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22 & 24 October 2025 | ECC, Berlin | Conference & Exhibition This is the must-attend event of the year , focusing on additive, printed, 3D sustainable, wearable, flexible, hybrid, soft, stretchable, textile, structural and R2R electronics.    This year the event will feature: ✅ 100+ speakers  ✅ 90+ exhibitors showcasing all the key innovations ✅ 12 expert- and industry-led masterclasses  ✅ 3 guided tours ✅ Networking with 600+ global participants  ✅ Annual access to all TechBlick online events, on-demand version of all onsite events, as well as an on-demand library featuring over 1500 talks and  masterclasses. 🚨Register before 12 September to save 200 Euros on top of early bird discounts. This is a one-time offer. The coupon can be obtained here🚨 Explore The Agenda See the most up-to-date conference agenda here 22 October | Conference Day 1 Track 1 09:00 | TechBlick  | Welcome & Introduction 09:10 | Toyota  | Technology Opportunities That Go Beyond Automotive 09:30 | Fuji Corporation  | Additively manufactured multi-layer and stacked circuits with embedded electronics components 09:50 | Lockheed Martin  | Flexible Hybrid Electronics in the Wild: How Copper Printing and Flexible RF Circuits Made it Out of the Lab and Into the Field 10:10 | NanoPrintek  | Inkless Multimaterial Printing Directly from Raw Materials - Breaking the Barriers in Cost, Time, Pollution, and Supply Chain   Networking Break 11:15 | University of Rome Tor Vergata  | Scalable and Ambient-Air Processing of Printed Perovskite PV Modules 11:35 | CubicPV  | Enabling Durable Perovskite Tandems with Scalable Architecture and Manufacturing Methods 11:55 | Solaires Entreprises Inc  | From Lab to Fab: Navigating the Challenges and Lessons Learned in Scaling Perovskite PV Modules 12:15 | Institut Photovoltaïque d'Île-de-France (IPVF)  | From Lab to Fab: Navigating the Challenges and Lessons Learned in Scaling Perovskite PV Modules Lunch & Exhibition Break 14:05 | SATO Global  | How digital twins support Industry 4.0 and what comes next in RFID 14:25 | Wiliot  | Scaling Ambient IoT: Wiliot’s Battery-Free Bluetooth Revolution with Printed Sensing and Reel-to-Reel Manufacturing Technology 14:45 | Sunray Scientific Inc  | Ultraviolet Light-Cured Anisotropic Conductive Epoxy for Low Cost, High Throughput Electronic Assemblies 15:05 | University of Glasgow  | Sustainable Wireless Battery-Free and Chip-Free Sensors and IDs Exhibition & Refreshment Break 16:10 | Essemtec  | Jetting and SMT mounting technologies for additive and printed electronics on flexible and stretchable substrates 16:30 | VTT  | Flexible hybrid multi-layer complex systems: Prototyping and Process Development 16:50 | Fraunhofer ENAS  | Ultra-thin Parylene-based Printed Circuit Boards for the next generation of flexible electronics 17:10 | TracXon  | Expanding the boundaries of printed electronics for volume manufacturing of PCB-replacements Drinks Reception Track 2 09:10 | Oxford PV  | The world's first commercial tandem perovskite-silicon module 09:30 | Hangzhou Microquanta Semiconductor  | Bridging the Gap: The Commercial Readiness of Perovskite PV 09:50 | Swift Solar  | Unlocking the Potential of Perovskite-Silicon Tandem PV: Insights into the Journey from Lab to Fab 10:10 | Solar and Renewable Industry Leader  | The Future of European and U.S. Solar Manufacturing: Niche Only or Mass Production? Exhibition & Refreshment Break 11:15 | Würth Elektronik GmbH & Co. KG  | Towards Sustainable PCBs: Design, Process Efficiency and Material Innovation for a Greener Lifecycle 11:35 | Signify Research  | Printed Electronics, an opportunity for lighting? 11:55 | Dresden Integrated Center for Applied Physics and Photonic Materials - TU Dresden  | Leaftronics: novel devices based on leaf skeletons 12:15 | Holst Centre  | Recyclability of In-Mold Electronics   Lunch & Exhibition Break 14:05 | Q5D  | 5 axis laser-assisted selective metallization of large 3D parts 14:25 | XTPL  | Additive Manufacturing for Next-Generation Microelectronics 14:45 | AMAREA Technology  | Ceramic-Based Printed Electronics Enabled by Multi-Material Additive Manufacturing 15:05 | Lithoz  | Additive Manufacturing of Dielectric Ceramics and Ceramic–Metal Components Using Lithography-Based Ceramic Manufacturing Exhibition & Refreshment Break 16:10 | Henkel  | High Performance Inks for Cost Efficient Manufacturing of Printed Electronics 16:30 | CondAlign  | Novel conductive films – from launch to volume production 16:50 | University of Coimbra  | Scalable, High-Resolution Microchip-Integrated Liquid Metal Circuits: Enabling the Next Generation of 3R Electronics 17:10 | The University of Manchester  | Graphene and 2D materials printed electronics Drinks Reception Track 3 11:15 | CurveSYS Sensors  | Smart Sensors for Security Fields 11:35 | Heraeus Electronics  | Bridging the Gap Between Additive and Subtractive Technologies: the Solderable Polymer Revolution 11:55 | Blackleaf  | Graphene-based Electric Heating: how graphene films are reinventing surface heating in the industry 12:15 | ELANTAS Europe GmbH  | Printed Electronics in the fast lane: Paste technologies driving tomorrow’s mobility   Lunch & Exhibition Break 14:05 | iGii  | Revolutionising sensing and diagnostics with 3D carbon nanomaterials 14:25 | NGK Europe GmbH |  [TBC] 14:45 | Armor Smart Films  | Armor Smart Films: Empowering Scalable Innovation in Functional Surfaces 15:05 | RISE  | Screen printed stretchable electronics including liquid metals   Exhibition & Refreshment Break 16:30 | TNO partner in Solliance  | Pioneering Perovskite Scalability: Advancing Roll-to-Roll Slot Die Coating for Stable and Efficient Flexible Solar Cells 16:50 | Heliatek  | Certified, flexible and lightweight PV modules on a commercial scale 17:10 | OET Energy Technologies  | Scaling Printed Photovoltaics: From 3rd Gen PV Innovation to Giga Fab Industrialization   Drinks Reception Track 4 11:15 | National Research Council Canada  | 3D electronics with volumetric additive manufacturing 11:35 | Notion Systems  | New products for development and scale-up of functional inkjet processes to industrial production 11:55 | ImageXpert  | Selecting the Right Inkjet Printhead for Advanced Electronics Applications 12:15 | Printed Electronics Limited  | Drop-on-Demand Printing of Highly Viscous Inks     Lunch & Exhibition Break 14:05 | Sofab Inks  | Novel materials for next-generation perovskite solar panel production processes 14:25 | Karlsruhe Institute of Technology  | New Materials for Metallization and Interconnection of Perovskite Reduced Silver Consumption 14:45 | Nano-C, Inc.  | Innovative Interface Materials for Perovskite Photovoltaics 15:05 | DELO Industrial Adhesives  | Pioneering the Future: DELO's Advanced Adhesives Enhance Perovskite Solar Cell Protection Exhibition & Refreshment Break 🚨Register before 13 September to save 200 Euros on top of early bird discount. This is a one-time offer. The coupon can be obtained here🚨 23 October | Conference Day 2 Track 1 09:10 | Valeo  | Introducing new technologies into automotive products: Valeo’s path with Printed and In-Mold Electronics 09:30 | Auburn University  | Additively Printed In-Mold Electronics Circuits and Sensors for Automotive 09:50 | GE Aerospace  | Additive Electronics for Harsh Environment Applications in Aerospace 10:10 | NextFlex  | Commercialization of Additively Manufactured Electronics Exhibition & Refreshment Break 11:15 | Fraunhofer ISE  | Sustainable Fabrication of Perovskite Modules: Strategies for scalable devices with low material criticality 11:35 | SparkNano  | On a Roll: Spatial ALD Advances Scalable Perovskite Solar Manufacturing 11:55 | AeroSolar  | Aerosol treatment of perovskite solar cells for improved efficiency, stability and manufacturing yield Lunch & Exhibition Break 13:15 | HighLine Technologies  | Scalable Solutions, from Microextrusion to Coating 13:35 | Ceradrop - MGI Digital Technology  | [Title TBC] 13:55 | Sonojet  | SAW-Based Aerosol Printing for the Future of Electronics 14:15 | Enjet  | Redefining Functional Printing: Innovations in EHD Inkjet Multi-Nozzle Technology Exhibition & Refreshment Break  15:05 | X-Fab  | Micro-Transfer Printing: Integrate ultra-thin ASICs to enable sophisticated Applications 15:25 | Mesoline  | Microchannel particle deposition for MEMS & Sensors Applications 15:45 | Prio Optics GmbH  | Precision Through Additive Manufacturing: Inkjet-Printed Optical Coatings Track 2  09:10 | Caelux Corporation  | Meeting Future Energy Needs With High Density Solar 09:30 | Helmholtz-Zentrum Berlin  | [Title TBC] 09:50 | Perovskia Solar  | Charged by Light – Designed for Life 10:10 | CEA  | Challenges for upscaling Perovskite/Silicon tandem solar cells Exhibition & Refreshment Break 11:15 | Fraunhofer EMFT  | Endless electronics by R2R processing 11:35 | Eastman Kodak  | Flexo for High-Resolution Roll-to-Roll Manufacturing 11:55 | LightnTec  | [Title TBC]. Lunch & Exhibition Break 13:15 | Fraunhofer ILT  | Optimizing Local Conductivity in Printed Electronics: A Laser-Controlled Approach 13:35 | Hamamatsu  | Leveraging Laser Processing for Sustainable Printed Electronics – Laser Sintering, Encapsulation & Soldering 14:05 | Akoneer  | Making of multilayer glass HDI PCB 14:15 | DR Utilight Corp  | Laser Pattern Transfer Printing for High-Viscosity Pastes Exhibition & Refreshment Break 15:05 | Smartkem  | OTFT circuit developments enabling low-voltage flexible processors 15:25 | Canatu  | ADAS camera heaters, advancing autonomous driving in any weather 15:45 | INKTIO  | From Ink to Impact: Digital Manufacturing of Flexible Photocatalytic Electronics Track 3 11:15 | Hummink  | HPCaP (High Precision Capillary Printing): A Technology for Next-Generation Manufacturing 11:35 | Suss MicroTec  | Pushing the Limits of Inkjet Printing: A Flexible Platform for Micro- and Multi-Material Deposition 11:55 | Myrias Optics + UMass Amherst  | Printed Metaoptics for AR/VR and Photonics Lunch & Exhibition Break 13:15 | INO d.o.o.  | From R&D to high volume production and importance of modular equipment 13:35 | Conductive Technologies  | Engineering Functionality: Material Strategies for Modern Sensors 14:15 | Panasonic  | Multifunctional Shock Absorb Film Material, Toughtelon   Exhibition & Refreshment Break 15:05 | SOLRA-PV  | The Industrialization of Perovskite-Based Indoor Photovoltaics 15:25 | P3C Technology and Solutions Pvt Ltd  | Scaling Perovskite Solar Module Technology in India: Field Deployment and Commercialization Roadmap Track 4   11:15 | Antolin  | Automotive interiors dynamic decoration with electronic ink 11:35 | Trusscore  | Changing your wall colour on demand using electrochromics 11:55 | ruhlamat GmbH  | Embedded wires for 3D formed electronics and smart surfaces   Lunch & Exhibition Break 13:15 | SOLRA-PV  | The Industrialization of Perovskite-Based Indoor Photovoltaics 13:35 | SALD B.V.  | A Paradigm Shift in Roll-to-Roll Spatial Atomic Layer Deposition for Perovskite Solar Cell Manufacture 14:15 | Panacol-Elosol GmbH  | Advanced Bonding Technologies for Flexible Substrates and Electronic Devices 14:35 | Intellivation LLC  | R2R Laser Processing of Multi-Layer Vacuum deposited coatings on flexible substrates for 2D Functional Devices 🚨Register before 12 September to save 200 Euros on top of early bird discount. This is a one-time offer. The coupon can be obtained here Masterclasses and Tours   Explore our masterclass and tour program here. Masterclasses | Track 1 (21 OCT 2025) 09:00 | Nagase ChemteX  | Selecting Conductive Inks: A Property-Driven Approach for Printed Electronics Applications 10:00 | Heraeus Electronics  | Printable Thick Film Heaters: Essentials for Design, Material Selection, and Printing 11:00 | Fraunhofer IFAM  | Screen Printing Technology For Printed Electronics Manufacturing 12:00 | 3E Smart Solutions / ZSK  | Driving Reliability and Scalability in E-Textiles and Wearables via Embroidery Technologies | Chip Interconnections for Flexible Printed Electronics. Masterclasses | Track 2 (21 OCT 2025) 09:00 | Hahn-Schickard  | Multi-material Additive Manufacturing of 3D Electronics 10:00 | Voltera  | Advancements in Printed Electronics Prototyping: Direct Ink Write Technology for Printed Multi-Layer Flexible Electronics 11:00 | Silicon Austria Labs GmbH  | Life Cycle Assessment of Printed Electronics: Challenges, Insights and Opportunities 12:00 | CEA  | Advancing PCB Technology Through Additive Manufacturing: Process, Sustainability, and Reliability Masterclasses | Track 3 (21 OCT 2025) 09:00 | imec  | Stable and efficient architectures for perovskite solar modules and tandems 10:00 | Swansea University  | Printing Perovskite Solar Modules using S2S and R2R processes 11:00 | Coatema  | Slot Die Coating: Principles and Practice Towards Mass Production 12:00 | Fraunhofer IAP  | Towards Non-Toxic and Sustainable Materials in Perovskite Photovoltaics   Tours to:   Fraunhofer IAP, Fraunhofer IZM, Helmholz Zentrum Berlin/PVcomB   🚨Register before 12 September to save 200 Euro on top of early bird discounts. This is a one-time offer. The coupon can be obtained here Exhibition  Explore the exhibition floor here 🚨Register before 12 September to save 200 Euro on top of early bird discounts. This is a one-time offer. The coupon can be obtained here🚨 Gold Exhibitors Dimension Division Heraeus Electronics Henkel Nagase ChemteX Notion Systems Silver and Standard Exhibitors ACI Materials Akoneer Ames Goldsmith Armor Smart Films Blackleaf Ceradrop - MGI Digital Technology Coatema CondAlign Conductive Technologies Creative Materials Inc. Delo Eastman Kodak Company ELANTAS Europe GmbH Ercon Fuji Corporation Hamamatsu HighLine Technology Holst Centre Hummink ImageXpert INO, d.o.o., Žiri Integrated Graphene (iGii) Intellivation LLC Kimoto Linxens Nano-C NanoPrintek NGK Europe GmbH NovaCentrix OET Energy Technologies & Coatema Panacol Panasonic Electronic Materials Policrom Printed Electronics Limited Smartkem SparkNano SPGPrints Sun Chemical SunRay Scientific SUSS The University Of Manchester TracXon Voltera VTT XTPL ABeetle Corporation Agfa Ail Arian Alpha Precision Systems (APS) Arkema Beespenser BrightSpot Automation LLC Brilliant Matters CEA Chimet S.p.A Coveme Spa DoMicro BV droptical GmbH FOM Technologies Fraunhofer IAP Fraunhofer IFAM Grafisk Maskinfabrik A/S GraphEnergyTech IPVF Joanneum Research JP Kummer Semiconductor Technology GmbH National Research Council Canada Noctiluca Normandy Coating nsm Norbert Schläfli AG PINA CREATION Polytec GmbH PrintUp Institute PROFACTOR GmbH PROTEX INTERNATIONAL RK Siebdrucktechnik RISE ruhlamat Silicon Austria Labs GmbH Sofab Inks Inc. Solaveni Technic, Inc. THIEME Toray Research Center, Inc. VFP Ink Technologies 🚨Register before 12 September to save 200 Euro on top of early bird . This is a one-time offer. The coupon can be obtained here🚨

Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics.  This year the program features a world-class agenda with over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors.  In this article, we discuss and highlight various innovative talks at the event around the theme of  Additive and 3D Electronics Manufacturing Process Innovation.  In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. In previous articles we introduced other innovations in Additive and 3D electronics (see here ) and also key material related innovations which will be showcased at the show (see here ) Explore the  full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. Explore the Full Agenda and   Register  before 12 September 2025 for the best rates GE Aerospace – Felippe Pavinatto  presents additive electronics for aerospace applications in harsh environments . Examples include direct-write 3D printed passive RF sensors operating up to 1000 °C and fully additive embedded die packaging. Both demonstrate how additive methods enable non-planar, embedded devices beyond the limits of conventional semiconductor manufacturing. Mesoline – Thomas Russell  presents microchannel particle deposition (MPD) for MEMS and sensor applications . This wafer-scale technology enables micron-precision material deposition on 6- and 8-inch wafers. Demonstrated use cases include uniform low-power gas sensors, high-resolution glass frit bonding lines (~20 µm), and high-aspect-ratio hydrogen getters on CMOS wafers, advancing device miniaturization and performance. Prio Optics – Dr. Qihao Jin  presents inkjet-printed optical coatings for precision photonics . Functional inks are deposited with nanoscale accuracy to tune layer thickness, refractive index, and patterns for applications such as anti-reflective layers, spectral filters, and optical intensity control. Compared to vacuum deposition, the additive process reduces waste, accelerates prototyping, and scales from small to large-area optics for imaging, displays, sensors, and solar control. X-Fab – Tino Jaeger  presents micro-transfer printing for integrating ultra-thin ASICs . The technology enables precise, high-throughput transfer of free-standing chiplets from CMOS and III-V wafers onto flexible foils and other substrates. The talk covers CMOS post-processing flows, tether/anchor structures, and heterogeneous integration approaches, highlighting applications where ultra-thin chiplets unlock advanced functionality. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Enjet – Doyoung Byun  presents innovations in electrohydrodynamic (EHD) inkjet multi-nozzle printing . The talk outlines advances that overcome electrical crosstalk and interference, enabling stable, high-throughput jetting of viscous functional materials with micron precision. This scalable architecture positions EHD printing as a key technology for next-generation semiconductors, displays, and bioelectronics. Sonojet – Mehrzad Roudini  presents SAW-based aerosol printing for next-generation electronics . Using surface acoustic waves on piezoelectric chips, this solid-state, nozzle-free approach enables low-power, tunable droplet generation from submicron to tens of microns. Integrated with on-chip microfluidics, the compact printheads are clog-free, compatible with a wide range of inks, and offer precise, energy-efficient deposition for high-resolution, multi-material additive manufacturing. HighLine Technologies – Maximilian Pospischil  presents scalable deposition solutions from microextrusion to coating . The company’s high-speed dispensing achieves homogeneous fine lines below 20 µm at >500 mm/s, with expanded capabilities for cathode layer coating and other applications. Modular nozzle kits, multi-head systems, and AI-driven process optimization enable flexible, automated solutions for PV metallization and large-scale manufacturing. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Fraunhofer ILT – Adam El-Sarout  presents laser-controlled optimization of local conductivity in printed electronics . The approach uses selective laser sintering to correct printing-induced conductivity variations in thin silver layers, achieving resistance fluctuations below 1 Ω. This two-step process enhances the performance and reliability of digitally printed strain gage sensors, offering a cost-efficient alternative to conventional lithography. NanoPrintek – Masoud Mahjouri-Samani  presents inkless multimaterial printing directly from raw materials . This dry-printing process bypasses costly ink formulation and post-processing, generating pure nanoparticles in situ and sintering them with lasers onto diverse substrates. Capable of printing metals, semiconductors, insulators, and composites, the approach reduces cost, pollution, and supply-chain dependence while enabling hybrid, multifunctional structures for electronics, energy, healthcare, and aerospace applications. Akoneer – Tadas Kildušis  presents multilayer glass HDI PCBs enabled by laser processing . Glass substrates offer advantages for electronics and semiconductor packaging, and Akoneer demonstrates methods for creating high-density interconnections in multilayer glass PCBs using advanced laser technologies. Hamamatsu – Alexander Görk  presents laser processing for sustainable printed electronics . The talk highlights energy-efficient laser sintering, encapsulation, and soldering of NIR-absorbing materials, demonstrating how laser thermal processing supports greener materials and sustainable manufacturing through collaborations with material suppliers, institutes, and integrators. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Myrias Optics & University of Massachusetts Amherst – James Watkins  present printed metaoptics for AR/VR and photonics . Using additive nanoimprint lithography with nanoparticle inks, wafer-scale fabrication of inorganic metalenses, metasurfaces, and AR/VR waveguides is demonstrated, achieving >80% efficiency and excellent uniformity. The process enables high-index, stable, and low-cost optical devices, paving the way for scalable integration of metaoptics on glass and silicon platforms. Hummink – Elisa Duquet  presents High Precision Capillary Printing (HPCaP) for next-generation manufacturing . Inspired by AFM, HPCaP uses capillary forces and resonant micropipettes to achieve resolutions from 50 µm down to 100 nm without external energy input. Capable of depositing polymers, conductive inks, and biomaterials—including high-viscosity formulations—it enables high-aspect-ratio structures and fine interconnects for applications in semiconductor packaging, display repair, biosensors, and precision devices. Fuji Corporation – Ryojiro Tominaga  presents additively manufactured multilayer and stacked circuits with embedded components . Using inkjet-printed silver nano-inks on UV-curable resin substrates combined with ultra-low temperature SMT, Fuji demonstrates 3D encapsulated devices with novel geometries. This approach highlights the potential of additive manufacturing to transform electronic device design and production. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates

We cover these points by sharing short (1min or so) handpicked snippets from their live recent talks at TechBlick and MicroLED Connect conferences and exhibitions In this newsletter we cover the following MicroLED Wafer Metrology and Calibration Strategies Assessing the Practicality of MicroLED Displays for Mass Production Stamp-Based Imprinting for AR Waveguide Manufacturing Advances in Mass Transfer Processes for MicroLED Chip Integration VR vs. AR: Market Outlook and Growth Limitations Perovskite Quantum Dots for High-Density Color Conversion Challenges and Advances in Native Red MicroLED Efficiency Etching and Deposition Solutions for MicroLED Materials Progress Toward Emissive Quantum Dot–EL Displays Cubic GaN as a Novel Platform for Scalable MicroLEDs Wafer-to-Wafer Integration for MicroLED Microdisplays MicroLED Smart Glasses and Market Update for AR Applications Integrated Production Platforms for Scalable MicroLED Manufacturing Join the MicroLED Connect + AR/VR Connect 2025 on 24 & 25 Sept 2025 at the High Tech Campus in Eindhoven (Netherlands). Explore full agenda here and register before 12 Sept when the FINAL early bird rates expire   https://www.microledconnect.com/ https://www.microledconnect.com Manufacturing Processes & Integration Advances in Mass Transfer Processes for MicroLED Chip Integration Mass transfer remains one of the biggest hurdles for cost-effective microLED displays. At MicroLED-Connect 2024, Toray Engineering presented a new transfer method combining microLED chips with a panel-level package. Stamp-Based Imprinting for AR Waveguide Manufacturing Waveguides are key for AR devices, but must balance cost and performance. At Display Innovation Day (Dec 2024), SCIL presented its stamp-based system for waveguide imprinting as a scalable solution. Wafer-to-Wafer Integration for MicroLED Microdisplays Wafer-to-wafer processes are emerging as the path to mass production of microLED microdisplays. At MicroLED-Connect 2024, MICLEDI (imec spin-out) detailed its 300 mm CMOS integration flow and why wafer-level integration is critical. Integrated Production Platforms for Scalable MicroLED Manufacturing At MicroLED-Connect 2024, VueReal presented its platform for scalable microLED display production, addressing key challenges in cost, yield, and throughput.    Materials Innovations Challenges and Advances in Native Red MicroLED Efficiency Native red microLEDs remain a bottleneck for performance. At MicroLED-Connect 2024, UCSB’s Prof. DenBaars presented the latest advances in tunnel-junction technology and efficiency gains versus OLED benchmarks. Etching and Deposition Solutions for MicroLED Materials Oxford Instruments shared processing solutions for GaN and InGaAlP materials, including AlInGaP etching and ALD-based passivation. Perovskite Quantum Dots for High-Density Color Conversion CEA-Leti’s Prof. François Templier presented research on perovskite quantum dots achieving sub-micron densities for color conversion in microLED displays. Progress Toward Emissive Quantum Dot–EL Displays QNA Technology updated on progress towards QD-EL displays, sharing the latest status of emissive quantum dot research and scalability. Cubic GaN as a Novel Platform for Scalable MicroLEDs Kubos Semiconductors detailed its cubic GaN material system, showing how it can enable efficient, scalable microLED manufacturing. https://www.microledconnect.com Metrology, Testing & Inspection MicroLED Wafer Metrology and Calibration Strategies MicroLED displays remain at an early stage, making precise optical measurement and wafer inspection critical for success. In our Display Innovation Webinar (Dec 2024), Tobias Steinel (Instrument Systems) introduced PL and EL test strategies, and highlighted how calibration reduces errors and improves performance in mass production. https://www.microledconnect.com  Applications & Market Outlook Assessing the Practicality of MicroLED Displays for Mass Production Mikro Mesa presented key considerations around microLED driving, power consumption, and production readiness at MicroLED-Connect 2024. VR vs. AR: Market Outlook and Growth Limitations  Yole Group’s Raphaël Mermet-Lyaudoz explained why VR may face a growth ceiling while AR has stronger market potential. MicroLED Smart Glasses and Market Update for AR Applications Omdia provided a market update on microLED adoption in AR smart glasses, highlighting recent product launches with full-color microLED solutions.

#PerovskiteSolarCells #OLED #OrganicPV #PrintedElectronics #NanoInks #ElectronTransportLayer #FlexibleElectronics #Optoelectronics #RollToRoll #SmartMaterials #EnergyTech #SolarInnovation #DisplayTechnology #NextGenMaterials #SustainableElectronics Author:  Maryam Bari  & Ashwani Jain   PINA CREATION   Unlocking printable, low-temperature charge transport layers for next-generation optoelectronics   As next-generation optoelectronic technologies—such as  Perovskite solar cells (PSCs), OLED displays, and Organic photovoltaics (OPVs) —move from lab to large-scale manufacturing, the pressure is on to find materials that are  not only high-performing, but scalable, stable, and compatible with printed device architectures .   A critical bottleneck remains the  Electron Transport Layer (ETL)  and  Hole Transport Layer (HTL) . For technologies relying on delicate or flexible substrates, traditional materials such as Organic Semiconductors and traditional metal oxide inks pose serious limitations. High-temperature processing, moisture sensitivity, high cost, and limited lifetime all threaten the viability of commercial deployment.   At  PINA Creation , we’ve developed a line of  ready-to-use SnO₂, NiO and ZnO nano inks  that overcome these barriers and unlock practical, large-area fabrication for flexible and rigid optoelectronics. We are Exhibiting in Berlin. Visit our booth at the TechBlick Perovskite Connect  event co-located with the  Future of Electronics RESHAPED  on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend The ETL & HTL Processability The ETL & HTL are responsible for: Extracting electrons (ETL) and hole (HTL) from the photoactive layer Blocking either holes or electrons to prevent recombination Providing a stable interface with the electrode Traditionally, organic semiconductors such as PCBM or PEDOT:PSS has been used in organic and perovskite devices due to its low-temperature processability, but it comes with drawbacks: Short device lifetime due to degradation Expensive material cost Dependency on toxic organic solvents Incompatibility with scalable coating methods Traditional metal oxide inks such as TiO₂ , while effective, requires  >400°C annealing , eliminating its use in  flexible substrates  like PET or PEN.   Another example of the traditional materials is the solution-processed  SnO₂  inks (typically from sol-gel precursors like SnCl₂) often demand  complex multi-step processing, low performance,   and still show limited uniformity and reproducibility when printed at scale. PINA’s Nano Ink Advantage To address these limitations, PINA has developed  stable, printable dispersions of metal oxide nanoparticles , engineered specifically for  printed electronics and scalable photovoltaic manufacturing . PINA  SnO₂, ZnO, and NiO nano inks  are: Ready-to-use  ETL & HTL materials — no precursor conversion needed Alcohol-based or water-based , non-toxic formulations Solar Cell Efficiency Improvement: +20% increase  in efficiency compared to current ETLs, as reported by PINA customers.   Compatible with perovskites, PEDOT:PSS, P3HT, and common OLED stacks Cost-effective  – up to  50% less  than current alternatives Low-temperature processed (<150°C)  – enabling  compatibility with plastic substrates , -  lower energy consumption , and  reduced manufacturing costs Example:  Cutting annealing from  450°C to 150°C  reduces energy use by  ~70% , saving  $0.02–$0.05 per watt  of solar panel manufacturing cost. Shelf-stable  – with  12+ months  of shelf life, eliminating waste and supply disruptions Eco-friendly  – made with  water and alcohol , improving safety and reducing compliance costs Equipment-compatible  – works with  existing coating and printing lines   Impact:     Replacing current ETL/HTL materials with PINA’s inks can reduce material and processing costs by  up to 30% per watt . For example: For a high-growth flexible solar manufacturer with ~$200M in annual production, this translates to  $40–60M in recovered margin per year—a major competitive  advantage.   In addition to water-based formulations, PINA recently launched  alcohol-based SnO₂  nano inks represent a critical advancement for manufacturers working with moisture-sensitive materials such as perovskites or PEDOT:PSS. Traditional water-based inks often introduce interfacial degradation or layer instability, particularly in multi-layer printed devices. Alcohol-based inks, on the other hand, offer lower surface tension, faster drying, and greater compatibility with hydrophobic or organic layers, enabling defect-free film formation on flexible substrates. This makes them especially valuable in roll-to-roll printing environments, where consistent wetting and drying behavior is essential for yield and throughput. Beyond SnO₂, ZnO, and NiO, PINA is expanding its material platform to include TiO₂  and  ITO nano inks as transparent conductive layers — both tailored for low-temperature, printable electronics. These upcoming materials are being engineered with the same core principles: stability, scalability, and compatibility with next-generation device architectures. Technical Highlights Durability : PINA’s SnO₂ and ZnO films have passed IEC standard environmental stress tests:(85°C / 85% RH for 1000 hours) with  no performance degradation Energy Alignment : Suitable for both n-i-p and inverted p-i-n architectures Film Uniformity : Smooth, dense coatings reduce recombination losses, small surface roughness <5nm Mobility & Conductivity : Enables faster charge extraction and higher efficiency ZnO Film coated by Slot-Die Coater SAED Pattern (left) and TEM Image (right) Dynamic light scattering (DLS) analysis of PINA zinc oxide (ZnO) nanoparticles are uniformly dispersed in isopropanol with a narrow size distribution centered around ~7–8 nm.   Use Cases Across Devices Solar Cells Stable ETL and HTL for Perovskite Solar Cells stack Stable ETL and HTL   for Indoor & Outdoor Organic Photovoltaics (OPV) modules for IoT & smart sensors OLEDs Printable ETL and HTL layers for flexible and transparent display structures Compatible with hybrid organic-inorganic architectures Printed Sensors & Thin-Film Transistors (TFTs) High uniformity ETL or active layers for large-area printable electronics From Lab to Pilot to Production What sets PINA’s nano ink technology apart is its  scalability . We design every formulation with the production line in mind — from the  rheology and viscosity suited for precision coating , to the  ink stability required for batch manufacturing , to the  form factor flexibility  needed for integration into existing platforms.   Conclusion As Perovskite and OLED technologies edge closer to commercial viability, the materials used in their architecture must evolve.  Tin Oxide, Zinc Oxide, and NiO Nano Inks  represent a critical enabler — offering  stability, scalability, and performance  in one printable package.   Whether you're building the next high-efficiency solar module or pioneering flexible OLED displays,  PINA’s Nano Ink platform is ready to support your roadmap. For datasheets, compatibility trials, or free samples, visit:   www.pinacreation.com  or email us at  info@pinacreation.com We are Exhibiting in Berlin. Visit our booth at the TechBlick Perovskite Connect  event co-located with the  Future of Electronics RESHAPED  on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend Download Conference Handout https://www.techblick.com/perovskiteconnect

Authors: Alan Brown , Dr. Jay R Dorfman , Zac Hudson , Brandon Peters Contact: abrown@nagasechemtex.com , Nagase ChemteX America, LLC   In the rapidly evolving field of Printed Electronics, the demand for robust, durable, and highly stretchable conductive inks is paramount for advancing applications in wearable technology and hybrid electronics. While existing conductive inks offer some degree of stretchability, they often exhibit a trade-off between mechanical resilience and electrical performance, leading to a significant increase in resistivity under strain. This limitation poses a critical challenge for engineers designing products that require consistent electrical conductivity across a wide range of motion. Nagase ChemteX America, LLC. (NCU) has developed a next-generation conductive ink, CI-1096, that is formulated to address this gap by providing superior stretchability while maintaining excellent and stable electrical resistivity. Our work constitutes a novel material solution that enables the development of more reliable and versatile stretchable electronic devices, paving the way for future innovations in biomedical sensors, smart textiles, and flexible displays. Stretch Ink Wearable Electrode   NCU began this project with the goals of developing a Ag ink with increased stretchability, superior durability and high conductivity compared to CI-1036, an NCU Ag ink that has been on the market >10 years. This paper will document some of the challenges incurred during development in addition to sharing the data which supports CI-1096 meeting the development goals. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend   Development Challenges   As with any R&D product, developing the CI-1096 did present challenges. To meet the goals of maximum stretch/ crease properties, while optimizing both resistivity and cost, it was imperative to balance the Ag:Binder ratio to meet these goals. In Figure 1, below, the impact of Resistivity vs.% Stretch based on three different Ag: Binder Ratios is measured: Figure 1 demonstrates that A<B=C in terms of Resistivity vs. % Stretch, in particular, up to 20% stretch. While the samples made with Ag:B ratio C might have slightly lower resistivity than sample B, there is not enough of a difference to justify the cost impact of adding the Ag in sample C just to potentially get marginally lower resistivity. Crease performance was also optimized at Ag:Binder ratio B. This can be observed in Figure 2 which details Resistivity vs. # Creases. Figure 2 Creasibility was tested over various trace widths. CI-1096 on the narrowest trace width (0.381 mm) shows excellent creasibility. Comparing to CI-1036 With Level B being the optimized Ag:Binder ratio, CI-1096 was created, and further testing was completed to show that CI-1096 was superior to CI-1036. Comparing the two products, testing includes stretchability, durability and washability.   For stretchability both CI-1096 and CI-1036 were screen printed on a commercially available TPU substrate. The silver inks were cured for 8 minutes at 130°C. Figure 3 shows that CI-1096 can stretch to at least 60% prior to the trace breaking whereas the CI-1036 starts to exhibit open circuits at 46%. It should also be noted that as the circuits are stretched the rate of change in resistivity for CI-1096, is not as significant as CI-1036. Because CI-1096 is more consistent as stretched it enables a more robust circuit design. Figure 3 CI-1096 and CI-1036 printed on TPU and stretched to 60% (maximum stretch for test pattern). Again, CI-1096 exhibits excellent elongation. Additionally, CI-1096 was also assessed over five cycles. Figure 4 shows the stability of both stretch and hysteresis over five cycles, again a benefit to designing robust circuits. Samples were stretched to 20% elongation then returned to the original position. Figure 4 Cycle testing for CI-1096. CI-1096 stretched to 20% and returned to 0% over five cycles. As already stated, durability was another critical property where CI-1096 performs extremely well. While the CI-1036 is known and is used in applications where there can be multiple creases, it was discovered that as traces become narrower the CI-1096 well outperforms the CI-1036. This is seen in Figure 5 where the testing was done by printing both CI-1096 and CI-1036 on print treated polyester and cured for 8 minutes at 130°C. Figure 5 CI-1096, regardless of trace width, maintains excellent resistivity after 10 creases. Crease testing was performed in accordance with ASTM F2750. Finally, as some of the intended applications for using the CI-1096 are in the wearable/ stretchable realm, it was critical to also perform wash testing. Previous testing done by NCU with CI-1036 as the Ag circuit had proven that a tri-layer circuit construction of inks consisting of C/Ag/C (Figure 7) provided users with a garment that could be washed ~20 times. While the tri-layer did perform best, with CI-1096 being new development, a dual layer (Ag coated with C) was also included to compare to historical data. The conductive inks, including CI-1096, were printed and cured on TPU, according to what is stated on the TDS (8 minutes @ 130°C for CI-1096). After curing, the TPU film containing the tri-layer construction was then heat laminated to fabric. The samples were then placed in a Laundrometer washing temperature set to 30°C. Resistance was measured after every five wash cycles. Once again, samples constructed with CI-1096 outperform those constructed with CI-1036 and show that fifty wash cycles can be achieved! This can be seen in Figure 6: Figure 6 Compares washability of conductive ink stackups on two different TPU films. The combination of CI-2078/ CI-1096/ CI-2078 provides data that supports the conductive inks surviving fifty wash cycles.   Figure 7 Example of triple layer conductive circuit construction. Carbon is printed on TPU followed by Ag ink with a final layer of carbon ink. Summary In summary, NCU achieved the desired goal of developing a next-generation conductive ink. With superior stretchability, exceptional durability and excellent washability, CI-1096 is optimized for use in a diverse range of applications. Whether those applications are intended to print on PET or TPU the data supports CI-1096 being an excellent choice for any engineer. For more information please contact Alan Brown at abrown@nagasechemtex.com  or visit the Nagase ChemteX America website: www.nagasechemtex.com      We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin Contact us for your special discount coupon to attend

#PrintedElectronics #MedicalTechnology #FlexibleElectronics Author: Antti KEMPPAINEN | Email: antti.kemppainen@vtt.fi Bringing medical technology from innovation to patient care is slow and costly due to the complexity of the needed technologies and regulations. VTT’s pilot environment for medical devices, based on printed and flexible electronics and photonics technologies, accelerates the market entry of patient-friendly innovations. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend The medical device pilot enables the production of small and middle-size prototype series for pre-clinical studies using advanced flexible electronics, photonics, microelectronic, and microfluidic components and integration manufacturing technologies. These technologies facilitate the development of comfortable-to-wear, skin-like wearable sensors combined with wireless communication and data processing functionalities. Key application areas for the pilot line include preventive monitoring of cardiovascular diseases, metabolic syndromes, early cancer detection and recurrence, as well as rapid diagnostics. Our Key Infrastructure: State-of-the-art ISO7 cleanroom Flatbed automatic screen printer with 500 mm x 500mm and Flatbed Computer-to-Screen (CtS) screen exposure system, UV and IR belt oven Automatic component assembly line for large area flexible PCBs High-capacity 3D X-ray Microscopy, surface profilometers and material characterization capabilities Picosecond UV Laser for cutting, structuring, and drilling of flexible PCBs High precision press flat die cutter Advanced Sub-Micron Bonder for photonics packaging Photonics packaging capabilities Advanced testing and reliability capabilities for flexible electronics and photonics High-precision dispenser for bioreagents We are speaking in Berlin. Register to hear my presentation at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend VTT Provides R&D&I processes offering novel technologies: Prototype design and manufacturing Design Verification and Design for Manufacturing: Enhancing design processes to ensure manufacturability Increased readiness for the Medical Device Regulation development when applicable New Material Testing: Focusing on sustainable materials and manufacturing practices Printed and flexible electronics manufacturing – screen printing and component assembly. Photonics packaging. Fiber pigtailing process. Key users can be Medical device product companies and manufacturers Proof-of-concept development for health application Start-ups looking for proof of concept demonstrator   Get in touch At VTT, we can help you speed up your development process. Get in touch with us to discuss more: Antti Kemppainen Solution Sales Lead, Sensing Solutions + 358408205076 antti.kemppainen@vtt.fi Ralph Liedert Customer Account Lead + 358405230883 ralph.liedert@vtt.fi We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin Contact us for your special discount coupon to attend

Zachary Kelly, PhD . - Senior Research Scientist, Heraeus Electronics, Conshohocken, Pennsylvania Introduction Understanding PTC 4980 and Its Benefits Key Features of PTC 4980 Design Principles for PTC Heating Solutions Case Study: Improving Large-Format PTC Heater Performance 5.1 Initial Challenges Identified 5.2 Optimized Design and Manufacturing Process 5.3 Key Takeaways and Industry Implications Conclusion We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend This paper has been carefully compiled by Heraeus Electronics. Although the content is considered accurate, we cannot guarantee that this paper is suitable for any application. The descriptions and engineering data shown here have been compiled by Heraeus Electronics using commonly accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. 1. Introduction Printed electronics have revolutionized heating solutions across industries by enabling cost-effective, scalable, and customizable manufacturing processes. One of the critical advancements in this field is the use of Positive Temperature Coefficient (PTC) resistor pastes for self-regulating heaters. These materials offer inherent temperature control, reducing the need for external regulation mechanisms and ensuring safer, more energy-efficient heating solutions. Heraeus Electronics has developed PTC4980, a new family of carbon and polymer-based resistor pastes designed specifically for self-regulating heaters. With applications ranging from industrial heating to automotive and medical sectors, these pastes leverage a PTC effect to provide precise thermal management. This white paper explores the principles behind PTC heater inks, design methodologies, and the improvements in large-format printing enabled through collaboration between Heraeus Electronics and Boyd Corporation, preeminent experts in medium to high volume manufacturing for custom user interface and printed electronics. 2. Understanding PTC 4980 and Its Benefits PTC4980 is a specially engineered carbon-polymer paste formulated for applications requiring self-regulating heating. The paste exhibits a positive temperature coefficient of resistance (PTC), meaning that as temperature increases, the electrical resistance also rises. This property enables a self-limiting effect, preventing overheating and reducing the need for complex control circuitry. 3. Key Features of PTC 4980 Designed for operation in the 65°C - 90°C temperature range Blendable high and low resistance variants for tailored performance and tighter engineering tolerances in manufacturing Provides uniform heating across surfaces Scalable to large-format printing applications Reduces energy consumption due to self-regulating properties By leveraging these characteristics, industries can achieve more reliable, safer, and energy-efficient heating solutions tailored to their specific requirements. 4. Design Principles for PTC Heating Solutions Heraeus Electronics works closely with customers to help them optimize their PTC heater design based on specific requirements. To develop an effective PTC heater, a systematic design approach is followed. The process begins with defining the application’s requirements and then optimizing the PTC formulation and print layout for the best performance. Step 1: Define the Application Before designing a heater, it is crucial to determine: Target temperature: The target temperature required for the application Heating area: The surface area in contact with the heating elements Driving voltage: The operating voltage that will be applied Desired heating power: The power needed to achieve optimal performance Thermal load: The type and amount of material that will absorb heat for an application Step 2: Optimizing PTC Paste and Circuit Design This optimization process includes: a.) Blending High (H) and Low (L) Resistance PTC Pastes: Different heating applications require different resistance characteristics. By blending high and low resistance pastes, designers can fine-tune the heater’s resistance to combat the common problem of carbon conductivity drifts, ensuring precise temperature control. b.) Defining the Conductor Bus Bar and Cell Pattern: The arrangement of the heating elements significantly impacts performance. The design must consider: Width, length, and thickness of conductor bus bars Spacing and width of conductor fingers PTC resistors print thickness Number and arrangement of PTC resistor cells By configuring these parameters, a uniform heating profile can be achieved with minimal unwanted heat accumulation. 5. Case Study: Improving Large-Format PTC Heater Performance Heraeus Electronics collaborated with Boyd Corporation to enhance the design and manufacturing of large-format printed heaters. The initial customer prototype exhibited issues related to conductor bus bar heating, which led to overheating, non-uniform temperature distribution, and performance inconsistencies. 5.1 Initial Challenges Identified When the prototype was tested, thermal imaging indicated hotspots along the conductor bars well above the target temperature. To determine the cause, the PTC cells were first individually investigated. Microscopy and thickness measurements determined that the prints were excellent quality, and the thickness was highly consistent within the cell, from cell-to-cell and from print-to-print. Individual PTC cells were isolated for power testing and performed as expected with consistent regulating profiles. So, everything on an individual component level was working as expected. The root cause was found in the overall design. The conductor bus bars heated above the target temperature before the PTC units reached the target regulating temperature due to a mismatch in overall resistance values between the conductor bars and the PTC resistor cells. 5.2 Optimized Design and Manufacturing Process Through mathematical modeling, testing, and design improvements, the following modifications were made: a.) Model: Calculate the required resistance difference between the conductor trace and the PTC trace to mitigate Joule heating in the conductor bus bars. b.) Increase Bus Bar Width/Thickness: By increasing the conductor cross-sectional volume along the trace, it reduces the overall resistance of the conductor trace. c.) Increase PTC trace resistance: The new design ensured that each sub-unit within the heater had the right dimensions to resistance match the conductor with the given input voltage requirements. d.) The improved prototype demonstrated significant enhancements in performance with: Reduced unwanted heating at the conductor bars More uniform heat distribution Improved efficiency and reliability 5. Case Study: Improving Large-Format PTC Heater Performance 5.3 Key Takeaways and Industry Implications The collaboration between Heraeus Electronics and Boyd Corporation highlights the importance of precision design in PTC heater manufacturing. The key insights from this research include: Heater design plays a crucial role in PTC performance: Proper selection of resistance values, conductor patterns, and material thickness ensures efficiency. Avoiding unwanted bus bar heating: High resistance in unintended areas can lead to undesired heating and performance issues. Optimizing conductor layouts prevents this problem. High-volume manufacturing requires robust material formulations: Heraeus Electronics’ PTC resistor pastes are designed to be compatible with large-scale production, enabling cost-effective and high-quality manufacturing. Customization is key: Different applications require different resistance values and power configurations. Heraeus Electronics and Boyd Corporation offer tailored solutions to meet specific industry needs. 6. Conclusion The development of PTC 4980 self-regulating heater inks represents a significant advancement in printed electronics. By providing a scalable, energy-efficient, and safe heating solution, these materials are unlocking new possibilities across industries. This collaboration between Heraeus Electronics and Boyd Corporation has demonstrated the importance of optimizing material formulations and design parameters to achieve superior performance in largeformat printing. As demand for smart heating solutions continues to grow, innovations in PTC resistor pastes will play a vital role in enabling high-performance, cost-effective, and sustainable heating applications. Heraeus Electronics remains committed to advancing the field through continuous research, material development, and collaboration with industry leaders. About Heraeus Electronics Heraeus Electronics is one of the leading manufacturers of materials for packaging technology in the electronics industry. The operating company develops sophisticated material solutions for the automotive industry, power electronics, and advanced packaging in development centers and production facilities in Asia, the USA, and Europe. As a solution provider, Heraeus Electronics offers its customers a broad product portfolio - from materials and material systems to components and services. For more information and product details please visit heraeus-electronics.com The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application. The Heraeus logo and Heraeus are trademarks or registered trademarks of Heraeus Holding GmbH or its affiliates. All rights reserved. Contact Us: Americas Phone +1 610 825 6050 electronics.americas@heraeus.com Asia Pacific Phone +65 6571 7649 electronics.apac@heraeus.com China Phone +86 53 5815 9601 electronics.china@heraeus.com Europe, Middle East and Africa Phone +49 6181 35 4370 electronics.emea@heraeus.com We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin Contact us for your special discount coupon to attend

Authors: Julien Vitiello, Elisa Duquet, Louis Caillard, Achille Guitton, Marc Pascual, Maroua Ben Haddada, Frederic Raynal, Amin M’barki Corresponding author: julien.vitiello@hummink.com Hummink S.A.S, 5 rue Charlot, 75003 Paris, France Keywords: Display repair, additive manufacturing, High Precision Capillary Printing (HPCaP), capillary forces, Atomic Force Microscopy (AFM) Abstract In the field of display repair, particularly for OLED and microLED technologies, there is a growing need for precise and scalable solutions to restore high-resolution defects without compromising performance. While several repair methods exist, they often fall short in resolution, versatility, or ease of integration. High Precision Capillary Printing (HPCaP) overcomes these limitations by leveraging capillary forces and mechanical resonance to deposit inks with micron and sub-micron precision, enabling accurate, reliable, and non-destructive repair of critical display components. 1. Introduction According to MarketsandMarkets the global display market size is expected to reach around USD 174 billion in 2029 growing at a CAGR of 5.1% from 2024 to 2029. The increased demand for displays in various industries especially the IT and healthcare industries, and the increased demand of interactive displays such as wearable devices, AR/VR products in addition to the adoption of flexible displays are the major factors driving this market growth. We are Exhibiting! Visit our booth at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025 MicroLED production processes for displays face significant challenges, as many screens are rendered defective. These defects often manifest as non-functioning black pixels or pixels displaying incorrect colors, typically caused by faulty LEDs or malfunctioning circuit boards. Despite meticulous manufacturing practices, such errors are nearly inevitable, resulting in rejected displays that hinder productivity, increasing cost and waste. The defects in these displays are increasingly microscopic, often below 5 micrometers, making traditional repair methods insufficient. LED defects can also vary widely, from line breaks and particle contamination to pixel malfunctions, requiring versatile and precise repair solutions. HPCaP (High Precision Capillary Printing) by Hummink is currently the only technology capable of printing at micron and submicron scales and thus repairing micronic defects. We are Speaking! Register to hear my presentation at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025 2. High Precision Capillary Printing (HPCaP) HPCaP is a technology strongly inspired by Atomic Force Microscopy (AFM) [1].It uses a macroscopic resonator as a detecting mechanism for contact and printing feedback. The uniqueness of this technology resides in its usage of capillary forces and resonance as the only driving force for printing. A macroresonator oscillating at a resonance frequency of about 1 kHz is attached to a mechanical bridge. The oscillation is generated by a piezodither that excites the macroresonator. The bridge, driven by a piezostage, allows the resonator to move with a 5 nm precision in Z axis. State-of-the- art electronics are used to control the resonance of the macroresonator through 3 different parameters: the resonance phase, amplitude, and frequency. Any shift in these values can be controlled to achieve different printing features, indirectly modifying the print geometry (thickness, line width...). Amplitude can be adjusted between 5 nm and 100 nm, and any frequency shift of 100 mHz or more can be accurately detected. A pipette is attached to the extremity of the macroresonator and oscillates in phase with the latter. Fig. 1 a) Schematic representation of the macroresonator (right) and a close-up on the glass pipette in contact with a substrate. b) Graphical representation of the underlying control loop in HPCaP technology Since the dispensed volume is in the nanoliter range (orders of magnitude lower than the pipette volume), a single pipette can print up to hundreds of kilometers, depending on the dispensing diameter. Fig.1,(a) shows that the first step of the HPCaP printing process is to approach the pipette to the substrate surface. As the macroresonator is oscillating at its proper resonance frequency, a slight change of a few hundreds of mHz can be observed as in figure 1, (b) once a meniscus is formed between the ink inside the pipette and the substrate. This meniscus is stabilized by the macroresonator’s oscillation, and the frequency shift is then locked by the electronic feedback loop. After this initial step, capillary printing can be achieved by moving the substrate in the XY axis. As the frequency shift value must remain constant, the Z-fine bridge will move the resonator in the Z direction to perfectly follow the topography of the substrate. Fig. 2 presents the results of high-precision printing using a pipette with a 1.5 µm diameter. (a) displays a cross-section from a 3D map revealing a printed silver line with a thickness of 100 nm achieved in a single pass. (b) shows a 3D topographic map acquired with a Hitachi TM4000PlusII SEM. (c) is an SEM image of the printed pattern, consisting of three silver lines with a linewidth of 2.5 µm and a gap of 1.5 µm. These lines exhibit a bulk conductivity of 6 µΩ·cm. Thanks to the versatility of the ink formulation, HPCaP enables the printing of virtually any material. Fig.3 shows polymer (Polyvinylpyrrolidone) lines with a linewidth of 430±40 nm and a pitch of 1±0.05 µm. Similar sub-micronic gratings were printed with SU8 to create a distributed feedback laser [2]. Fig. 2 a) Cross-section of the 3D map showing a line of 100 nm thickness by a single printing pass b) 3D map acquired with the SEM (Hitachi TM4000PlusII). c) SEM image of the same lines of 2.5 µm line width and 1.5 µm gap. Fig. 3 SEM image of printed Polyvinylpyrrolidone (PVP) lines (dark horizontal lines) at the sub- micron scale, with a gap of 1 micron (light gray horizontal lines) 3. Results In this section, we showcase the key outcomes and repair capabilities of Hummink’s HPCaP technology in the context of display repair. The HPCaP printhead addresses a critical industry challenge: repairing high-resolution defects that conventional tools cannot handle, ultimately boosting production yield and salvaging previously discarded panels. In fig 4 we highlight a typical process that is used for display repair. As seen in this schematic, HPCaP technology can be used in tandem with laser etching to deposit conductive lines as well as encapsulating polymers. To achieve this, several capabilities must be demonstrated by HPCaP technology: micrometric resolution and precision for defect correction. Substrate versatility and automatic adaptation to substrate topography. Diverse material compatibility. Fig. 4. Display repair process for top and buried conductive lines. Laser etching is initially used to remove defective lines (top and buried). Printing techniques such as HPCaP is used to print new conductive lines and fill cavities with polymer. 3.1. Micrometric Resolution for Defect Correction Achieving micron and even sub-micron resolution is essential for the repair of fine-line defects in MicroLED displays. As shown in figure 2 and 3, HPCaP enables material deposition at nanometric precision, allowing seamless restoration of damaged conductive paths or pixels without degrading the display’s visual or electrical performance. This ultra-fine control ensures that repaired traces maintain the original geometry and conductivity, which is crucial for optical consistency across the screen. 3.2. Substrate versatility and automatic adaptation to substrate topography Substrates to be repaired are typically already patterned and can be a combination of different materials with topology variation. An advantage of HPCaP is that printing can be done on any substrate following its topography completely automatically. HPCaP has successfully printed on surfaces with topographies, fig.5 shows a silver trace of line width 10 µm printed on wet-etched silicon wafer with a step of 100 µm and a slope angle of 54.7°. To climb the step, the printing speed was decreased from 200 µm/s on flat wafers to 25 µm/s on the slope part. HPCaP functions like an AFM, enabling automatic printing on diverse topographies without the need for additional commands in the g-code. Advanced electronics in the printing process continuously gather feedback from the substrate, adjusting the pipette's z-axis movement to match its topography and facilitate precise printing accordingly. Fig. 5. On the right is a SEM image of a silver trace printed on a wet- etched silicon wafer with a step of 100 µm and a slope of 54.7° angle as illustrated on the left of the figure 3.3. Diverse material compatibility Being able to print different inks on the same substrate is crucial for display repair. This versatility can be leveraged to be able to deposit conductive lines as well as encapsulating polymers with the same technology. The strength of capillary forces allows HPCaP to print inks with viscosity ranging between 0 to 100,000 cP. With minimal adjustments in rheological, capillary, and colloidal properties, any ink can be printed. In fig.6, we demonstrate the ability to print conductive silver lines of 2 µm linewidth and 2 µm pitch on a silicon wafer and coat these traces with a polymer (PVP). Such encapsulation is often required to prevent electrical shorts and oxidation of the metallic traces. The same ink can also be used to fill cavities and can be printed on with conductive ink after reticulation. Fig. 6. SEM image showing conductive line encapsulated using a polymer SU8. Both materials were deposited using HPCaP technology. 3.4. Display repair HPCaP has successfully printed conductive lines on multimaterial patterned substrates to repair defective conductive lines. No damage has been observed on underlying TFT devices 4. Conclusion As MicroLED technology advances, defects in displays are becoming smaller and more diverse, increasing the need for precise, scalable, and reliable repair solutions. HPCaP’s innovative printing technology offers a transformative approach to repairing LED displays, ensuring minimal waste and optimal production efficiency. Hummink is also currently working to expand this sustainable strategy to other industries, such as semiconductor packaging. 5. References [1] Canale, L., Laborieux, A., Mogane, A. A., Jubin, L., Comtet, J., Lainé, A., Bocquet,L., Siria, A., & Niguès, A. (2018).Micromegascope.Nanotechnology, 29(35),355501. https://doi.org/ 10.1088/1361-6528/aacbad [2] Pascual, M., Bigan, N., M’Barki, A., Mental, R.,Allegro, I., & Lemmer, U. (2023). All-printed SU8- perovskite DFB Laser. Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVI. https://doi.org/10.1117/12.2661336 What to expect at the MicroLED Connect & AR/VR Connect event in Eindhoven on 24-25 September 2025?

A decimal counter is a digital circuit that cycles through zero to nine using logic components. It is essential in clocks and timers. Making a decimal counter using seven-segment displays offers great opportunities for students to learn sequential logic, clock signals, and circuit integration. Materials used Voltera V-One PCB printer Voltera disposable nozzles Linear voltage regulator Switching voltage regulator NE555DR timer Variable resistor  Seven-segment displays   We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend Purpose The goal of this project was to demonstrate PCB development through key concepts:  Linear and switching regulators Variable resistors Seven-segment displays Prototyping techniques Conductive trace printing Component placement Solder reflow Project overview Design The original PCB layouts were provided by ITIZ , Voltera’s authorized reseller in Korea. We modified the design to create an integrated circuit system, which was comprised of three interconnected PCBs: Voltage regulator board Pulse generator board Decimal counter board ITIZ design of the boards Desired outcome When connected to a 7V–12V DC source, the system should function as follows:  The voltage regulator board converts the input to a steady 5V output. The pulse generator board uses this 5V supply to create adjustable pulse signals. The decimal counter board drives two seven-segment displays to count from 00 to 99 at a speed controlled by the pulse generator. Functionality When powered by a 9V battery, the circuit successfully counted from 0 to 99 at an adjustable speed. A reset button allowed restarting the sequence, and the integration of both a linear regulator (78M05) and switching regulator (LM2575) on the same board provided a practical way to compare their efficiency, thermal behavior, and noise generation. Printing the boards on V-One Voltage regulator board This board converts a 9V input into a steady 5V output. It includes the following components: Table 1 Voltage regulator board design Voltage regulators  maintain a stable output voltage regardless of fluctuations in input voltage or load conditions. They play a critical role in circuit stability by preventing voltage spikes or drops that could damage components. In this circuit, we included two different types of regulators for ease of comparison.  The 78M05 linear regulator (U1) dissipates excess energy as heat, providing a stable 5V output at lower efficiency. In contrast, the LM2575 switching regulator (U2) achieves higher efficiency by rapidly switching an internal transistor to store energy in an inductor (L1) and capacitor (C6), though this can introduce noise into the circuit due to rapid switching.  Table 2 V-One print settings for all three boards V-One probing the voltage regulator board Pulse generator board This board uses a 555 timer IC (NE555) to generate adjustable pulse signals that drive the decimal counter board. It includes the following components: Table 3 Pulse generator board design The NE555 timer  (U1) is a versatile and widely-used integrated circuit (IC) that can generate stable time delays or oscillations, depending on the external components configured around it. On this board, it operates in astable mode  to generate continuous pulse signals. The variable resistor (R3) functions as a potentiometer  in this circuit, altering the charging and discharging time of capacitor C1. This adjusts the pulse frequency, which controls the counting speed of the seven-segment displays on the decimal counter board. The green LED (D1) blinks in sync with the output pulses. Table 4 V-One dispensing silver ink on pulse generator board Decimal counter board This board drives two seven-segment displays to count from 00 to 99, with adjustable speed (by the pulse generator board) and a reset function. It includes the following components: Table 5 Decimal counter board design A seven-segment display  consists of seven individual LEDs arranged to form the shape of the number 8. By turning specific segments on or off, the display can represent any numeral between 0 and 9.  In this circuit, the 74LS93 counters (U1, U2) process incoming pulses into binary-coded decimal  (BCD) outputs. The 74LS47 decoders (U3, U4) convert BCD signals into segment activation patterns for the seven-segment displays (FND1, FND2). A manual reset button (SW1) allows restarting the count. Table 6 V-One dispensing silver ink on decimal counter board Post-processing Populating and reflow After all three circuits were cured, we dispensed solder paste using V-One and carefully populated the components using a pair of tweezers. The solder paste was then reflowed on V-One’s heated bed. Table 7 V-One dispense settings for solder paste V-One dispensing solder paste on decimal counter board Connecting the boards The three boards were linked using JST-SM connectors and wires. We connected the voltage regulator board to a battery and the pulse generator. We then connected the pulse generator outputs to the decimal counter’s clock input pins. The connected boards Printing enclosures To protect the circuits from any impact during handling, we designed and 3D printed three enclosures using PLA filament. 3D printed enclosures for the boards Challenges and advice  Troubleshooting interconnected circuits Errors in interconnected systems could originate from any board, which made troubleshooting a bit more complex than a single board. To streamline the process, we recommend checking component polarity and orientation before populating the components, and reference their datasheets when necessary. Additionally, it’s helpful to check for continuity with a multimeter, or with an oscilloscope to calculate and view the frequency of the pulses. Conclusion This project highlights the potential of additive PCB prototyping in electronics education. By combining theory and practice, students can explore how digital counting systems function, understand the role of BCD-to-seven-segment conversion, and observe how timing signals interact with display components. Direct ink writing platforms like V-One empower the next generation of engineers to innovate beyond breadboards and rapidly iterate on electronics designs.  If you are interested in exploring other PCB prototyping projects we have completed, take a look at: Printing a Control Board for a Line Following Robot with Silver Ink on FR1 Printing a Flexible PCB with Silver Ink on PET Dispensing Solder Paste on Factory Fabricated PCBs Want to be notified when we post new white papers? Sign up for our newsletter . We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin Contact us for your special discount coupon to attend

In the fast-paced world of advanced manufacturing, precision, speed, and reliability are non-negotiable. Enter the Intlvac Icarus Indium Solder Bump Deposition System—a game-changing solution designed to meet the rigorous demands of high-volume production. With over 30 years of expertise in system manufacturing and coating services, Intlvac has engineered a system that delivers exceptional performance, minimal maintenance, and rapid turnaround times. A solder bump is a small, raised deposit of indium solder that is typically applied to the surface of a microelectronic device. Solder bumps are commonly used in semiconductor packaging and flip-chip bonding processes, microprocessors, integrated circuits, and other electronic components. They provide an efficient and reliable method for connecting chips to substrates, allowing for high-performance and compact devices. We are Exhibiting! Visit our booth at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025   Why Indium Bumps? Indium bumps are essential for advanced applications due to their unique properties. They enable higher packing density and increased device speeds, making them ideal for flip-chip bonding in pixel readout applications. Additionally, indium offers strong mechanical properties and superconductivity at temperatures below 3.4K, ensuring reliable performance in demanding environments. Its role as an under-bump diffusion barrier further enhances device performance by preventing material intermixing and maintaining structural integrity. More than 10 years of research have advanced our technology, allowing us to produce higher-quality bumps High-Throughput Production with Unmatched Precision The Icarus system is optimized for efficiency, completing 200 mm diameter wafers in under 90 minutes. Its proprietary technology ensures precise control over film thickness, supporting bump heights ranging from 1 to 40 microns. This makes it ideal for applications in microelectronics, microLEDs, flip-chip bonding, and optoelectronics—industries where precision is paramount. The system’s capacity for hundreds of depositions without opening the main chamber significantly reduces downtime. When indium refills are required, the process is streamlined, taking only minutes to exchange the empty crucible with a pre-charged one. Intlvac Technology. Icarus is suitable for both square and round bump arrays, exhibiting consistent fill with exceptional uniformity. Tackling Dendritic Growth for Superior Performance One of the standout features of the Icarus system is its ability to suppress dendritic growth, a common challenge in indium deposition. Dendritic growth, characterized by uneven spikes that compromise mechanical and electrical performance, is effectively controlled through elevated deposition rates and low deposition temperatures. The result? High-quality indium films with: Spit-free deposition up to 70 Å/s <5% uniformity variation across 200 mm wafers Advanced thermal bonding for precise temperature control (+60°C to -75°C) Superior lift-off yields and consistent bump arrays Competitors' outdated technology struggled to suppress dendritic growth, leading to poor bump uniformity and compromised mechanical and electrical performance. The Intlvac Icarus system effectively addresses and eliminates these challenges. Optimized for Uniformity and Fill Achieving uniform coating and optimal hole filling is no small feat, but the Icarus system excels here too. By aligning deposition flux perpendicularly to the substrate, it prevents hole closure and ensures consistent results across both square and round bump arrays. This precision allows for up to 200 depositions of 2μm films without requiring access to the main chamber. Deposition uniformity of ±5% over 200mm wafer without substrate rotation Ultra-High Purity Indium for Next-Level Applications Intlvac takes purity seriously. Starting with 5N (99.999%) grade indium, the company performs additional purification steps under vacuum to eliminate residual impurities. The result is an oxide-free, ultra-pure indium film that meets the stringent demands of industries like quantum computing, optoelectronics, and microelectronics. Indium’s unique properties, such as its low melting point (156.6°C), high thermal conductivity, and compatibility with complex crystal structures, make it an ideal material for forming reliable electrical contacts in semiconductor devices. Its ductility and thermal stability further enhance its suitability for applications requiring efficient heat dissipation and low processing temperatures. Comparison of low-rate (left) and high-rate (right) indium deposition. Advanced Features for Seamless Operation The Icarus system is packed with features that enhance its performance and usability: Automatic Load-Lock:  Transfers and pre-conditions wafers up to 200 mm, removing contaminants and water vapor without physical etching. Cryogenic Temperature Control:  Films are grown at temperatures as low as -90°C, enhancing shear strength and adhesion while preventing lateral atom migration. Dry Substrate Bonding:  A Drichuck pad ensures efficient heat transfer and substrate cooling, maintaining optimal wafer temperatures for superior deposition quality. Physical Vapor Deposition (PVD ): Compared to electroplating, PVD offers superior adhesion, uniformity, and density, with precise control over coating thickness and minimal environmental impact on film properties.     Redefining High-Volume Bump Fabrication With its combination of ultra-high-purity indium, precise thermal control, and industry-leading uniformity, the Icarus system sets a new standard in high-volume bump fabrication. Whether you're manufacturing  microLEDs , optoelectronics , or quantum devices , this system delivers consistent, repeatable performance with minimal maintenance and rapid turnaround times. In a world where production schedules are tighter than ever, the Intlvac Icarus Indium Solder Bump Deposition System empowers manufacturers to stay ahead—without compromising on quality or reliability. What to expect at the MicroLED Connect & AR/VR Connect event in Eindhoven on 24-25 September 2025?

Perovskite Connect conference and exhibition | 22 & 23 OCT 2025, ECC, Berlin | Co-located with the Future of Electronics RESHAPED Berlin 2025 Perovskite Connect 2025   is shaping up to be the must-attend event for the perovskite industry , bringing together leading innovators, researchers, and manufacturers from across the globe. Taking place on 22–23 October 2025  at the ECC in Berlin , this specialist conference will run alongside the flagship   Future of Electronics RESHAPED  show. This article highlights some of the key talks that will take place during this conference.  Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Oxford PV – Edward Crossland  presents the world’s first commercial perovskite-silicon tandem module . Breaking silicon’s efficiency limits, tandem technology delivers higher performance with minimal changes to existing production lines. The talk highlights Oxford PV’s milestone 2024 shipment, recent advances, and solutions for durability, scalability, and environmental compliance, demonstrating readiness for large-scale deployment. Hangzhou Microquanta Semiconductor – Yang Chen  discusses the commercial readiness of perovskite PV . Drawing on lessons from industrial validation and field deployment, the talk addresses solutions to challenges in stability, efficiency, and scalable manufacturing. Insights into certification and real-world testing show how perovskite PV is evolving into a commercially viable alternative to silicon. Swift Solar – Maximilian Hoerantner  presents advancing perovskite-silicon tandem PV from lab to fab . The talk focuses on achieving high efficiency and stability while scaling manufacturing processes to wafer level. Topics include device stack optimization, reliability testing under light and thermal stress, and development of high-throughput production methods to make tandem PV commercially viable. Solar and Renewable Industry Leader – Gunter Erfurt  explores the future of European and U.S. solar manufacturing . With global competition challenged by Chinese overcapacity, the talk emphasizes the importance of industrial policy, mass production capability, and innovation-driven ecosystems to secure resilient, competitive solar industries in Europe and the U.S. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates University of Rome Tor Vergata – Luigi Vesce  presents scalable, ambient-air processing of printed perovskite PV modules . Using blade, slot-die, and screen printing for all functional layers, the process integrates low-temperature carbon electrodes and interfacial passivation to boost stability and efficiency. Modules achieve T₈₀ lifetimes >1000 h at MPP under ambient-air fabrication, demonstrating a sustainable, fully printed pathway to industrial perovskite photovoltaics. CubicPV – Adam Lorenz  presents durable perovskite-silicon tandems with scalable architecture and manufacturing . Cubic’s decoupled tandem design maximizes performance, durability, and cost efficiency with simplified manufacturing. Accelerated aging tests—including light + heat at up to 105 °C—validate stability and field readiness. Recent results include NREL-certified ~22% perovskite top cells and tandem efficiencies approaching 30%. Solaires Entreprises – Sahar Sam  discusses scaling perovskite PV modules from lab to fab . Drawing on pilot-scale slot-die and blade coating efforts, the talk addresses coating optimization, interface challenges, and process integration for large-area modules. Lessons from pre-commercial validation highlight technical barriers and the collaborative strategies needed to achieve reliable, scalable manufacturing. Institut Photovoltaïque d’Île-de-France (IPVF) – Nicolas VANDAMME  presents the IPVF pilot line for perovskite solar cells and modules . Opening in 2025, this Paris-Saclay facility provides lab-to-fab manufacturing, testing, and qualification of perovskite devices across substrates, encapsulants, and precursors. Supported by leading industrial and academic partners, the platform accelerates development and industrialization of next-generation PV technologies Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Sofab Inks – Blake Martin  presents novel materials for scalable perovskite solar panel production . The talk explores soluble-process materials that balance high performance with manufacturability, addressing key bottlenecks in scaling perovskite PV from lab to industrial production. Karlsruhe Institute of Technology – Norbert Willenbacher  discusses low-temperature metallization and interconnection materials for perovskite cells with reduced silver use . Leveraging the capillary suspension concept, printable pastes achieve high conductivity with low filler content. Concepts such as TECC wires and thermoplastic busbars demonstrate resource-efficient, low-temperature interconnection methods to support sustainable PV manufacturing. Nano-C – Henning Richter  presents innovative interface materials for perovskite photovoltaics . Building on fullerene chemistry, Nano-C has developed new electron-transporting materials with functional groups for passivation, adhesion, and stability. These tailored molecules optimize band alignment, prevent delamination, and are being scaled for industrial deployment in both single-junction and tandem perovskite devices. DELO Industrial Adhesives – Sebastian Stasch  presents advanced adhesives for protecting perovskite solar cells . High-barrier encapsulants form durable, flexible seals against moisture, extending lifetime and efficiency. Leveraging experience from organic PV, DELO introduces new adhesive solutions engineered to meet the unique stability and performance challenges of perovskite technology. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Halocell Energy – Tom Fontaine  presents roll-to-roll flexible perovskite solar modules . A scalable printing process delivers lightweight, high power density modules optimized for low-light and IoT applications. The talk addresses key challenges in large-scale deposition and material efficiency for long-lifetime flexible PV. TNO | Solliance – Anuja Vijayan  discusses roll-to-roll slot-die coating for scalable, stable perovskite PV . Using green solvents and ambient processing, R2R-coated polymer substrates achieved PCEs up to 13%, with metal foil devices exceeding 15% and stability beyond 3000 h at 85–100 °C. The work demonstrates strong reproducibility and modular fabrication potential for large-scale production. Heliatek – Martin Hermenau  presents commercial lightweight flexible PV modules . Heliatek introduces the first IEC 61215-certified OPV module and outlines integration of perovskite stacks into existing R2R pilot lines. The talk highlights lessons from vacuum multilayer deposition and encapsulation technologies for scaling flexible perovskite PV. OET Energy Technologies / Coatema  present scaling printed photovoltaics from 3rd-gen innovation to Giga Fab industrialization . The Flex2Energy initiative establishes the first Giga Fab for automated OPV/PPV production, integrating R2R printing, in-line metrology, AI-driven analytics, and Industry 4.0 frameworks. Applications include building-, vehicle-, and agriculture-integrated PVs, positioning printed photovoltaics at the forefront of the clean energy transition. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Caelux Corporation – Scott Graybeal  presents high-density solar to meet future energy needs . With U.S. power demand surging from AI and electrification, Caelux highlights how higher energy density modules improve project economics by reducing land use, installation costs, and exposure to interest rate volatility. These advanced modules can retrofit legacy systems or integrate with next-gen technologies to deliver more cost-effective solar power. CEA – Noella Lemaitre  presents challenges for upscaling perovskite/silicon tandem solar cells . While small-area 2T tandems have reached record efficiencies of 34.9%, scaling to industrially relevant sizes requires advances in interface layers, perovskite deposition on textured silicon, low-temperature screen printing, and long-term stability of encapsulated devices. The talk highlights pathways from lab-scale PCE >30% devices toward manufacturable, durable tandem modules. Panacol – Lena Reinke  discusses advanced bonding technologies for flexible electronics . Specialized adhesives provide robust encapsulation against moisture, oxygen, and stress while conductive formulations replace soldering, ensuring reliable electrical interconnections. These adhesive solutions enhance durability and performance in flexible devices such as photovoltaics, batteries, and sensors. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates AeroSolar – Joe Briscoe  presents aerosol treatment for scalable perovskite solar cells . Using a solvent- or additive-based aerosol CVD process, post-deposition recrystallization improves nanoscale and macroscale film uniformity, reducing defects and trap states. The method enhances efficiency, stability, and manufacturing yield, offering a scalable route to large-area, commercially viable perovskite modules. SparkNano  - Alexander Bouman presents spatial ALD for scalable perovskite solar manufacturing . By decoupling precursor exposures, roll-to-roll s-ALD achieves deposition rates >100× faster than conventional ALD, with web speeds up to 80 m/min and widths of 1.5 m at 50–150 °C. The talk highlights scalable SnO₂ electron transport layer deposition and how the Omega system delivers throughput, uniformity, and substrate compatibility essential for gigawatt-scale PSC production. SALD B.V. – Hindrik de Vries  presents a paradigm shift in roll-to-roll spatial ALD for perovskite solar cells . A novel R2R s-ALD tool achieves web speeds 100× faster than conventional ALD while maintaining atomic-scale thickness control and conformality. Demonstrated applications include passivation, charge transport, and high-performance barrier layers, enabling scalable, high-quality thin films for perovskite photovoltaics. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates SOLRA-PV – Yousef Farraj  presents industrialization of perovskite-based indoor photovoltaics . Optimized device stacks for artificial light, combined with scalable printing and advanced encapsulation, deliver efficient, stable modules tailored for IoT and consumer electronics. These indoor PV panels enable battery-free operation, advancing sustainable electronics and reducing e-waste. P3C Technology and Solutions Pvt – Sooraj Kumar  presents scaling perovskite solar module technology in India . Through parallel platforms—rigid MySUN Glass  and flexible MySUN Flexible —P3C is advancing from lab-scale results to real-world field deployments across EVs, railways, and aerospace. The talk covers performance benchmarks, environmental stability, encapsulation strategies, and a commercialization roadmap for mass production and market adoption in India’s growing PV ecosystem. Perovskia Solar – Anand Verma  presents digitally printed perovskite PV for IoT and consumer electronics . Custom-designed cells operate efficiently under indoor and outdoor light, enabling battery-free or battery-extended smart devices such as sensors, wearables, and electronic shelf labels. With Swiss-based industrial production scaling to one million units annually, Perovskia highlights its scalable processes and integration-ready solutions. Explore the Full Agenda  and   Register  before 12 September 2025 for the best rates Perovskite Connect talks are a part of the  full conference agenda

Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics.  This year the program features a world-class agenda with over over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors.  In this article, we discuss and highlight various innovative talks at the event around the theme of Material, Ink and Paste Innovations. In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. Explore the full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable.  Heraeus Electronics – Ryan Banfield  presents bridging additive and subtractive technologies through solderable polymer thick films. The talk highlights advances in polymer thick-film conductors that overcome long-standing barriers of poor solderability and thermal stability. This breakthrough enables flexible, low-cost circuits while reducing reliance on environmentally intensive subtractive manufacturing processes. Blackleaf – Michael Friess  presents graphene-based electric heating inks for next-generation surface heating. Using sustainable graphene production and tailored formulations, Lackleaf develops flexible heating foils and coatings that enable efficient, uniform thermal control across diverse industrial surfaces. ELANTAS Europe - Berit Schuster  presents printed electronics paste technologies for automotive applications. The talk highlights formulation strategies for functional pastes used in in-mold touch interfaces, sensors, and heating elements. Key requirements such as electrical performance, adhesion, flexibility, and thermal stability are addressed, emphasizing application-specific customization to ensure reliable, durable integration in future mobility solutions. Henkel – Thibaut Soulestin  presents high-performance inks for cost-efficient printed electronics. The talk highlights conductive silver and silver-coated copper inks for large-area antennas, ink systems compatible with conductive adhesives for hybrid integration, and pad-printed inks enabling direct functionality on 3D surfaces—reducing complexity and manufacturing cost. Explore the Full Agenda and Register before 12 September 2025 for the best rates Sofab Inks – Blake Martin  presents novel materials for scalable perovskite solar panels. The talk addresses material innovations enabling high efficiency and manufacturability in large-scale production. Focus is placed on soluble processes and next-generation formulations that balance performance with cost-effective scalability for perovskite photovoltaics. Karlsruhe Institute of Technology – Norbert Willenbacher  presents low-temperature metallization and interconnection materials for perovskite solar cells with reduced silver use. Leveraging the capillary suspension concept, printable pastes achieve high conductivity at low filler content, while thermoplastic busbars and TECC wire concepts enable efficient copper-based interconnection under gentle processing. These innovations support scalable, resource-efficient PV manufacturing with lower CO₂ impact. Nano-C – Henning Richter  presents innovative interface materials for perovskite photovoltaics. Building on decades of fullerene expertise, Nano-C develops functionalized C60/C70 derivatives that stabilize perovskite phases, enhance adhesion to metal oxides, and enable optimized band alignment. The talk highlights passivation strategies, improved device stability, and scalable manufacturing of next-generation electron transport materials to accelerate commercial deployment. DELO Industrial Adhesives – Sebastian Stasch  presents advanced encapsulants for perovskite solar cells. High-barrier adhesives are engineered to protect against moisture, improving durability, stability, and efficiency. Building on expertise in organic photovoltaics, DELO introduces new formulations tailored to the unique requirements of perovskites, enabling longer lifetimes and enhanced performance. P anacol – Lena Reinke  presents advanced bonding technologies for flexible substrates and devices. The talk covers encapsulation adhesives that protect against moisture, oxygen, and stress, and electrically conductive adhesives that replace soldering for lightweight, flexible interconnections. These solutions enhance performance, durability, and reliability in photovoltaics, batteries, and sensors. Explore the Full Agenda and Register before 12 September 2025 for the best rates RISE – Lars Herlogsson presents screen-printed stretchable electronics with liquid metals. The talk highlights advances in gallium-based liquid metal inks and water-spray sintering methods enabling multilayer, fully screen-printed stretchable circuits. Applications span wearable, biomedical, and soft robotic devices, with emphasis on scalable, large-area manufacturing. University of Coimbra – Mahmoud Tavakoli  presents scalable, h igh-resolution liquid metal circuits for 3R electronics (Resilient, Repairable, Recyclable ). The talk introduces gallium-based liquid metal composites as candidates for soft, sustainable electronics, addressing challenges in precision deposition, multilayer circuit integration, and chip interfacing. Additive manufacturing, screen printing, and laser patterning approaches are discussed, with applications ranging from flexible PCBs to emerging 3R batteries and optoelectronic devices. University of Manchester – Katy Ainsworth  presents graphene and 2D material inks for printed and flexible electronics. The talk highlights conductive, optical, and multifunctional applications enabled by graphene and related materials, supported by pilot-scale printing capabilities. Examples include sensors, flexible devices, and energy-efficient heating elements, demonstrating pathways from lab innovation to scalable industrial adoption. CondAlign – Morten Lindberget  presents n ovel anisotropic conductive films f rom launch to volume production. Based on particle alignment technology, these films enable reduced filler content, lower costs, improved performance, and smaller carbon footprint compared to conventional ACF and TIM products. The talk addresses the path from qualification and sustainability validation to industrial-scale processes and commercial adoption. Explore the Full Agenda and Register before 12 September 2025 for the best rates Canatu – Jussi Rahomäki  presents CNT-based transparent film heaters for ADAS cameras. These wire-free heaters deliver fast, uniform de-icing and de-fogging with high transmittance and ultra-low haze, ensuring clear vision in harsh weather. Seamlessly integrated into laminated windshields, the technology enables reliable ADAS performance for next-generation autonomous vehicles. Panasonic – Takatoshi Abe  presents Toughtelon, a multifunctional shock-absorbent film material for advanced display applications. This multilayer composite achieves significant thickness reduction while offering self-healing, high flexural durability, and wide-temperature resilience. Demonstrating ~165% greater impact resistance than conventional materials, Toughtelon is customizable for flexible, slim, and mechanically robust device components. INKTIO - Jaime Benavides  presents digital manufacturing of flexible photocatalytic electronics . Using inkjet deposition and digital thermal processing, TiO₂-based electrodes with a platinum cocatalyst are fabricated directly on PET substrates, achieving 98% pollutant degradation under solar illumination. The fully scalable, roll-to-roll compatible process enables on-demand production of photocatalytic devices for self-cleaning, air purification, and water treatment, while reducing cost and material waste. Explore the Full Agenda and Register before 12 September 2025 for the best rates