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Our research group at Yamagata University in Japan is actively developing flexible and printed organic electronics, covering all related technologies from materials and devices to fabrication processes and applications. Our focus is on wireless applications for healthcare, robotics, and logistics. We have recently developed highly sensitive and reliable pressure, strain, and humidity sensors using composite materials of carbon and polymeric materials with simple printing methods. The pressure sensor exhibited a high resistivity change with a sensitivity of 0.014kPa-1 when pressure was applied. The stretchable strain sensors demonstrated high sensitivity with a gauge factor of approximately 14 and could stretch up to 100% with small hysteresis. The developed humidity sensors exhibited a high resistive response of 120% over the relative humidity (RH) range of 30% to 90% through an absorption and desorption mechanism, with fast response and recovery times. We have used these sensors to demonstrate human pulse wave and respiration detection, as well as tactile sensing for robot grippers. In addition, we have established flexible hybrid electronics (FHE) with screen printing methods and combined these sensors with the FHE technology to realize more practical applications for the Internet of Things (IoT) society. SAVE THE DATE

Flexible printed circuit boards (FPCs) have found uses in a wide variety of applications, including health/wellness, mobile devices, aerospace and many more. Conventional FPCs consist of copper patterns formed on the surface of a flexible film using standard printed circuit board fabrication processes. Historically, polyimide resin (PI) has been widely used because it is readily available and possesses heat-resistant property which make it compatible with high volume assembly processes like solder reflow. However, new applications and device designs like wearables are driving the development of more conformable circuits. Stiff, high-modulus films such as polyimide are not suitable for these products and currently available pliable, low modulus films like thermoplastic polyurethane (TPU) are not compatible with surface mount assembly processes. Researchers at Panasonic Electronic Materials are developing a new material technology that overcomes the limitations of conventional FPCs. In this presentation, we will introduce our novel ultra-pliable circuit board material development. SAVE THE DATE

Thibaut Soulestin, PhD ; Lead Application Engineer at Henkel Printed Electronics; thibaut.soulestin@henkel.com Henkel Adhesive Technologies has developed a large material portfolio of conductive inks and coatings suitable for printed electronics technology. Our portfolio offers material solutions ideal for various smart surface technologies, including self-regulating foil heaters. Self- regulating foil heaters are enabled by Henkel’s Positive Temperature Coefficient (PTC) inks in combination with silver and dielectric inks. Understanding the origin of the PTC effect, typical characterizations, and basic design rules enable our customers to reveal the full potential of this technology. 1. Introduction to Henkel Positive Temperature Coefficient (PTC) carbon inks Different types of conductive polymer composites (CPC) exhibit positive temperature coefficient (PTC) properties. They have been extensively studied and some are commercially available. A vast majority is obtained by compounding a polymer binder with conductive fillers, mostly carbon-based. The increase in resistance of the conductive networks during heating is caused by the thermal expansion of the polymer and the change in the distance between the conductive fillers. The PTC effect usually occurs during the phase transition of the polymer matrix, the glass transition, or the melting. After the maximum PTC effect, if the temperature keeps rising, a negative temperature coefficient (NTC) effect can be observed due to the re-aggregation of the conductive particles. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped Contact thibaut.soulestin@henkel.com for your discounted passes Henkel carbon PTC inks are like other screen-printable carbon inks and are based on three main components: (I) carbon particles for the electrical conductivity, (ii) a polymer binder for the mechanical properties and adhesion to the substrate, and (iii) a solvent. The dry ink layer is then obtained after drying and solvent evaporation. Henkel developed a specific and patented technology using micronized wax particles to introduce the PTC effect. A fine wax powder is added as a fourth main component to the ink. The resistance will increase exponentially near the wax melting point, resulting in a high PTC ratio and a well-controlled self-regulation temperature. By finely controlling the melting point and the size of the wax particles, and thus the particles’ volume expansion, the PTC effect can be finely tuned to match customer requirements. Figure 1. Schematic graph representing the exponential increase of resistance of Henkel positive temperature coefficient (PTC) ink. At a defined temperature, the micronized wax particles (spherical white), nicely dispersed between the carbon particles (black ovals), increase in volume, pulling apart the conductive carbon particles, leading to the resistance increase. Table 1 overviews the commercially available and under-development Henkel PTC ink range. Low voltage inks are formulated to self-regulate at voltages below 50 V. High voltage inks, identified by HV in the name, can be used for voltages above 50 V. Low and high voltage inks differ mostly by their sheet resistance. A non-conductive ink, NCI, is also available for each self- regulation temperature, allowing the printer to adjust the sheet resistance. Table 1. Henkel PTC ink range. 2. Typical Example of 9V, 60 °C, self-regulating demo heater 2.1 Layout Figure 2 shows the exploded view for a typical PTC heater. The polyester substrate is an industry standard. A first layer of highly conductive silver ink tracks is printed, typically with LOCTITE ECI 1010. Two main areas can be identified: the busbars and the fingers. On the sides, the busbars carry the current and must be designed according to the maximum current peak to avoid local heating. The finer silver fingers give the interdigit structure and allow having all PTC elements in parallel. Then, the PTC ink, from LOCTITE ECI 8000 series is printed on top of the silver tracks as numerous independent elements. On top of the conductive inks, an insulating layer is mandatory. This layer can either be a printable dielectric or a laminated foil. As PTC inks are living materials with a variable resistance, the influence of the insulating layer should be closely monitored. It should not deteriorate the ink properties, such as PTC ratio and long-term reliability. Figure 2. Exploded view of 9 V demo heater showcasing the four main components. For this 9 V self-regulating demo heater, substrate is PET 125 µm, silver ink is LOCTITE ECI 1010, PTC ink is LOCTITE ECI 8001 with self- regulation in the 55-60 °C range, and translucent dielectric UV-curing ink is LOCTITE EDAG PF-455BC. 2.2 Typical Voltage Sweep Characterization Voltage sweep curves are characteristic of one self-regulation in a specific condition. Taping a heater on different surfaces, like a metallic plate or a foam, will give different results. For characterization purposes, it is interesting to characterize the heater on an insulating foam to expose potential limitations like hotspots or printing inhomogeneities. Figure 3 shows the resistance and average surface temperature change with increasing applied voltage. Three typical zones of a self-regulating PTC heater are nicely exemplified. Zone I, Heating-Up. Temperature increases with the increasing voltage thanks to the Joule effect until reaching the onset of self-regulation. Zone II, Self-regulation. With the increasing voltage, resistance increases thanks to the volume expansion of the wax particles. Zone III, Overruled PTC effect. The voltage is too high. The resistance cannot increase anymore. Temperature rises above the self-regulation, reaching the melting point of the wax. Melting of the wax brings the carbon particles closer and the resistance drop. Runaway may occur. Applying 5, 8, or 10 V to the heater will give the same self-regulation temperature based on this voltage sweep. This is due to the sharp PTC effect around 60 °C. The higher the PTC ratio, the larger the self-regulation plateau. High PTC ratio of Henkel inks enables rapid heating than to high initial power. Figure 3. Typical characterization curve of a self-regulating PTC heater. Temperature (grey curve) and resistance (red curve) are measured as a function of increasing voltage. 3. Heater Initial Guidelines 3.1 Requirement Definition To start your self-regulating PTC heater project, you must have some crucial primary information: The driving voltage that will power your heater. It will be closely related to the spacing between two silver fingers and the resistance of one PTC unit. The higher the voltage, the higher should be the resistance of the PTC unit. It is possible either by increasing the distance between the silver fingers or increasing the sheet resistance of the PTC ink. The initial heating power. To heat an object, you need a heat source with a higher temperature than the object and sufficient power to heat this object. If you have a low power hot heater, then the object will heat-up very slowly. Conversely, you may overrule the PTC effect if your heater is too powerful. Knowing the driving voltage and the initial heating power will allow the calculation of the resistance of the heater, 𝑅 = 𝑈2⁄𝑃. Voltage and resistance define the initial in-rush current 𝐼 = 𝑈⁄𝑅. Silver busbars must be designed according to the in-rush current. The self-regulation temperature to choose the adapted PTC ink. The heater dimension or available area. It will also be important to identify the heater integration and heat diffusion behavior early in the project as it strongly impacts the heater design and layout. 3.2 Basic Design Rules and Calculations 4 Accelerating Customer On-Boarding Developing self-regulating heaters requires a large range of expertise such as material, printing, circuit design, heat transfer, and integration. Following a methodology based on years of feedback enables a progressive learning curve and the identification of key parameters. Figure 4 gives an overview of this methodology. If specific expertise is needed, Henkel team can bring external partners to the table for the success of customer projects. Figure 4. Overview of Henkel PTC ink on-boarding methodology Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped Contact thibaut.soulestin@henkel.com for your discounted passes

By Thomas Kolbusch, Director of Sales, Marketing, and Technology, VP 1. Abstract The Roll-to-Roll (R2R) processing methodology, pivotal in the fabrication of printed electronics, particularly 3rd Gen photovoltaics (OPVs), offers significant advantages. Yet, inherent technical challenges pose constraints in achieving optimal device performance. This article delves into the mechanics, advantages, and impediments associated with the R2R method as applied to OPVs. 2. R2R Process: Operational Mechanics and Implications 2.1. Mechanism At its core, R2R involves unreeling a flexible substrate from a source, subjecting it to various fabrication processes, and subsequently reeling the treated substrate. These processes can encompass material deposition, lithographic patterning, and post-fabrication treatments. 2.2. Benefits High Throughput: Continuous production translates to faster manufacturing cycles. Economic Viability: Economies of scale achieved reduce per-unit costs. Versatility: It enables the creation of lightweight, flexible electronic devices. 3. Inherent Technical Challenges in R2R Processing for OPVs 3.1. Ensuring Quality Homogeneity Attaining uniformity in deposition across vast substrate lengths poses a formidable challenge. Factors like deposition rate, substrate tension, and ambient temperature can influence the end product's quality. 3.2. Addressing Material Limitations For OPVs, the choice of materials is critical. Many organic materials used in these cells are sensitive to environmental factors like humidity and temperature. The R2R process, being continuous, requires that these materials remain stable over extended periods, a challenge that is currently under intensive research 3.3. Guaranteeing Consistent Device Performance Securing uniform device efficiency across an extended substrate requires rigorous quality control. Discrepancies in layer composition or thickness can culminate in efficiency variations, detracting from the overall process yield. 4. An Analysis of Two Decades of OPV Advancements Over the preceding 20 years, significant strides have been made in OPV technology: Material Evolution: Introduction of novel organic compounds to enhance light absorption and electron mobility. Architectural Refinements: Tandem structures, where multiple OPV layers are stacked, have emerged to enhance the cell's absorption spectrum Optimization of R2R Processes: Advancements in substrate control, improved coating and printing techniques, and swifter post-deposition treatments have been established. Despite these advancements, the conversion efficiency of R2R-produced OPVs remains an area of ongoing research when compared to other photovoltaic technologies. 5. Summary The potential of the R2R process in reshaping printed electronics production is clear. However, its broader adoption, especially for OPVs, demands a precise understanding of its challenges and a continuous drive for research and innovation. The advancements over the past 20 years underline the ongoing effort in this field and the need for further refinement to fully exploit R2R's benefits in OPV manufacturing. Coatema is working on all of these topics with cooperation partners in R&D and industry and with the Horizon Europe project Flex2Energy will establish a production line for OPV in Greece with integrated module assembly. This will be a boost to the European efforts to be more independent from imports from China. The growth rate of the global OPV market

Roartis, a Belgian, privately owned company, develops and manufactures adhesives, coatings, resins and sintering materials for electronic applications. Since 2008, their focus has been on high reliability markets and applications, in the field of medical, semiconductor, automotive, defense, aerospace, heady-industries, etc. Based on a business model of customized solutions, technical support and excellence in quality, the company has been steadily growing over the past years with its broad portfolio of over 400 commercial products for various electronic applications. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped The portfolio includes electrically conductive adhesives, micro-encapsulants, high power sintering pastes, thermally conductive materials, UV-curable adhesives, etc. Roartis’ portfolio is marketed under the brands IQ-BOND®, IQ-CAST® and IQ-SINTER®. Recently, a new line of functional inks has been introduced, targeting applications for printing circuitry on flexible substrates including PET, PEN, PC, PVC, TPU, etc. The new range of products, branded IQ-INQ® will be launched during the upcoming Techblick event in Berlin, Germany and covers apart from Ag-based inks also other metal options, as well as dielectric materials. Where over the past years, many suppliers have emerged for traditional 2D compatible conductive inks compatible with screen, inkjet, gravure or slot die printing, a newer technology in this emerging market is the field of 3D-shaped electronics, and more specifically In-Mold-Electronics (IME). IME is the process of developing and producing embedded circuitry in 3D shaped electronics by means of thermoforming and/or molding processes. This new emerging market of IME and 3D-shaped electronics requires inks, specifically develop to address the technical challenges of this market. Technical challenges to be addressed by IME-compatible conductive inks include high elongation, thermoformability, adhesion, fine line printability and high conductivity. These properties should enable to print electronic circuitry on a 2D substrate prior to converting it into a functional 3D electronics circuit. Figure 1: IQ-INQ® 1002 screen printed on flat substrate, followed by thermoforming Together with leading research institutes, active in the design and evaluation of printed and in-moldelectronics, Roartis optimized its electrically conductive ink IQ-INQ® 1002, specifically targeting bestin-class thermoformability, combined with good conductivity and fine line printability. IQ-INQ® 1002 was evaluated in comparison to 5 leading competitive “thermoformable” conductive inks, with regards performance of electrical resistivity versus elongation, printability, and adhesion. On various substrates, including PVC, PC, PET, PA, TPU it was shown to provide low resistivity with highest elongation (> 50%) and excellent adhesion. Conductive tracks of 60 µm, with equally 60 µm were successfully printed, resulting in intensely thermoformed 3D shapes, with good electrical functionality. The selected chemistry is suitable for screen printing on most high speed industrial screen printing equipment, and will cure at temperatures as low as 80°C. For further information, please contact info@roartis.com, or contact us via our website www.roartis.com. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped

Carolyn Ellinger, Chris O’Connor, Chris Liston, Emily Rej, Tom LeBlanc Eastman Kodak Company Kodak has a long history of manufacturing quality film products – starting with silver halide imaging films for consumers, including the iconic KODACHROME. Kodak is continuing to build on that history, manufacturing a variety of industrial film products for strategic business partners in many industries – from automotive to battery to healthcare. Built on expertise in coating, printing, and image quality, printed electronics products and contract manufacturing services offer customers modern functionality rooted in decades of manufacturing excellence. Flexible heaters were first developed in the late 1800s, around the same time as Kodak was starting to manufacture film products While these first flexible heaters were textile based, they operate on the same resistive heating principles as today’s flexible film heaters. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact us for your discounted passes With new technologies come new challenges and limitations, and “hidden” heaters are being deployed to improve the functionality of a broad range of electronic systems. Temperature-limited electronic devices, such as LCDs, require heating to be able to operate in cold environments. Outdoor sensors require that ice and snow be removed from their front surface to ensure their operation. Each of these applications (many many more) require transparency and heating. However, while each application nominally requires “heat” and “transparency” – the requirements and form-factors of these transparent heaters vary across applications, and from device to device. Kodak’s manufacturing process for fabricating highly transparent patterned heating films delivers designs optimized for individual customers, various integration paths, and a myriad of end-devices. The copper micro-wire designs are manufactured with 2-μm imaging resolution, enabling ultimate freedom in macroscale and microscale optimization. The fully additive, roll-to-roll printed electronics manufacturing process produces copper micro-wires by printing a catalytic ink in the desired pattern, and then electrolessly plating copper to the specified height allowing for independent control of transparency and sheet resistance. As described in this white paper, Kodak works with customers to determine the optimum heater design. Figure 1a illustrates a simple approach in designing for a desired power density at a given system voltage. Figure 1b illustrates just a few of the many possible designs for uniform transparent heating. Figure 1a. Example of heater designs for system optimization. Each heater has the same heated area, same transparency, but have been tuned to a different resistance (R) to achieve the required power density (PD) and the supply voltage of a given application. Figure 1b. Example heater patterns. How do resistive heaters work? Resistive heaters function by Joule heating, also known as Ohmic heating, where the flow of electric current through a conductor produces heat. All conductive materials exhibit this resistive heating phenomenon, with the heating response varying based on the specific properties of each material. Resistance is defined as the resistance to the flow of current at a given voltage bias, or R = V/I. Heater power is a function of the amount of current that is driven through an element of a given resistance: P = I2R = V2/R. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 - www.techblick.com/electronicsreshaped. Contact us for your discounted passes Therefore, a heater with a higher resistance will require less current to generate the same power. Conversely, a conductive trace with low resistance will have lesser heating when current is applied than a higher resistance trace. In typical operation, heaters are driven by a constant voltage power supply, and a heater with a lower resistance will consume more power and heat to a higher temperature. The resistance of any heater is a combination of the pattern of the resistive element and the electrical properties of the material used. The resistance of conductors of a given thickness can be expressed as sheet resistance (Rs) in Ohm/square, so the end-to-end (terminal) resistance of any conductive pattern is Rs*L/W where L/W is the number of squares. Consequently, at a given operating voltage, the power per unit area or power density (PD) is proportional to 1/R, and 1/Rs for square heater element as shown in Figure 2. Figure 2. Power density of a square heater at various voltage levels as a function of sheet resistance. What Sets the Kodak Technology Apart? Kodak’s cleanroom manufacturing leverages Kodak’s long history of innovation in material science, image science, printing, deposition, and roll-to-roll manufacturing to produce patterned micro-wire films with the unprecedented combination of high transparency, neutral color, low reflectance, and low sheet resistance. Cleanroom manufacturing minimizes electrical yield losses and ensures that parts will be free of transparency-reducing particulate going into final integration. The fully additive, roll-to-roll process features ~2 µm imaging resolution to produce fine copper micro-wires as narrow as 5 µm in width, by first printing a patented catalytic ink and then electrolessly plating copper to the desired height. The process enables the ability to independently tune sheet resistance and transparency, the ability to manufacture films with highly conductive traces leading to more resistive heating elements, and the ability to form multiple devices or electrical elements on a single substrate in a single roll to roll manufacturing flow – on one or both sides of the substrate. The design tools of the Kodak process enable functional heater designs without sacrificing transparency through a combination of mesh design (line dimensions, gaps, curves and angles), copper thickness, and the resistive path of the heater. Not only can the Kodak process support freeform design--only limited by imagination--other supporting elements such as traces, bond pads and even non-conductive or graphic can be additively included. Transparent mesh designs are readily obtainable with visible light transmission (VLT)>85% with Rs from 1 to 5 Ohm/square, as illustrated in Figure 3. Figure 3. Kodak copper micro-wire mesh performance for a variety of mesh patterns represented the ratio of pitch to linewidth (LW) and copper thicknesses. The design freedom that comes from patterning via printing enables not only the pattern selection optimized for transparency, but also optimization of the overall design of the heater for a given system. For example, if the application has a square area that requires uniform heating a possible heater design would be a single square patch of resistive heater, but in this case the power density achievable would be limited by both the sheet resistance of the heater and the operating voltage available in the system. Typically, an application will have specified power, temperature and voltage requirements and a heater must be designed to operate at those conditions. Figure 4 illustrates how heaters may be designed using the mesh designs of Figure 3, with a reference shown at 100 W/m2 and the design choices depending on the supply voltage. For example, if a 3V power supply is chosen then a three-leg heater design is preferred, but if a 12V power supply is chosen, then a 3-leg heater would not be suitable and a 7-leg heater is preferred. Figure 4. Illustration of heater designs to obtain a desired power density versus supply voltage. Ready-to-Integrate Transparent Heaters Kodak is seeking strategic integration partners for transparent conductive heaters. Products and devices from this manufacturing line include all benefits discussed above, and ready-to-integrate films can be supplied for evaluation. Contact Information For more information on Kodak’s micro-wire technology and enabling manufacturing process, please contact: sales.printedelectronics@kodak.com. Join us at TechBlick's Future of Electronics RESHAPED conference & tradeshow in Berlin on 17-18 OCT 2023 at www.TechBlick.com/ElectronicsReshaped. Contact us for your discounted passes

In this illuminating presentation, Michael Petersen will walk us through the transformative path of medication adherence advanced by smart packaging technology. Focusing on remarkable innovations like Information Mediary Corp's Med-ic smart blisters and CertiScan solutions, Petersen will provide a comprehensive insight into how these pioneering tools have decoded complex adherence puzzles and driven industry momentum, albeit slowly. By tracing the arc from traditional to smart adherence packaging, Petersen aims to showcase the remarkable potential of digitization in healthcare while acknowledging the challenges and the gradual pace of progress. Attendees will come away with a deeper understanding of the power of smart adherence packaging to reduce clinical uncertainties and improve patient outcomes, despite persistent industry inertia. This discourse forms an integral part of the larger dialogue about the transformation of healthcare through technology at the TechBlick event in Berlin SAVE THE DATE

Speaker: Alan Wu Company: Smooth & Sharp The RFID business continues to grow. The global RFID market is anticipated to continue to grow in 2023, according to several market researches, it projects a market value of US$14~15 billion in 2023. Retail apparel continues to dominate the UHF industry in terms of tag number and market size. The 2023 forecasts nearly 23~24 billion UHF RFID labels will be used in retail apparel tagging. In the latest study series into the UHF RFID market, predicate UHF RFID label shipment will rise to 80~90 billion by 2028, with a 25 percent compound annual growth between now and 2026. All these billions of UHF RFID label are designed for single-use, they will be discarded right after customer bring them home. Almost all these ten billions of RFID labels are made with etched antenna on plastic, a lot of pollution during chemical etching process and leave waste plastic after use. In this presentation, S&S will unveil the first and only ISO certified Biodegradable RFID antenna by using Additive Manufacturing SAVE THE DATE

Karl-Heinz Fritz Company: Cicor Aerosol jet technology offers capabilities in printing sensors in 2D and 3D, as well as a way to connect off the shelf components in a very efficient and space saving way. This presentation will give an overview about different ways to make best use of the capabilities SAVE THE DATE

Speaker: Sven Hujo Company: Delo Flexible electronics have the great potential to reshape the upcoming decade from automotive interior design to smart textiles. In this presentation the potential of new functional polymers will be highlighted, which are on the one hand side capable to ensure flexibility and on the other hand side long term reliability. The property profile of functional polymers or adhesives is able cover a wide range of bonding and coating applications in flexible electronics. To ensure both electrical and mechanical connection of SMDs on flexible substrates it is possible to dispense non-conductive (NCA) and isotropic conductive adhesives (ICA) together to combine their benefits. For this reason, adhesive solutions are important for the introduction of new flexible electronic devices and applications to the market. SAVE THE DATE

Speaker: Teemu Alajoki Organization: VTT SAVE THE DATE

With ambient IoT standards emerging from IEEE and 3GPP and adoption of Bluetooth based ambient IoT rapidly scaling from hundreds of millions to billions, it’s important to understand this new segment of the Internet of Things. The original vision of a pervasive IoT was limited by low cost tags that required expensive infrastructure (RFID), or high cost tags with low cost infrastructure (cellular and LP WAN). Ambient IoT is on a trajectory to scale to trillions of connected things by having low-cost tags and low or even no cost infrastructure. In this talk we review the emerging standards, architecture, and applications for ambient IoT. SAVE THE DATE