Ynvisible InteractiveInc. (the "Company" or"Ynvisible") (TSX-V: YNV, FSE: 1XNA, OTCQB: YNVYF), on 15th March 2022, plans on releasing an updated version of their display, positioning it as the lowest energy-consuming printed e-paper display on the market. ‍ The upgraded ultra-low-power display now consumes 50% less energy per switch than its predecessor and can last 10 times longer when switched on and off, positioning the technology as the lowest energy-consuming display in the e-paper industry. Other upgrades include boosted performance, particularly at lower temperatures, faster processing speeds, and a higher quality print, display. Ynvisible's new e-paper displays are also the thinnest displays on the market and are capable of fitting in the card holder of your wallet, providing incredible benefits when creating products in the emerging smart label and packaging market. ‍ These upgrades, along with the highly customizable screen-printing production processes, are set to position Ynvisible’s e-paper display as a compelling contender in the printed display space. Carolos Pinheiro, CTO at Ynvisible, said: “We are continuously collecting market feedback to prioritize our development efforts and technology roadmap. With this new generation display release, we know that we are responding to our customers’ needs whilst expanding the use of our printed display technology in a wider range of e-paper devices” “This latest upgrade will significantly benefit specific indus...

This is auto-transcriped from the presentation without human control You are probably familiar with no Novacentric as as our kind of parent company and we have over the past of. Few months have migrated to to establish a new division within the company called Pulse Launch. So we bring the same innovative team to this foray, and we were working to solve a lot of the problems that that people are having with various processing challenges that they're facing. We're based in Austin, Texas. Then we always love to host you guys. So if you're ever in the Texas area of the United States, come visit us. So we're in the business of delivering light and we use that light to heat up or do some work on a different material. And the key that we bring to the table is that we can deliver this this energy in a very digital manner, in a non non-contact digital format, whereby we can really target what material we're heating up and we heat it up. Whereas the lead precisely and and repeated. So this heating can be done above the thermal equilibrium thermal damage threshold of most materials, enabling us to really get into creating value for our customers. This can be attributed. This type of pulsing can be attributed to processing a wide range of different materials. So that allows us to really get Spring Valley to a lot of different applications. So these are just some sample applications that we have. But for today's discussion, I want to talk about soldering and the ability for us to place co...

Victoria, B.C. (February 2022): Solaires Entreprises Inc (Solaires), a Canadian cleantech startup based in Victoria BC, is raising USD 2.1 million in pre-seed funding at a pre-money valuation of USD 9 million. Investors and recognized angel groups in British Columbia, such as eFund, Cindicates, and Keiretsu forum members are participating in this round. “We have developed a solution that will enable innovative solar energy applications to revolutionize solar energy harvesting. We are currently in advanced discussions with key partners for this product as they are interested in Solaires’ vitally important work in accelerating our transition to a low-carbon economy”, said Chief Development Officer, Ernest Daddey. The proceeds from the pre-seed round will be directed towards purchasing materials and equipment to ramp up the production capabilities of the company and scale up their product sales of Solar Ink™. “We are very grateful for the continued support we receive from our partners, our communities, and our investors. Our progress in the pre-seed raise and product launch has demonstrated that we have an excellent team and proven technology. Now onwards, we will be ramping up production and delivery to start order fulfilment,” said CEO & Co-founder, Fabian de la Fuente. About Solaires Entreprises Inc.: Solaires Entreprises Inc. is a Canadian cleantech company located in Victoria, focused on developing the next generation of solar cells by replacing silicon with perovskite thro...

Speaker: Katharina Gerber | Company: LiCap Technologies | Date: 9-10 Feb 2022 | Full Presentation Solid state #electrolytes (SSEs) can improve safety of batteries due to the reduced possibility of thermal runaway that is more likely to occur in the presence of liquid electrolytes used in lithium ion batteries. However, lack of scalable processes allowing to produce SSEs with the necessary combination of thickness, uniformity, interfacial impedance and mechanical strength, hinders commercialization of solid-state batteries (SSBs). Whether as glass or in ceramic form, SSEs usually require high temperature sintering or vapor deposition to consolidate the films and manage interfacial impedance. The resulting films are brittle, and available manufacturing methods are limited to production of tiny cells with low capacity. LiCAP Technologies, Inc. has a patented Activated Dry Electrode technology, which makes processing of battery materials more cost-effective and sustainable and, is uniquely suitable for handling of sensitive SSB materials. R2R Activated Dry Electrode process is already proven on industrial scale in world’s fastest manufacturing of ultracapacitor electrodes and has been piloted in R2R production of electrodes for lithium-ion batteries. In 2022 LiCAP will launch development of scalable R2R process for the solid-state battery industry. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of...

Speaker: Filip Granek | Company: XTPL | Date: 11-12 May 2021 | Full Presentation We introduce the ultra-precise deposition (UPD) technology for rapid prototyping of microelectronic devices. UPD allows maskless deposition of high-viscosity metallic and non-metallic inks with the printed feature size as small as 1 μm. XTPL technology answers some of the key challenges in the fabrication of high-density microelectronics, including the ability to print on complex 3D substrates and obtain structures with arbitrary shapes, including lines, dots, crosses, and meshes. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...

This is an auto transcriped version of the talk without human control All right. Thank you very much. I appreciate the invitation to come talk about our materials. So first, I want to go into an introduction of motivation and 5G. So in response to society's increasing appetite for more and more data, telecommunication networks are looking to increase wireless communication, bandwidth and connectivity. And a critical aspect of this is the hardware, the devices that will that will need to operate at higher frequencies, at frequencies known as millimeter wave or about 20 gigahertz. Unfortunately, current device designs use materials that will not deliver the efficiency in terms of power utilization or with practical economics. But if you could integrate the semiconductor chips in the same modules as the passives and the switches and the filters and the antenna structures, this will shorten wiring distances and increase electrical efficiency as well as miniaturizing devices which are all good things using materials that I only use that only not only allow for increased integration, but also have stable performance at high frequency and at a myriad of operating conditions are critical to realize the advanced designs that these higher frequencies that will give us more data, but they also will provide hard hardware that will give a robust build out and avoid things like field failures or unnecessary maintenance cost in the field. And so that's why we focused on 5G. And so what I re...

This is an auto transcriped version of the presentation without any human control. Speaker 200:00:04Yes, we can hear you. We can see you and your slides are perfect. So you have your 5 minutes now. Speaker 100:00:09Okay. Thank you very much. So today we're going to talk about high output, aerosol printing for high conductivity, printed electronic applications. The first thing we're going to talk about is sort of the sweet spot for aerosol printing, the traditional sweet spot. And then we'll talk a little bit about what we're doing to enhance the aerosol printing capability and expand it into other areas. So the slides here show the typical sweet spot for for aerosol printing is fine printing of fine lines. A lot of effort for aerosol printing has been focused, no pun intended, on printing of very fine features. So we can reliably print features down to 15 microns. And with our and a lot of our customers actually have printed features at ten microns or less. The image on the right shows gold printed conductors, they're 20 microns wide at 100 micron, and they have really good line edge quality. I can show you some better higher magnification images of the type of image quality you would expect for our aerosol printing. Another unique advantage that we have for the aerosol printing is that we have a large working distance between the nozzle and the substrate that we're printing on. This really makes aerosol printing unique or provides a unique advantage over a lot of the other d...

Speaker: Jean-Charles Souriau | Company: CEA| Date: 11-12 May 2021 | Full Presentation ChipInFlex is CEA-Leti's latest development towards the integration of ultra-thin, bare silicon chips within a flexible film. Today, electronic systems are becoming smaller, thinner and, above all, flexible. Flexibility makes possible new functions and hence new usages. With Chip-In-Flex, CEA-Leti is introducing a new paradigm for integrating ultra-thin, bare chips into a flexible label made on a silicon wafer. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda...