Future of Electronics RESHAPED: USA conference arrives in Mountain View, California, on 10-11 June 2026. Held at the Computer History Museum, this global gathering focuses on the commercialization and technical advancement of additive, printed, 3D, and wearable electronics. This is the most important and the largest conference and exhibition of the year dedicated to printed electronics, additive electronics, 3D electronics, wearable electronics, flexible electronics and hybrid electronics. The 2026 agenda features deep-tech presentations from industry leaders covering material innovations, scalable roll-to-roll (R2R) manufacturing, and novel hardware applications. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link High-precision capillary printing, roll-to-roll VIA printing, and electrochemical additive manufacturing (ECAM) for thermal management. Sub-Micron Printing, Scalable FHE, and Next-Gen AI Cooling? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Keynote Presentations covering high-precision capillary printing, roll-to-roll VIA printing, and electrochemical additive manufacturing (ECAM) for thermal management. Hummink | Pascal Boncenne Topic: HPCaP (High Precision Capillary Printing) : A Technology for Advanced Packaging. Pascal explores the strict micron-scale limitations of traditional inkjet printing, which relies on external lasers, pressure, or UV energy and struggles with high-viscosity materials. Th...

Next-Gen Wearable Electronics & Invisible Monitoring? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 2 covering wearables in pharma, sustainable FHE manufacturing, internal physiological insight tracking, and body-integrated medical sensors. Genentech (Roche Group) | Paul Upham Topic: Wearables in Pharma. Paul explores how traditional pharmaceutical development often lacks continuous, real-world data from the patient's home environment to establish stronger clinical endpoints. The talk highlights how integrating wearable technologies across multiple disease domains captures high-utility patient data. This work offers a powerful framework for utilizing wearables to improve clinical trial accuracy and accelerate drug development. GE Healthcare | Gurvinder Topic: Sustainability-to-Scalability in FHE: Screening LCA Insights and AI/ML-Enabled Manufacturing. Gurvinder explores the high environmental impacts and slow qualification cycles that limit the scale-up of conventional flex circuitry. The presentation reveals a life cycle assessment (LCA) proving printed flex reduces fabrication impacts by up to 80%, paired with an AI/ML workflow for in-line defect detection. This solution provides an optimized, low-emission roadmap for mass-producing vital sign monitoring patches. Datwyler Switzerland Inc. | Mattia Lucchini Topic: A Glimpse Inside: How Next-Gen Wearables are Unlocking Internal Physiological and Mental Insights. Mattia explores the curren...

Picture: Ms. Jennifer Lin, AUO Corporation Vice President of Innovation Development, and Mr. Ness Benamran, Aledia Chief Financial Officer, announced the partnership in the presence of the Minister of Economic Affairs of Taiwan, Mr. Kung Ming-Hsin Grenoble, France & Hsinchu, Taiwan - April 10th 2026 -AUO Corporation ("AUO") and Aledia today announced a strategic partnership to develop a new generation of microLED display technology combining high brightness, low power consumption, and high resolution. The collaboration will integrate Aledia's high-voltage microLED {µLED) technology-based on its proprietary 3D nanowire architecture-onto AUO's advanced display backplane. MicMiD project for enhanced microLED displays The project has been selected as part of the France-Taiwan cooperation funding program, announced in Paris on March 31, 2026, in the presence of representatives from both governments and industry. The objective is to enable energy-efficient, high-performance displays addressing the growing demand for next-generation display technologies. By combining AUO's expertise in display engineering and system integration with Aledia's microLED technology designed for high-volume semiconductor manufacturing, the partnership aims to accelerate the industrialization of microLED displays and support their adoption across emerging applications. Beyond display use cases, the collaboration also opens opportunities in adjacent domains such as optical interconnects for Al data centers...

Author: Jurgen Westerhoff | jurgen.westerhoff@spgprints.com Why printed electronics projects succeed or fail at the business case stage Printed electronics has moved well beyond the experimental phase. Applications such as RFID antennas, in-mould heaters, biosensors, and energy components are increasingly transitioning into industrial-scale production. The technical promise is clear: lightweight designs, scalable manufacturing, and new functional integration possibilities. Yet many projects stall at a critical point — not because the technology fails, but because the business case remains unclear. In most development trajectories, technical feasibility comes first. Teams focus on whether the application works: signal performance, resistance levels, feature resolution, and material compatibility. These are essential steps. Without them, there is no viable product. However, technical validation alone does not justify investment. A recurring issue in printed electronics projects is that financial validation happens too late. Organizations often confirm that a product works before asking whether it can be produced profitably, reliably, and at scale. This creates a structural risk. By the time cost models, yield assumptions, and capital requirements are analysed, significant time and resources have already been committed. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in ...

Intelligent Labels, Biosensing Patches, and Multi-Modal Tracking? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 1 covering smart interactive label technologies, silicone-based dry electrode biosensing, and AI-boosted neuromuscular tracking. Tapecon | Brad Hull Topic: The Evolution of Smart Labels: From Identification to Intelligent Interaction. Brad explores how standard barcoded identification no longer satisfies the data demands of modern logistics, healthcare, and retail ecosystems. The presentation outlines a versatile toolbox of emerging technologies designed to transform passive packaging into intelligent devices capable of autonomous authentication, sensing, and communication. This work provides original equipment manufacturers (OEMs) with a practical guide to speed up distributed workflows and enable real-time interactive product tracking. DuPont | Julia Kozhukh Topic: Skin-Friendly Biosensing Patches for Excellent Signal Quality and Patient Comfort. Julia explores the medical and technical challenges of remote cardiac monitoring, where standard patch materials cause skin irritation and suffer from signal degradation during extended patient wear. The talk details an innovative patch design utilizing silicone pressure-sensitive adhesives combined with specialized, silicone-based dry electrodes. This solution delivers an ultra-comfortable, skin-friendly architecture that maintains excellent signal quality to support early clinical d...

Author: Masoud Mahjouri-Samani | info@nanoprintek.com For decades, printed electronics has promised a future of rapid, flexible, and low-cost manufacturing. From wearable sensors and smart packaging to flexible antennas and next-generation energy systems, the vision has been compelling. Yet despite impressive progress, many technologies still struggle to transition into reproducible manufacturing platforms. Besides the challenge of what materials can be printed, the greater challenge is whether they can be manufactured reliably, repeatedly, and independently of fragile material supply chains. Traditional printed electronics rely heavily on highly engineered liquid formulations composed of nanoparticles, solvents, binders, surfactants, dispersants, rheology modifiers, and proprietary additives. While these formulations enable printing, they also introduce a significant burden on manufacturing consistency and qualification. Small variations in ink composition, aging, storage conditions, viscosity, or supplier changes can drastically alter print performance and final device characteristics. Even more challenging, many inks are proprietary and evolve over time. Suppliers may discontinue formulations, modify ingredients, or change processing routes, forcing manufacturers and researchers to repeatedly recalibrate and requalify processes. For industries requiring long-term reliability, including aerospace, defense, medical systems, and energy infrastructure, this creates substantial...

Author: Varun Vohra, Engineering Department Manager, Brilliant Matters | v.vohra@brilliantmatters.com Organic Photovoltaics (OPVs) for Solar Heat Gain (SHG) Mitigation Buildings are among the largest contributors to global energy consumption and greenhouse gas emissions, accounting for a significant portion of worldwide energy-related CO₂ output. They are responsible for roughly one-third of global final energy use, with operational energy demand dominated by heating, ventilation, and air conditioning (HVAC). In modern commercial and high-performance residential buildings, HVAC systems typically represent 30% to 60% of total building energy consumption [1]. In recent years, buildings with high glazing ratios or window-to-wall ratios (WWRs) exceeding 70% have become increasingly common worldwide. This trend has been enabled by advances in high-strength glazing materials and window-frame engineering, which allow large glass façades to be implemented safely while enhancing daylight access and spatial openness for occupants. However, high WWRs also substantially increase cooling demand, often making HVAC systems the dominant contributor to building electricity consumption, accounting for more than 75% of total electrical use in some cases [2]. Conventional glazing lets through a large fraction of near-infrared (NIR) solar radiation (700–2500 nm), which carries more than half of the sun’s thermal energy. Transmitted NIR radiation is absorbed by interior surfaces and re-emitted as ...

Author: Kyle Pucci | pucci@imagexpert.com At ImageXpert, we design inkjet development platforms with one goal in mind: enabling users to develop, validate and scale applications with confidence. In this context, curing is no longer a downstream step. In advanced functional and industrial applications, even small changes in UV dose, wavelength or timing can determine whether a printed layer performs as intended—or fails later during testing or scale-up. Collaborative Success Traditionally, curing has been treated as a secondary consideration in inkjet R&D, often handled using stand-alone lamps or externally controlled units. However, as applications become more demanding, this separation can limit development accuracy and process understanding. To overcome this, ImageXpert has partnered with IST INTECH to bring fully integrated UV-LED curing directly into our JetXpert printing platforms. By embedding it within the core system architecture, ImageXpert enables users to treat curing as a fully controllable and optimisable process parameter—alongside jetting, motion and fluid behaviour. Adjustable Operating Window A defining strength of ImageXpert equipment is flexibility. Our platforms are built to support a wide range of applications, allowing users for example to evaluate different fluid chemistries and viscosities, jetting and long-term reliability, layer application and thicknesses, print process speeds and quality seamlessly. All towards end-use requirements—and within...