost finding compatible inks for various circuit parts. InkTech: Know-how transfer including design files, printing guide and continuous professional support. Saral Electronics (Technology Platforms): Pre-printed functional boards produced by Saralon using Saral Inks©. With this portfolio of products and services, Saralon simplifies printed electronics, fuels innovation, and opens the doors to a sustainable future in the electronics industry. We are Exhibiting in Boston. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Visit our booth at this long-awaited TechBlick US event on 12-13 June 2024 in Boston. This is the most important industry and research meeting in our field in the US.

Download the slides

Wearable sensor patches offer novel opportunities for many healthcare and wellness applications. For optimal comfort and reliability, they should be flexible, soft, conformable, or even stretchable. Printed electronics and hybrid electronics enable the use of almost any substrate and packaging materials, making it the perfect technology for next-generation wearables. Author: Antti Kemppainen , VTT, Antti.Kemppainen@vtt.fi Pilot Factory The production of printed and hybrid electronics requires several manufacturing processes and tools which might not be available by commercial manufacturing partners. VTT’s Printocent Pilot Factory bridges the gap towards full upscaled manufacturing by extremely versatile infra, including for example following capabilities: Roll-to-roll printed electronics lines with: Interchangeable printing methods, high curing capacity and automated layer-to-layer registration. Printing and coating processes are available for thin films (<100 nm) up to thick films (tens of micrometers). Highly experienced team and facilities for ink tailoring, process development and quality control. Component assembly in a roll-to-roll format using: High throughput pick and place line for low-temperature soldering or adhesive bonding. Flip-chip high-precision and bare-die assembly line Extensive converting and post-processing capabilities including: A Versatile lamination and cutting converting line equipped with a cutting laser, robot arms, soldering and ultrasonic welding capabilities Injection molding machine with a roll feeder for overmolded electronics The roll-to-roll testing line for automated functionality testing and programming purposes. Dedicated pilot line for silicone material processing in reduced pressure. Additionally, for early screening and testing, there are laboratory-scale capabilities available for all key processes used in Pilot Factory. For verification purposes, characterization capabilities range from material testing, profilometry to 3D X-ray imaging. ECG Patch: Proof of Concept and Proof of Manufacturing At VTT, we have developed a smart patch proof-of-concept for a single-lead ECG (Electrocardiogram) wireless patch. This patch is printed and assembled onto a TPU (Thermoplastic Polyurethane) substrate. Elastic ECG patch printed and assembled directly onto TPU. Manufacturing processes have been developed and piloted in a versatile environment with highly scalable technologies. In the video below, part of the converting and post-processing at VTT Printocent pilot factory for the ECG patch is shown. The demonstrated technology offers a versatile manufacturing platform for the development of elastic wearable skin contact patches. Smart patch manufacturing video https://www.youtube.com/watch?v=z96NH3xBoGw We are speaking in Boston Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Join us at this long-awaited TechBlick US event on 12-13 June 2024 in Boston. This is the most important industry and research meeting in our field in the US. More sustainable future Printed electronics enable an unlimited selection of materials. For disposable smart patches reused, recycled, biobased or even biodegradable materials can be used. In a recent study, VTT has developed a new sustainable electrocardiogram patch that is fully recyclable and made of biomaterials. The device is modular, so electronic components can be easily removed from the disposable patch and used again. The patch itself is made of nanocellulose and printed with carbon conductors and sensing electrodes. The biodegradable patch is made of VTT’s new material cellulose e-skin, which replaces traditional plastic in wearable skin applications. Why to use VTT and Pilot Factory Printocent pilot factory and VTT’s experienced crew offer a fast path from proof of product concept feasibility to scalable continuous web manufacturing. Alternatively, we can address specific technical challenges or process bottlenecks, complementing our customers’ existing competences or capabilities. This facilitates quicker market entry and enhances the precision of manufacturing investments for the future. The insights gained from pilot developments can be effectively leveraged for technology transfer to third parties or for establishing in-house production, with our experts’ support. Read more about: VTT Printed Electronics PrintoCent Ecosystem We are Exhibiting in Boston. Let's RESHAPE the Future of Electronics together, making it Additive, Sustainable, Flexible, Hybrid,  Wearable, Structural, and 3D. Visit our booth at this long-awaited TechBlick US event on 12-13 June 2024 in Boston. This is the most important industry and research meeting in our field in the US.

Free seminar An Introduction to Printed Electronics & Thick Film Technology May 22nd & 23rd, 2024 With Dinner on Wednesday, May 22nd Join us to hear leading industry experts provide a comprehensive overview of Printed Electronics/Thick Film materials and processing during this TWO DAYS / TWO TRACKS IN PERSON seminar. The seminar is designed for professionals and engineers who are new to Printed Electronics & Thick Film Technology or would like to learn more about its art and science. The program also comprises talks from external speakers as well as a tour of our European Technology Center (ETC) for Engineering Polymers. In addition, we will display and discuss Printed Electronics/Thick Film applications. The event runs from 8:30 am to approximately 5 pm each day. Lunch, coffee and light snacks will be provided during the seminar. Please refer to the attached preliminary agenda Seminar Location Celanese Performance Solutions Switzerland Sàrl Route du Nant-d’Avril 146 1217 Meyrin, Switzerland Click HERE to register for the Seminar Recommended Hotel Mercure Geneva Airport (10 min walk to the Seminar location) 3B Rue de la Bergère, 1217 Meyrin, Geneva A contingent number of rooms are pre-reserved to ensure availability. Please book prior 15th April 2024 by sending an email to: mercure-geneva-airport@accor.com and refer to: “Celanese Group as of May 2024” Additional Hotels (not pre-reserved) Hotel NH Geneva Airport, Av. De Mategnin 21, 1217 Meyrin, Geneva Hotel NH Geneva Airport Hilton Geneva Hotel, Route Francois-Peyrot 34, 1218 Le Grand-Saconnex, Geneva Hilton Geneva Hotel and Conference Centre Micromax™ Electronic Inks and Pastes

UJIWARA REI | Panasonic Electronic Materials Business Division | fujiwara.rei@jp.panasonic.com High-frequency devices, such as those used in beyond 5G and 6G technologies, require precise and reliable signal transmission for optimal performance. High-frequency signals are more susceptible to noise interference, which can degrade the quality and integrity of the transmitted data. Noise mitigation is crucial to ensure that the intended signal is accurately received and interpreted. Traditionally, noise-absorbing materials have been used as an effective method of making noise. Noise absorbing materials are generally sheet or sponge type. However, these types are difficult to apply beyond5G/6G devices which become smaller and more complicated. We are speaking in Boston on 12-13 June 2024 at The Future of Electronics RESHAPED USA Register now and come to hear our talk To solve this problem, we propose a noise-absorbing paste. Dispensable material can be easily installed in narrow spaces, suppressing noise inside electronic devices used in beyond 5G/6G, and contributing to improved quality and performance. Features: Dispensable Good conformability High frequencies over 100GHz Figure 1 Paste Noise Absorber Table 1 Properties Figure 2 Absorption vs frequency Case 1: For solving cavity resonance. Figure 3 MMIC on antenna module. The radiation noise of MMIC resonating in the cavity affects the antenna characteristics. (Figure.3) Noise absorbing paste can be installed on small space, and attenuating cavity resonance. Case 2: For solving noise radiation from board patterns. Figure 4 Noise radiation from board patterns Noise radiation from board patterns contaminates the antenna circuit and affects antenna characteristics. Noise-absorbing paste, which has insulation properties, can be installed on the circuit to solve noise radiation. Author:  OHARA TAKASHI | Panasonic Electronic Materials Business Division | ohara.tk@jp.panasonic.com We are Exhibiting in Boston on 12-13 June 2024 at The Future of Electronics RESHAPED USA Register now and visit our booth

Authors: Daan de Kubber, Jurgen Westerhoff, Ben Robesin SPGPrints b.v., Raamstraat 1-3, 5831 AT, Boxmeer, the Netherlands Printed electronics have gained significant attention for their potential to revolutionize various industries through cost-effective and scalable manufacturing processes. However, a critical challenge within this domain lies in the transition from lab-scale and pilot equipment to industrial-scale production. We want to shed light on the implications of this transition, emphasizing its impact on cost reduction, repeatability, and time to market. The initial stages of printed electronics development predominantly occur on lab and pilot equipment, where researchers and innovators prototype new applications. As these applications progress towards commercialization, the shift to industrial-scale equipment becomes inevitable. Rotary screen printing emerges as a prominent technique, providing high-throughput capabilities essential for large-scale production. We are Speaking at the Free-To-Attend On-Line Innovations Festival on 25 April 2024. Register to hear our talk, and meet us during the virtual networking. We have looked critically at this transition. Investments in Industrial-scale equipment, though substantial, ultimately leads to significant cost reductions in large-scale production. This is essential if manufacturers want to achieve sustainable, cost-effective printed electronics. Moreover, the transition to industrial-scale equipment like Rotary Screen Printing enhances repeatability and quality control. Lab-scale equipment often lacks the precision, required consistency and capacity for mass production. In contrast, industrial-scale tools offer robust control mechanisms, ensuring consistent output across large volumes. This shift results in higher product quality consistency, reducing defects and improving overall yield rates. A great example of a printed electronics application that is moving into high-volume industrialized scale are the printed e-paper displays by our partner Ynvisible. Their products are used on smart labels, IoT devices, retail signage and many more markets. Ynvisible even shares their know-how in scaling up printed electronics with other companies in the flexible solar and printable battery space. Printed ultra-low-power display for use in retail If we take the e-paper example and run it through our cost-per-print calculator you see that for a yearly production of 3.5 million e-paper displays the Rotary Screen Printing solution starts to become more profitable within 3 years of production. This shows that you need relatively high volumes to justify the investment in a full SPGPrints Rotary screen printing line, but it will pay off and will ensure steady profitable business in the long run. Of course SPGPrints also offers screen printing units that can be integrated into an existing or custom built line, changing the business case significantly. Next to owning the equipment SPGPrints (and our network of print service providers) offers Production-as-a-Service including application development consultancy. This is a calculation showing the cost per printed unit comparison between typical flat-bed screen printing and a full SPGPrints rotary screen printing line. It is imperative to acknowledge that transitioning equipment mid-development cycle extends the time to market. This delay arises from the need to recalibrate processes, optimize formulations, and adapt to the unique characteristics of industrial-scale equipment. This delay represents a critical trade-off, where time saved in large-scale production is weighed against the extended development phase. In conclusion, the transition from lab-scale and pilot equipment to industrial-scale production, like Rotary Screen Printing, plays a pivotal role in advancing printed electronics. While the cost reductions and enhanced repeatability are substantial benefits, it is important to recognize the inherent time-to-market trade-off associated with this transition. In this paper we will show some examples of how choosing for industrial-scale equipment at an early stage in development, saves time and money in the long run. Additionally, we will provide a calculation method to evaluate the most suitable production equipment for a specific application. Read more about our offerings online: SPGPrints | Applications | Printed Electronics We are exhibiting in Boston at the Future of Electronics RESHAPED on 12-13 June 2024. Register now and visit our booth.

Authors: Mike Simmons, Matthew Kleyn, Joseph Vlach, Liz Josephson; Intellivation LLC ljosephson@intellivation.com | Intellivation The demand for high-performance devices with enhanced functionalities continues to grow. Materials, such as graphene and MoS2, exhibit unique electrical and mechanical properties making them ideal for flexible electronic applications. To meet the rising demand and requirements for flexible 2D microelectronics devices manufactured using Roll to Roll technology, we use innovative manufacturing techniques including vacuum coatings in combination with laser technology. Laser patterning of sputtered coatings provides the ability to achieve high-volume production with precision, functionality and efficiency for a wide range of flexible applications. Sputter deposition is a widely used technique for depositing thin films onto substrates. For flexible 2D microelectronics, sputtered coatings serve as the foundation for building functional devices. Sputtering involves bombarding a target material with ions to eject atoms or molecules, which then deposit onto a substrate to form a thin film. This process allows for precise control over the thickness and composition of the deposited film, making it a preferred method for creating uniform and reproducible coatings. Sputtered layers were deposited using Intellivation’s R2R Lab system. Sputtering provides an excellent method for depositing coatings uniformly over large areas, while laser patterning can create discrete devices, circuits, and other types of discontinuous features required for manufacturing. Using these two techniques in combination provides unique capabilities, particular during product development. Photolithography requires multiple steps and is time consuming, it also requires geometric commitment of features at early stage of design. Laser patterning offers a direct and efficient way to create and define patterns on sputtered coatings including changes in geometry while providing consistent feature size and edge quality. Laser patterning uses a laser beam to selectively remove or modify specific areas of deposited films enabling the generation of intricate patterns with submicron-level precision. Control and precision of the laser is critical and the non-contact nature of laser patterning reduces the risk of contamination and damage to the underlying substrate, ideal for delicate 2D materials. This technique provides the ability to develop and then validate a design and process in small volumes and then easily transfer to large area roll-to-roll production without changes to the laser processing equipment. Deposition of the conductive material onto the substrate was done with Intellivation’s R2R thin film vacuum deposition Lab coater , it is then laser patterned or the laser is used to isolate regions to crystallize them for interfacing with subsequent layers. Once the substrate, layer stacks and laser variables are optimized, the next phase is to scale these devices to large area R2R processing. The combination of laser patterning and sputtered coatings has unlocked new possibilities in the high-volume production of flexible 2D microelectronics. This innovative approach addresses the demand for devices with enhanced performance, precision, and scalability. A roll-to-roll approach offers several significant advantages in terms of efficiency, cost and adaptability.

How to extend the pot life of silicone to several months without changing its material properties? Ulrich Trog [Ulrich.Trog@joanneum.at | JOANNEUM RESEARCH] explains in this article how this is possible JOANNEUM RESEARCH offers the formulation of the appropriate compound based on feasibility studies of the silicones used by its customers. Licences for the Supresil™ technology are available. Platinum (Pt)-cured silicones are gaining in popularity, emphasising addition curing over traditional peroxide methods. This process ensures purity and efficacy, resulting in products with increased strength and superior aesthetics. The rise of Pt-curing marks a significant shift in silicone manufacturing techniques, promising unmatched quality and durability in a variety of applications. When crosslinking is initiated, the curing process starts almost immediately and the resulting silicone typically has a pot life limited to a maximum of a few hours at room temperature. This places significant practical and technological limitations on its use: short processing time manufacturing waste difficult reproducibility inflexible manufacturing process Our patented formulation greatly increases pot life via reversible inhibition of the crosslinking via hydrosilylation. After deposition, the inhibitors evaporate easily. Normal crosslinking occurs at mild temperatures, even below 80 °C, leading to a fast and complete curing. Join the Future of Electronics RESHAPED event in Boston on 12 & 13 June 2024. Learn more https://www.techblick.com/electronicsreshapedusa Benefits reduces production costs: the pot life of silicone mixtures can be extended to several months and beyond enables (3D) printing: shelf stable, 1-component silicone inks can be formulated for use with a variety of printing processes like dispensing, screen-printing, aerosoljet-printing, inkjet printing and others no change in material properties: through the complete and trace-free removal of the inhibitor during the curing process there is no change in the material or its properties applicable to liquid Silicone rubber (LSR) and high consistency rubber (HCR) suitable for all Pt-cure resins: no curing at processing temperature and normal curing at curing temperature, orthogonal with other inhibitors environmental: reduction in waste generation in production process Application examples LED production: Supresil™ resins reduce the processing efforts and increase the yield of colour conversion materials without changing their optical properties. The Supresil™ inhibited silicones can be mixed with colour conversion phosphors in large batches, increasing the accuracy and consistency of the colour conversion composites through improved wetting and distribution of the dispensed material and a better dispersion of the phosphors. 3D printing: Standard LSR formulations are optimised for extrusion and injection moulding machines and are not suitable for 3D printing. By adjusting the rheological behaviour and extending the pot life using JOANNEUM RESEARCH‘s proprietary reversible curing inhibition, 3D printing is now possible. All material properties of the silicones are preserved (through complete and trace-free removal of the inhibitor): physical: shrinkage, Shore hardness, storage modulus optical: UV/VIS transmission, no „yellowing“, refractive index biocompatibility: relevant for medical grade resins / formulations unaltered production: viscosity, reproducibility Fig. 1: Comparison of curing dynamics of standard silicone resins with SupresilTM inhibited resins We are Exhibiting in Berlin! Come and visit our booth Fig. 2: UV/VIS Transmission of cast silicones (100 µm) for the LED production JOANNEUM RESEARCH is a publicly owned, Austrian Research and Technology Organisation. It is successful nationally and internationally in the fields of “Information and Production Technologies”, “Human Technologies and Medicine” and “Society and Sustainability” AUTHOR: Ulrich Trog [Ulrich.Trog@joanneum.at |JOANNEUM RESEARCH] All images: © JOANNEUM RESEARCH TechBlick.com