The Future of Electronics RESHAPED USA  conference and exhibition ( 10 & 11 JUNE 2026, Mountain View ) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum , this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks  from around the world, 8 industry- or expert-led masterclasses , 2 tours , and over 75 onsite exhibitors . In this article, we discuss and highlight various innovative talks at the event around the theme of Additive Electronics in Packaging and PCB Manufacturing . In other articles we cover themes like materials innovation, hybrid electronic manufacturing and scale-up, wearables and sensors, soft robotics, additive and 3D electronics, sustainable electronics, and more. Explore the   full agenda  now and join the global industry in Mountain View on 10 & 11 JUNE 2026 . Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire GE Aerospace Research – David Lin  discusses 3D MEMS IMU enabled by additive packaging . In this session, David explores how traditional 3D assembly is highly susceptible to long-term drift driven by package-induced stress. By utilizing an additively...

21 & 22 OCT 2026 | Berlin Co-located with the  Electronics RESHAPED  conference and exhibition  Winter early bird rates expire end of this week (3 April 2026) Preliminary list of confirmed speakers Perovskite Connect 2026 is the most important conference and tradeshow dedicated to all aspects of the perovskite industry, bringing together the entire community from around the world in Berlin on 21 and 22 OCT 2026.

Explore and Book This Week When Winter Early Birds Expire (3 April)
Preliminary speaker list includes Oxford PV, Microquanta, Qcells, Caelux, Kunshan GCL Optoelectronic Material Co.,Ltd, Hust/WonderSolar, CubicPV,  Energy Material Corp, Power Roll, Bergfeld Lasertech, Homerun Energy, HB Fuller, imec, Helmholtz-Zentrum Berlin, Nano-C, Inc., PINA CREATION, Solar and Renewable Industry Leader, Tandem PV, Kalpana, Zentrum für Sonnenenergie-und Wasserstoff-Forschung Baden-Württemberg ZSW, Eternal Sun, Everlight, Nanyang Technological University, Unijet, etc. Learn more here
Winter early bird rates expire end of this week (3 April 2026) Explore and Book This Week When Winter Early Birds Expire (3 April) The 2026 edition is building on the great success of Perovskite Connect 2025 which was a sell-out event with packed conference tracks and buzzing exhibition stands. This event is already established as the most important event of the year dedicated to perovskite technology.  The Perovskite Connect exhibition area is part of the  Eectronics RESHAPED  show in Berlin. T...

In this newsletter you will find short highlights given at various editions of TechBlick's Future of Electronics RESHAPED conference and exhibitions. In particular you can learn about the following: Join us in Mountain View, Silicon Valley, in June at the latest edition of the Future of Electronics RESHARED event. This is the most important event of the year dedicated to Additive, Printed, Hybrid and Sustainable Electronic. Explore Agenda here https://www.techblick.com/electronicsreshapedusa Frederic Güth | Fraunhofer ENAS: How does the substitution of the structural unit in Parylene polymers affect their properties and application-specific fine-tuning? Ryojiro Tominaga | Fuji Corporation: How does the low-temperature sintering process impact the choice of conductive inks and substrate materials? Ryan Banfield | Heraeus Electronics: Why is a solderable polymer necessary when high-temperature fired materials have been available for decades? Paul Gaylo | Lockheed Martin: How does the miniaturization of electronic warfare systems impact mission capabilities? Alejandro Covalin | Spark Biomedical: How can 3D printing and printed electronics overcome the limitations of traditional manufacturing in wearable devices? Eric Wolf | Essemtec: How does Essemtec manage the complexities of dispensing non-Newtonian fluids with varying rheological properties? Allan Neville | Human Systems Integration, Inc.: How does the manufacturing process for integrating electronics into garments differ fr...

Mention droplet dispensing and you may immediately think of lab-on-a-chip (LoC) devices. Indeed, LoC devices rely on droplet dispensing systems or pipettes to distribute liquids for disease diagnostics. However, the application of droplet dispensing extends beyond life sciences. It finds various applications in consumer electronics (home inkjet printers), optics (lens arrays for fiber optics), life sciences (LoC systems, medical inhalers) as well as electronics manufacturing (dispensing solder droplets for flip chip bonding — attaching semiconductor chips to a substrate by flipping them onto tiny solder bumps) [1]. How does droplet dispensing work? Dispensing droplets manually involves using a syringe or micropipette to release individual droplets, and is common in laboratories for liquid handling. Micropipettes are engineered to deliver highly reproducible volumes and can reduce human variability, but achieving this precision requires proper technique and therefore subject to inter‑individual imprecision [2]. Automated droplet dispensing systems, in contrast, offer superior reliability by accurately jetting (drop-on-demand jetting systems ) or extruding ( direct ink writing  systems) single discrete volumes of materials from a nozzle to a precise location. The target volume of each drop can range widely, from picoliters in microelectronics to microliters in lab applications. Achieving consistent volume is crucial in droplet dispensing for accuracy and reproducibility [3]. Dr...

Andrew Stemmermann & John Yundt SunRay Scientific Inc. Wall Township, NJ USA andrew@sunrayscientific.com   johny@sunrayscientific.com SunRay Scientific Inc of Wall Township, NJ, USA continues to develop new and innovative technologies for electronic component assembly with their portfolio of novel ZTACH® ACE anisotropic conductive adhesives, printed conductive inks and dielectric and encapsulation materials. Introduction Today’s electronics manufacturers are confronted with a growing need for higher performance, lightweight, cost competitive, printed flexible hybrid electronics. This often requires the bonding of fine pitch components in high density and volumes. Factors for success include the capability of the conductive bonding technology to manage the pitch, bond strength requirements, cost constraints, and manufacturing throughput needs. Most available technologies employed in today’s FHE environment have limitations that can either hamper one or more of these important factors. Traditional component bonding technologies can struggle with the requirements for printed FHE applications. Solder, while very low cost and highly conductive, has limitations due to the required processing temperatures, brittle properties, and low bond strength. As a result, it will always require secondary encapsulation of the bonded component to ensure structural integrity. Silver-filled conductive adhesives (ECA) require patterning, which drastically limit component size and pitch, are heavil...

Polymer Thick Film (PTF) technology has played a significant role in printed electronics for more than forty years . By combining additive printing methods with advanced material innovation, PTF has enabled a wide range of electronic designs across industries. Although the underlying process is straightforward, effective use of PTF materials requires both technical understanding and practical experience.    To support continued learning  in this field, Heraeus Electronics is hosting a two‑day, on‑site workshop  at the Thick Film Application Center in Conshohocken, Pennsylvania. The workshop is open to participants across various roles and experience levels. Sessions will primarily focus on technical topics , including materials, processing, and application‑specific considerations.   The program includes small‑group seminars led by engineering experts, designed to strengthen participants’ understanding of PTF pastes and associated process steps. The workshop emphasizes practical   knowledge that can be applied directly to manufacturing and development activities.   Workshop components include: Technical Sessions:  where we share knowledge, practical insight, and innovative approaches to understanding the extensive world of thick film.  Hands-On Demonstrations:  that allow you to grasp the intricacies of the process and gain practical insights. In-Lab Activities:  guided hands-on exercises using our state-of-the-art equipment. Facility Tour:  highlighting our manufacturing pro...

MicroLED Connect and AR/VR Connect 16 & 17 September 2026 | High Tech Campus, Eindhoven, Netherlands   MicroLED Connect and AR/VR Connect are the most important dedicated conferences and exhibitions in these fields still taking place this year, bringing together the entire industry and applied research community from around the globe.   👉Organised by TechBlick and MicroLED Association 👉Supported by Optica, EPIC Photonics, and Karl Guttag 👉375+ Participants 👉25+ Exhibitors 👉50+ Talks 👉8 Masterclasses 👉3 Tours 👉And a year-round program of curated online events A Look Back to 2025.
Significant Growth in MicroLED Connect and AR/VR Connect  MicroLED Connect and AR/VR Connect 2025 was a huge success registrating over 30% YoY growth.   The program was world-class, featuring the likes of Google, Jade Bird Display, Lynx, Avegant, ASML, Swave Photonics, Brilliance RGB, Aledia, Mojo Vision and many more.   The participation was excellent too, including Apple, Meta, GoogleSamsung, Samsung Displays, Tianma, Sony, ASML, Huawei, Applied Materials, Bosch, Sensortec, GlobalFoundries, Lam Research, Thales, BAE Systems, Anduril Industries, Nokia, EssilorLuxotticaValeo, Garmin, ams-OSRAM, Haylo Ventures, ITEC B.V., Jabil Optics,  Fielmann Ventures GmbH, Sioux Technologies, and more A Look Back to 2024.
The First Ever MicroLED Onsite Conference & Exhibition  MicroLED Connect 2024 was a huge success with superb participation and fantastic customer feedback - despite the ups and downs o...

When: 10 & 11 June 2026 Where: Computer History Museum, Mountain View, California Register before 15 March 2026 for early bird rates  The Largest and Most Important Additive Electronics Show in North America! This is the most  important and the largest conference and exhibition  in North America dedicated to additive, printed, flexible, hybrid, wearable, stretchable, soft electronics. Exhibition floor : Almost sold out.  Agenda:  Shaping up to be our strongest yet. Featuring:  NextFlex Innovation Days  Co-locating:  Wearables RESHAPED Exhibition Floor Almost Sold Out ­ The exhibition floor is almost sold out with over 90% of the available spots booked. Act now and book your place! Visit here to download the info package including detailed pricing and benefits descriptions. Tom Keenan will also be your primary point of contact (tom@techblick.com) The Only Truly Global Package Worldwide Our packages are the only truly global option, combining the opportunity to exhibit in the USA and Europe with year-round global digital marketing and engagement. The key benefits include: Onsite exhibition (California  and/or  Berlin shows) 2 or more full onsite conference & exhibition passes 6 or more annual online passes Onsite talk (silver and gold packages only) Online talk Email marketing Social media support Virtual booth...