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TechBlick Blog

8 September 2025

How Femtosecond Lasers are Advancing the Consumer Electronics Field

Deividas Andriukaitis (Main Author) [1], Paulius Gečys[2], Tadas Kildušis[3] [1] Ekspla, Vilnius, Lithuania | [2] Center for Physical Sciences and Technology, Vilnius, Lithuania | [3] Akoneer, Vilnius, Lithuania Contact: d.andriukaitis@ekspla.com , Deividas Andriukaitis The consumer electronics field continues to evolve rapidly, driven by tighter tolerances, higher quality, faster processing speeds, and novel functionalities. As manufacturing demands increase, femtosecond lasers have become an essential technology, playing a critical role in enabling these advancements. In this article, we explore how femtosecond lasers are shaping the development of consumer electronics and powering emerging manufacturing technologies. Figure 1. Fan-out circuit on PI. Courtesy of Akoneer Lasers have long contributed to technological progress across various domains - from telecommunications and metrology to automotive, semiconductor, and medical sectors. Among the different laser types, femtosecond lasers stand out due to their extremely short pulse duration (on the order of 10⁻¹⁵ seconds). When tightly focused, they enable highly localized energy delivery in both time and space, vaporizing material with minimal thermal effects - a process known as „cold“ ablation. Figure 2. Schematic of material processing with long and ultrashort pulse lasers. Courtesy of Amada Miyachi America Inc. To learn more about  MicroLED and AR/VR displays please join the show in Eindhoven on 24 and 25 Sept 2025. Lea...

TechBlick Blog

5 September 2025

全プログラム:TechBlick『The Future of Electronics RESHAPED』カンファレンス&展示会」

📍 2025年10月22日・24日 | ECC ベルリン | 国際会議 & 展示会 本イベントは、Additive, Printed, 3D, Sustainable, Wearable, Flexible, Hybrid, Soft, Stretchable, Textile, Structural, そして Roll-to-Roll (R2R) エレクトロニクスに焦点を当てた、今年必見のグローバル会議・展示会です。 開催内容 ✅ 世界をリードする 100名以上のスピーカー ✅ 90社以上の出展者による最新技術紹介 ✅ 12 の専門家・業界リードによるマスタークラス ✅ 3つのガイド付き研究所見学ツアー ✅ 600名以上の国際参加者とのネットワーキング ✅ TechBlickオンラインイベント、オンデマンド配信、1,500件以上の講演・マスタークラスライブラリに年間アクセス可能 🚨 2025年9月12日までの登録で早期割引に加え200ユーロ節約できます 。一度限りの特典です 🚨 🔹 10月22日 | カンファレンス 1日目 Track 1 09:00 | TechBlick | 開会 & 挨拶
09:10 | Toyota | 自動車産業を超える技術的機会
09:30 | Fuji Corporation | 多層・積層構造のAdditive製造による回路形成
09:50 | Lockheed Martin | 柔軟なハイブリッドエレクトロニクスの実用事例(銅配線と柔軟RF回路)10:10 | NanoPrintek | 原材料から直接行うインクレス多材料プリンティング Networking Break 11:15 | University of Rome Tor Vergata | 大気中での印刷プロセスによる大面積ペロブスカイトPVモジュール
11:35 | CubicPV | 耐久性のあるタンデム構造とスケーラブル製造法
11:55 | Solaires Entreprises Inc | 研究室から量産へ:ペロブスカイトPVスケールアップの課題と教訓12:15 | Institut Photovoltaïque d'Île-de-France (IPVF) | ペロブスカイトPV量産化の課題と戦略 Lunch & Exhibition Break 14:05 | SATO Global | デジタルツインによるIndustry 4.0の進化とRFIDの将来
14:25 | Wiliot | バッテリーフリーBluetoothとプリンテッドセンサーによるAmbient IoTの拡張
14:45 | Sunray Scientific Inc | 紫外線硬化型異方性導電性エポキシによる低コスト高速実装
15:05 | University of Glasgow | サステナブルな無線バッテリーレス・チップレスセンサー Exhibition & Refreshment Break 16:10 | Essemtec | Jetting & SMT実装技術によるフレキシブル基板向け電子回路
16:30 | VTT | フレキシブル・ハイブリッド多層複合システムの試作とプロセス開発
16:50 | Fraunhofer ENAS | 超薄型パリレン基板による次世代フレキシブルPCB
17:10 | TracXon | PCB代替に向けたプリントエレクトロニクスの量産化拡大 Drinks Recep...

TechBlick Blog

1 September 2025

MicroLED & AR/VR Display Innovations: Mass Transfer, Wafer Metrology, Red GaN, Perovskite QDs, Smart Glasses, and Scalable Manufacturing

We cover these points by sharing short (1min or so) handpicked snippets from their live recent talks at TechBlick and MicroLED Connect conferences and exhibitions In this newsletter we cover the following MicroLED Wafer Metrology and Calibration Strategies Assessing the Practicality of MicroLED Displays for Mass Production Stamp-Based Imprinting for AR Waveguide Manufacturing Advances in Mass Transfer Processes for MicroLED Chip Integration VR vs. AR: Market Outlook and Growth Limitations Perovskite Quantum Dots for High-Density Color Conversion Challenges and Advances in Native Red MicroLED Efficiency Etching and Deposition Solutions for MicroLED Materials Progress Toward Emissive Quantum Dot–EL Displays Cubic GaN as a Novel Platform for Scalable MicroLEDs Wafer-to-Wafer Integration for MicroLED Microdisplays MicroLED Smart Glasses and Market Update for AR Applications Integrated Production Platforms for Scalable MicroLED Manufacturing Join the MicroLED Connect + AR/VR Connect 2025 on 24 & 25 Sept 2025 at the High Tech Campus in Eindhoven (Netherlands). Explore full agenda here and register before 12 Sept when the FINAL early bird rates expire   https://www.microledconnect.com/ https://www.microledconnect.com Manufacturing Processes & Integration Advances in Mass Transfer Processes for MicroLED Chip Integration Mass transfer remains one of the biggest hurdles for cost-effective microLED displays. At MicroLED-Connect 2024, Toray Engineering presented a new transfer method com...

TechBlick Blog

29 August 2025

Next Generation Conductive Ink

Authors: Alan Brown , Dr. Jay R Dorfman , Zac Hudson , Brandon Peters Contact: abrown@nagasechemtex.com , Nagase ChemteX America, LLC   In the rapidly evolving field of Printed Electronics, the demand for robust, durable, and highly stretchable conductive inks is paramount for advancing applications in wearable technology and hybrid electronics. While existing conductive inks offer some degree of stretchability, they often exhibit a trade-off between mechanical resilience and electrical performance, leading to a significant increase in resistivity under strain. This limitation poses a critical challenge for engineers designing products that require consistent electrical conductivity across a wide range of motion. Nagase ChemteX America, LLC. (NCU) has developed a next-generation conductive ink, CI-1096, that is formulated to address this gap by providing superior stretchability while maintaining excellent and stable electrical resistivity. Our work constitutes a novel material solution that enables the development of more reliable and versatile stretchable electronic devices, paving the way for future innovations in biomedical sensors, smart textiles, and flexible displays. Stretch Ink Wearable Electrode   NCU began this project with the goals of developing a Ag ink with increased stretchability, superior durability and high conductivity compared to CI-1036, an NCU Ag ink that has been on the market >10 years. This paper will document some of the challenges incurred during de...

TechBlick Blog

8 September 2025

Introducing the Program - Smart surfaces and sensors

Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics.  This year the program features a world-class agenda with over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors.  In this article, we discuss and highlight various innovative talks at the event around the theme of smart surfaces and sensors. In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. Explore the  full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable.  🚨Register before 12 September to save 200 Euros on top of early bird discounts. This is a one-time offer. The coupon can be obtained here🚨 Toyota – Michael Rowe  presents technology opportunities beyond automotive , showcasing cross-industry applications of actuator, sensor, and material innovations. Highlights include shape memory alloy (SMA) wire actuators delivering lightweight, translational motion with integrated feedback; near-IR reflective pigments enabling hidden data transfer fo...

TechBlick Blog

5 September 2025

Full Program: The Future of Electronics RESHAPED Berlin

22 & 24 October 2025 | ECC, Berlin | Conference & Exhibition This is the must-attend event of the year , focusing on additive, printed, 3D sustainable, wearable, flexible, hybrid, soft, stretchable, textile, structural and R2R electronics.    This year the event will feature:

✅ 100+ speakers 
✅ 90+ exhibitors showcasing all the key innovations
✅ 12 expert- and industry-led masterclasses 
✅ 3 guided tours
✅ Networking with 600+ global participants 
✅ Annual access to all TechBlick online events, on-demand version of all onsite events, as well as an on-demand library featuring over 1500 talks and  masterclasses.
🚨Register before 12 September to save 200 Euros on top of early bird discounts. This is a one-time offer. The coupon can be obtained here🚨
Explore The Agenda See the most up-to-date conference agenda here 22 October | Conference Day 1 Track 1 09:00 | TechBlick  | Welcome & Introduction 09:10 | Toyota  | Technology Opportunities That Go Beyond Automotive 09:30 | Fuji Corporation  | Additively manufactured multi-layer and stacked circuits with embedded electronics components 09:50 | Lockheed Martin  | Flexible Hybrid Electronics in the Wild: How Copper Printing and Flexible RF Circuits Made it Out of the Lab and Into the Field 10:10 | NanoPrintek  | Inkless Multimaterial Printing Directly from Raw Materials - Breaking the Barriers in Cost, Time, Pollution, and Supply Chain   Networking Break 11:15 | University of Rome Tor Vergata  | Scalable and Ambien...

TechBlick Blog

29 August 2025

Scalable Metal Oxide Nano Inks for High-Performance Organic, Perovskite, and Thin Film Photovoltaics and OLEDs

#PerovskiteSolarCells #OLED #OrganicPV #PrintedElectronics #NanoInks #ElectronTransportLayer #FlexibleElectronics #Optoelectronics #RollToRoll #SmartMaterials #EnergyTech #SolarInnovation #DisplayTechnology #NextGenMaterials #SustainableElectronics
Author:  Maryam Bari  & Ashwani Jain   PINA CREATION   Unlocking printable, low-temperature charge transport layers for next-generation optoelectronics   As next-generation optoelectronic technologies—such as  Perovskite solar cells (PSCs), OLED displays, and Organic photovoltaics (OPVs) —move from lab to large-scale manufacturing, the pressure is on to find materials that are  not only high-performing, but scalable, stable, and compatible with printed device architectures .   A critical bottleneck remains the  Electron Transport Layer (ETL)  and  Hole Transport Layer (HTL) . For technologies relying on delicate or flexible substrates, traditional materials such as Organic Semiconductors and traditional metal oxide inks pose serious limitations. High-temperature processing, moisture sensitivity, high cost, and limited lifetime all threaten the viability of commercial deployment.   At  PINA Creation , we’ve developed a line of  ready-to-use SnO₂, NiO and ZnO nano inks  that overcome these barriers and unlock practical, large-area fabrication for flexible and rigid optoelectronics. We are Exhibiting in Berlin. Visit our booth at the TechBlick Perovskite Connect  event co-located with the  Future of Electronics RESHAPED  on 22-23 Oc...

TechBlick Blog

28 August 2025

👉 Perovskite Connect 2025 컨퍼런스 전체 프로그램 소개

Perovskite Connect Conference & Exhibition | 2025년 10월 22–23일, ECC 베를린 | Future of Electronics RESHAPED Berlin 2025 와 공동 개최
Perovskite Connect 2025  는 전 세계의 선도적 혁신가, 연구자, 제조업체들을 한자리에 모으는 페로브스카이트(perovskite) 산업의 핵심 행사 로 자리매김하고 있습니다.
이번 전문 컨퍼런스는 2025년 10월 22–23일 베를린 ECC에서 열리며, 주력 행사인 Future of Electronics RESHAPED  와 함께 진행됩니다.
본 기사에서는 이번 컨퍼런스에서 발표될 주요 강연 일부를 소개합니다. 👉 전체 프로그램 보기  및 2025년 9월 12일 이전 등록 시 할인 혜택 제공 Oxford PV – Edward Crossland 세계 최초의 상용 페로브스카이트–실리콘 탠덤 모듈 (perovskite–silicon tandem module)  을 소개합니다. 실리콘의 효율 한계를 돌파한 탠덤 기술은 기존 생산 라인에 최소한의 변경만으로 더 높은 성능을 제공합니다. 발표에서는 Oxford PV의 2024년 출하라는 중요한 이정표, 최신 기술 진전, 내구성·스케일업·환경 적합성 솔루션을 다루며, 대규모 상용화를 위한 준비가 완료되었음을 보여줍니다. Hangzhou Microquanta Semiconductor – Yang Chen 페로브스카이트 태양광 (perovskite PV)  의 상용화 준비 상황을 논의합니다. 산업적 검증 및 현장 배치에서 얻은 교훈을 바탕으로 안정성, 효율, 대규모 제조의 도전과 그 해결책을 다룹니다. 인증 및 실사용 테스트에 대한 통찰을 통해 페로브스카이트 PV가 실리콘을 대체할 수 있는 상업적으로 유망한 기술로 진화하고 있음을 보여줍니다. Swift Solar – Maximilian Hoerantner 연구실에서 공장으로의 이전(lab to fab)을 통한 페로브스카이트–실리콘 탠덤 태양광 (tandem PV)  기술의 발전을 소개합니다. 본 발표는 웨이퍼 수준으로 제조 공정을 확장하면서도 높은 효율과 안정성을 달성하는 데 초점을 둡니다. 주요 주제로는 디바이스 스택 최적화, 광·열 스트레스 하에서의 신뢰성 시험, 상용화를 위한 고처리량 제조 기법 개발이 포함됩니다. Solar and Renewable Industry Leader – Gunter Erfurt 유럽 및 미국 태양광 산업의 미래를 탐구합니다. 중국의 과잉 생산으로 인한 글로벌 경쟁 압박 속에서, 산업 정책, 대량 생산 능력, 혁신 중심 생태계의 중요성을 강조하며 유럽과 미국이 회복력 있고 경쟁력 있는 태양광 산업을 확보할 수 있는 전략을 제시합니다. 👉 전체 프로그램 보기  및 2025년 9월 12일 이전 등록 시 할인 혜택  제공 University of Rome Tor Vergata – Luigi Vesce 대기 환경에서의 스케일러블한 인쇄형 페로브스카이트 모듈 (printed per...

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