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Digital Additive Hybrid Solutions as a Value Driver Authors: Frédéric SOULIER and Viktoriya TESSIER-DOYEN Email authors here   In the era of Smart Factories, IoT, AI and Sustainability Goals, the electronics and industrial sectors are undergoing a profound transformation. Traditional subtractive methods : etching, photolithography, plating still dominate, but they come with high fixed tooling cost, lead times, and material wastage. Digital Additive Manufacturing  — particularly in the domain of Printed Electronics — is emerging as a powerful disruptive lever. Among various solutions in this space, the CeraPrinter , by Ceradrop - MGI Group, offers hybrid digital deposition equipment that combine multiple printing technologies : Inkjet, NanoJet, Aerosol Jet®, Microdispensing  to deliver flexible, precise, and sustainable manufacturing across industrial domains. This article discusses key trends, technical merits, hybrid approaches, and business advantages of digital additive hybrid manufacturing. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend   Trends & Growth in the Printed Electronics Sector The global printed electronics market is forecast to grow strongly — expected to nearly double by 2030. This expansion is driven by flexible, lightweight, multifunctional electronics for wearables, automotive, sensors, and IoT devices.Key trends include flexibility, sustainability, on-demand customization, hybrid multi-material integration, and the rise of 3D additive electronics. Regional programs in Europe, USA and Asia are also pushing the sector forward.   Technical Landscape: Inkjet, NanoJet, AerosolJet, Microdispensing Each deposition technology has unique characteristics. Inkjet  excels in flexibility, high speed and cost-effectiveness. NanoJet  refines precision and resolution. Aerosol Jet®  enables 3D conformal and fine-feature deposition. Microdispensing offers volumetric precision for thicker films and viscous materials.MGI’s Hybrid Systems combine these advantages, providing unmatched versatility and scalability for industrial R&D and Production. Hybrid Digital Materials Deposition Platform. Industrial Digital Additive Manufacturing Solutions CeraPrinter’s Hybrid Edge: Industrial Multi-Field Applications The CeraPrinter platform integrates Inkjet, NanoJet, Aerosol Jet®, MicroDispensing in a unified modular tool. Users gain hybrid deposition capabilities, scalability, cross-field applications, and sustainable, material-efficient production.Key value propositions include hybrid deposition in one tool, modular scalability, multi-domain flexibility, on-demand production, cost efficiency, and sustainability alignment. Driving Growth Through Innovation Digital additive manufacturing is transforming the printed circuits industries. It removes constraints like masks, tooling, and chemical etching, enabling on-demand fabrication and just-in-time production.This flexibility facilitates efficient small-batch manufacturing, lowers cost, and fosters rapid innovation. Companies can design, test, and deliver new electronic architectures faster while minimizing waste and environmental footprint.   Advanced Simulation stage: Software suite CeraSlice CeraSlice , the exclusive CAD/CAM printing-job software suite by MGI-Ceradrop. CeraSlice is an advanced software suite, alongside DropAnalyser , FabAnalyser . It is used to design, simulate, and generate the printing jobs for: Inkjet, Aerosol Jet®, Nano Jet, Microdispensing, multi‐material / multi‐layer functional devices. Cross-Field Applications: Smart sensors directly printed on various substrates and curved surfaces. Flexible antennas and RF components on foils and molds. In-mold electronics integrated into polymer parts. Rapid PCB & FPC prototyping and interconnect fabrication. Printed power devices and energy modules. Smart packaging and wearables.   Advantages in Practice: Putting the features together, here are what CeraSlice enables in real applications: Faster prototyping:  Because of intuitive CAD import, simulation, patterning + scripting, users can go from design to printed prototype much faster. Material savings:  Early detection of printing issues means fewer wasted prints; pattern and droplet control avoids over‐use of inks/functional materials. Higher precision & consistency:  Detailed control over droplet placement, layer order, per‐subcomponent parameters leads to better uniformity, fewer defects. Flexibility for complex devices:  Printing multilayer, multi-material, 3D functional items becomes feasible. Combinations of materials: conductors, dielectrics, polymers, etc. Scalability from R&D to small production:  With scripting, experiment planning, and standardization of job definitions from lab scale to small batches or pilot lines. Reduced risk:  Simulation and preview steps reduce risk of failure or unexpected behavior; ability to integrate cleaning, curing, etc. helps control process. Conclusions & Call to Action: Digital Additive Hybrid Manufacturing is a strategic enabler for industrial transformation. CeraPrinter’s hybrid systems combine flexibility, sustainability, and scalability. Additive manufacturing redefines how electronics are designed, produced, and delivered — driving innovation, sustainability and competitiveness for the next generation of industrial products. Discover more: Welcome to our Presentation at TechBlick Conference on 23rd of October 2025, at 13h35, Track n°1 We are Presenting in Berlin. Register now to hear our talk at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend What to expect in Berlin? Download Conference Handout

Authors: Laszlo Izso. Matthias Carnoy. Nandan Singh Ruhela. Benjamin Borie. Mira Baraket. Maksym Plakhotnyuk Introduction: ZnO from an Applications point of view Zinc oxide (ZnO) is a versatile semiconductor material that has attracted broad interest in electronics and sensing. It features a direct wide bandgap of ~3.37 eV, making it useful for UV optoelectronic devices like LEDs and photodetectors [1]. ZnO is also abundant, low-cost, and chemically stable, and it can be synthesized via relatively easy methods all contributing to its popularity in research and industry [2]. Beyond optics, ZnO can be doped to achieve high conductivity (transparent conducting films) and used in thin-film transistors (TFTs) as an  n -type semiconductor channel. In microelectronics, ZnO and related oxides have been explored for transparent and flexible transistors, as well as varistors and UV sensors. Its wurtzite crystal structure lacks inversion symmetry, giving ZnO a strong electromechanical coupling it is one of the few semiconductors that is also piezoelectric [3]. This means mechanical strain can induce an electric charge and vice versa, enabling ZnO to serve in mechanical actuators and sensors [3]. In MEMS/NEMS devices, polycrystalline ZnO thin films (often  c -axis oriented) are used for piezoelectric actuators, micro-resonators, and energy harvesters. For example, ZnO thin films form the active layer in surface acoustic wave (SAW) devices and bulk acoustic resonators for filters and sensors [1]. Because of this unique mix of optical, electronic, and piezoelectric properties, ZnO attracts strong interest across multiple industries. In consumer and mobile electronics, it enables transparent and flexible displays, UV photodetectors, and low-power TFT backplanes; in automotive and industrial sensing, its piezoelectric response supports vibration, pressure, and acoustic devices that tolerate harsh environments. Healthcare and wearables benefit from biocompatible, flexible ZnO films for UV monitoring and self-powered (energy-harvesting) sensors, while IoT and smart-building applications leverage ZnO’s transparency and low-temperature processability for unobtrusive, large-area sensing. Combined with compatibility for back-end-of-line and additively patterned deposition, these attributes make ZnO a practical platform material for rapid productization across sectors. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend   ZnO Deposition via DALP® 2.1. Direct Atomic Layer Processing (DALP®) ATLANT 3D’s Direct Atomic Layer Processing (DALP®), allows direct-write deposition. In DALP®, a microscale ALD printhead (micronozzle) delivers precursor gases locally to the substrate in a programmable pattern [4]. Fig. 1: Illustration of the DALP® micronozzle; the printhead on top deposits gases onto a moving substrate. This approach translates the well-known ALD chemistry into a patternable format: instead of coating an entire wafer and then patterning, DALP deposits material  only where needed , with features defined by the motion of the printhead. In other words, DALP is essentially maskless, localized ALD [4]. Fig.  2: SEM Image of DALP® deposition of Atlant logo [4]. 2.2. ZnO Deposition with DALP®   ZnO deposition has been successfully demonstrated using DALP® process. In this approach, a safe and non-pyrophoric zinc precursor, bis(dimethylaminopropyl)zinc (Zn(DMP)₂), was used in combination with H₂O as the reactant, replacing the hazardous diethyl zinc (DEZ) typically employed in conventional atomic layer deposition (ALD) [5]. Fig. 3: Optical micrograph of ZnO lines printed by DALP® at 200 °C using Zn(DMP)₂ + H₂O chemistry. Line thickness increases with the number of passes (50 – 800) [5]. We are Presenting in Berlin. Register now to hear our talk at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend Comparing growth rate to traditional ALD, the DALP® ZnO process achieves a growth-per-pass (GPP) of approximately 1.1 Å/pass, nearly identical to the ~0.9 Å/cycle measured in traditional thermal ALD using the same precursor chemistry [5]. Both methods share the same self-limiting temperature window of 200-250 °C, within which stoichiometric and crystalline ZnO films are produced. This close alignment of growth kinetics demonstrates that DALP preserves the core benefits of ALD monolayer precision and reproducibility while adding the ability to pattern directly, greatly improving process flexibility and material utilization. Fig. 4: Comparison of ZnO growth rate between ALD (black) and DALP (red). Both exhibit a constant growth regime (ALD window) between 200–250 °C, yielding stoichiometric ZnO at ~1 Å per cycle/pass [5]. To further validate the precision of the DALP® process, imaging ellipsometry was used to map the thickness profiles of ZnO lines deposited at 200 °C. The results demonstrate excellent uniformity along each printed line and well-defined edges, confirming that film growth remains consistent across the entire patterned area. The cross-sectional profile reveals a smooth, slightly rounded shape typical of self-limiting surface reactions, while the thickness maps for multiple lines show reproducible scaling with the number of passes. These observations underscore DALP’s ability to achieve highly uniform, conformal ZnO layers with nanometer-level accuracy, reinforcing its equivalence to conventional ALD in deposition control [5]. Fig. 5: Thickness profiles and mapping of DALP-printed ZnO lines measured by imaging ellipsometry at 200 °C. (a) Cross-sectional thickness profile across a single line showing smooth curvature and uniformity; (b) thickness map of one printed line (~400 µm width); (c) set of ZnO lines with increasing numbers of passes (50–250), demonstrating reproducible, linear thickness scaling. Source: Stefanovic et al., 2023 [5]. Comprehensive material characterization confirmed that ZnO films produced by the DALP® process are crystalline, stoichiometric, and free of defects, matching the high quality typically achieved by conventional ALD. Microscopic analyses using SEM and AFM revealed dense, homogeneous microstructures with nanoscale surface roughness and grain sizes of approximately 20-30 nm, which remained consistent across the tested temperature range. Grazing-incidence XRD measurements further identified the films as hexagonal wurtzite ZnO, exhibiting a pronounced (002) preferential orientation at around 250 °C, a texture particularly favorable for piezoelectric and electronic device applications. Complementary EDS and XPS analyses confirmed that ZnO layers deposited within the 200-250°C window are stoichiometric (Zn:O ≈ 1:1), while deviations at lower temperatures (150 °C) or higher temperatures (≥ 295 °C) resulted in oxygen-rich and zinc-rich compositions, respectively, attributed to incomplete surface reactions or precursor decomposition [5]. Fig. 6: Microstructure of ZnO printed by DALP at different substrate temperatures (150 °C, 200 °C, 250 °C, 295 °C). SEM (top), AFM (middle), and XRD (bottom) confirm polycrystalline wurtzite ZnO with temperature-dependent orientation. Best crystallinity and stoichiometry occur near 200–250 °C [5]. 2.3. Further developments of ZnO using DALP® and Nanofabricator At ATLANT 3D, we have also conducted extensive development and testing of ZnO deposition using the DALP® process, employing the same Zn(DMP)₂ + H₂O precursor-reactant combination as described in the literature. Our objective was to evaluate the electrical properties, specifically resistivity, of ZnO films grown under varying substrate temperatures and film thicknesses, to benchmark performance and identify optimization pathways. For electrical measurements, ZnO lines were printed on gold-padded wafers, which allowed for direct contact with predefined electrode pads and facilitated resistance testing. For resistance measurements we received help from the Danish Technological Institute (DTI) of these lines, as our in-house potentiostat was not sensitive enough for the task. The setup enabled accurate two-point resistivity measurements across multiple DALP® deposited ZnO lines of different thicknesses and deposition conditions. Fig. 7: Optical micrograph of ZnO lines printed via DALP® on gold-padded wafer for resistivity testing. Au contact pads allow direct measurement of resistance across each line. Our measured ZnO resistivity-temperature curves are ≈3 orders of magnitude higher than the reference values and do not reproduce the characteristic trend reported in the literature. This discrepancy is most likely associated with the open-air deposition environment used in DALP® deposition. Literature indicates that ZnO grown in ambient conditions can exhibit increased resistivity due to oxygen adsorption and defect-related scattering at grain boundaries. A study by Ellmer & Mientus (2008) show that oxygen-rich surface states and grain boundary defects act as electron traps, thereby reducing carrier mobility in ZnO thin films deposited in non-inert atmospheres [6]. Similar behavior has been observed in open-air ALD systems, where uncontrolled oxygen incorporation leads to reduced conductivity compared to inert or vacuum processes. Fig  8: Left: Resistivity of DALP® deposited ZnO lines vs substrate temperature (600–1500 passes), showing a mid-temperature maximum followed by partial recovery at higher temperature. Right: Reference temperature dependence from literature for comparison (c) (highlighted).) [6]. Work is ongoing to further refine ZnO deposition conditions using DALP®. The lithography-free, direct-write nature of the technique allows for rapid, combinatorial optimization by systematically varying process parameters such as substrate temperature, deposition speed, gap distance between nozzle and substrate, and precursor and reactant bubbler temperatures. These tunable factors provide a wide process window to target improved crystallinity, stoichiometry, and electrical performance. Through systematic process mapping and controlled testing, DALP® continues to demonstrate its potential as a rapid prototyping platform for high-quality oxide semiconductors. Fig. 9: Optical image of ZnO DALP® deposition test library printed on a 4-inch Si/SiO₂ wafer. Each line corresponds to a unique combination of parameters: substrate temperature, deposition speed, gap, and bubbler temperatures, all deposited in a single automated run. Positioning DALP® Within the ZnO Fabrication Landscape Alternative Fabrication Methods for ZnO Thin FilmsBeyond DALP®, several fabrication routes have been proven to yield functional ZnO, each trading off precision, throughput, substrate compatibility, and post-processing. Among additive approaches, inkjet printing digitally patterns either nanoparticle dispersions or precursor inks that are converted to ZnO by thermal, UV, or plasma treatments. This enables maskless deposition on rigid or flexible substrates and large-area scalability, though film densification and crystallization typically require post-annealing and careful suppression of coffee-ring effects and porosity. Representative studies and reviews document successful thin films and devices prepared by inkjet, including recent demonstrations on flexible substrates and surveys of process-structure-property relations [7]. Two mature vacuum techniques pulsed laser deposition (PLD) and magnetron/RF sputtering remain benchmarks for dense, uniform ZnO. PLD can deliver highly stoichiometric and even epitaxial ZnO with excellent control of crystallinity via laser energy, oxygen ambience, and substrate temperature, albeit at limited area and higher system cost. Multiple studies and reviews outline PLD’s strength for high-quality ZnO thin films [8]. Magnetron/RF sputtering, by contrast, is industry-proven for large-area coatings at relatively low substrate temperatures; it provides dense, uniform layers suitable for transparent electronics, though patterning still requires masks or lithography and plasma exposure can introduce damage if not tuned [9]. Spray pyrolysis (including ultrasonic/nebulized variants) offers a low-cost, scalable path to ZnO by atomizing precursor solutions onto heated substrates, where thermal decomposition forms the oxide. It is attractive for rapid screening and large-area coatings but generally needs optimization to reduce roughness/porosity and to enhance film density and transport properties. Recent reviews and studies describe ZnO films produced by spray with controllable optical/electrical performance and post-treatments to improve crystallinity [10]. In summary, these methods map a practical spectrum of choices for ZnO: inkjet and spray routes offer low-cost, maskless patterning and rapid scale-up but typically rely on post-conversion to reach device-grade quality [6][9], while PLD and sputtering deliver dense, crystalline films with strong process control at the expense of vacuum infrastructure and added patterning steps [8][9]. DALP® complements this landscape by combining ALD-like, self-limiting growth with direct, lithography-free patterning using safer precursors, enabling fast design-to-device iteration and precise thickness control within the 100-300°C window, with far lower precursor consumption than blanket ALD [5]. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend   Summary & Conclusions  This work outlined why ZnO remains a compelling platform material, combining a wide bandgap for optoelectronics with strong piezoelectric response for sensing and actuation, and showed that DALP® can deliver patterned, device-grade ZnO with ALD-like control. We reviewed literature results, detailed our own DALP-based ZnO growth, thickness uniformity, and microstructure, and discussed electrical measurements that highlight where open-air growth, contact geometry, and defect chemistry can shift resistivity trends. Taken together, the picture is clear: ZnO by DALP® retains the precision of ALD while removing lithography, making it a practical route for rapid, iterative device prototyping. At ATLANT 3D, we are building on this foundation to expand ZnO capabilities in directions that matter for industry adoption: tighter control of stoichiometry and orientation within the 200-250 °C window; systematic de-embedding of contacts via TLM/four-point and Hall measurements; and process libraries that map substrate temperature, nozzle-substrate gap, stage speed, and precursor/reactant conditions to target electrical and piezoelectric figures of merit. The combination of DALP® with our NANOFABRICATOR™ Lite tool enables exactly this kind of rapid development, maskless, recipe-programmable, and combinatorial, so multiple thicknesses, chemistries, and device geometries can be explored on a single wafer in one run. Fig 10: ATLANT 3D NANOFABRICATOR™ LITE: A compact DALP® platform enabling maskless, direct-write deposition with ALD-level control. What to expect in Berlin? Download Conference Handout

Contact: Max Scherf, Maximilian.Scherf@profactor.at     Reimagining the entire life-cycle of electronics—from raw material sourcing to end-of-life management—is essential for building a sustainable economy and society. The EU-funded HyPELignum project addresses this challenge by exploring a holistic approach for manufacturing electronics with net zero carbon emissions, centred around additive manufacturing and wood-derived materials.   Methodology Materials By creating novel materials derived from wood feedstock, such as lignocellulosic composite boards, bio-derived resins, and functional compounds incorporating abundant, low-impact metals, a transition towards green electronics can be realized. These new materials expand the technological possibilities for electronics while maintaining a strong focus on environmental responsibility. A key material in this development is Cellulose Nano Fibrils (CNF), known for its excellent mechanical performance, ease of application, biodegradability, and eco-friendly nature. CNF has emerged as a promising material for eco-electronics due to its unique properties. Initial research at Empa demonstrated the feasibility of using CNF from delignified pulp (ECF) for eco-electronics applications. The prepared CNF samples exhibited robust mechanical strength and stability in indoor environments, providing a strong foundation for further development. While CNF-based ecoPCBs show strong mechanical properties comparable to FR4 PCBs, they face challenges regarding water vapor absorption and dimensional stability under extreme conditions (i.e. Temperatures  above 170°C). The conductive traces on the l-CNF boards were fabricated by inkjet printing a highly conductive, low-viscosity nanoparticle ink (NanoDimension) using the DragonFly™ IV printer (see Figure 1a)). Assembly of electronic components on l-CNF boards was done using curable glue from LOCTITE® AA 3491 from Henkel (mechanical fixation), and conductive paste from LOCTITE EDAG PF 050 E&C from Henkel (conductive bonding).   We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend High-resolution inkjet printing of electronic circuits To understand the behavior of the ink on the substrate, surface contact angle measurements and calculation of the surface energy were performed on the l-CNF board. A good match between surface energies of the surface and ink was observed, which was subsequently confirmed by printing results that exhibit good quality (sufficient resolution, no significant de-wetting or spreading of the ink on the l-CNF substrate).   l-CNF boards were wiped with ethanol to remove grease and dust particles before loading to the printer. The printing pattern was adapted from an open-source project, “Fair Mouse,” from NAGER IT. Next to the printed board for the sustainable mouse, other test structures were printed on l-CNF boards to estimate the adhesion and resistance of printed layers. The printing process includes inkjet deposition of conductive ink layer by layer followed by inline NIR drying of the ink to evaporate the carrying solvent and sintering to achieve good conductivity. The l-CNF board was kept at 120°C (tray temperature) during printing. Figure 1: Test l-CNF board loaded in the DragonFly printer a); Test structure printed on the board to estimate quality of printing and resistance of printed interconnections b). Characterization of printed lines Before printing the mouse electronic design, conductive traces on l-CNF were characterized to confirm that a good resistance of the printed track can be achieved. Layers up to the thickness of 40µm were printed and 3D profiles were measured. Figure 1b) depicts the typical shape of layers of 7µm and 40µm, respectively. 3D profiles were measured by Keyence VK-X3000 laser scanning microscope (see Figure 2a)). Resistance of printed tracks was characterized using a custom-made four-probe point station with source-meter Keithley 2400 and 4-wire measurement using Keysight 34465A (see Figure 2b). Printed interconnections with the thickness of 40 µm exhibit sheet resistance as low as 6,3mΩ/sq. For printing of the demonstrator board, the interconnection pattern with 20 µm in thickness was printed as a compromise between printing time and sufficient conductivity. Line resistances for different line lengths are depicted in Figure 2c) (measured on a line with 150 µm in width). Figure 2:Profiles of conductive layers printed on l-CNF substrate, the 3D profile view was taken in the printing direction a); Test station for resistance measurements b); line resistance vs line length c) Assembly of SMDs The assembly of passive components on the inkjet-printed circuit, built on a lignin-based PCB, was carried out manually. To ensure the mechanical stability of the electronic components, a commercially available UV-curable adhesive was applied to fix the electronic components on the top of the substrate. Electrical connections were made by glueing the components on the bottom (interconnections) side using a low temperature cured conductive paste. Curing to establish good electrical contact was done in convection oven at 120°C for 30 minutes. The functionality test of the whole assembly was done simply by attaching a USB cable and connection to a USB port in a PC.   The inkjet-printed antenna was integrated onto the textile band via heat-seal bonding, utilizing the C-Base bonding system to attach the corresponding chip . The fabricated sustainable printed circuit board was tested and found fully functional after placing it in a 3D printed housing out of wood-filled PLA filament, as it is demonstrated in the video in the supplement information. Demonstrators Mouse demonstrator (conventional, fully printed, ecoPCB) The development of this first working demonstrator, which is 97% based on ecofiendly material (by weight), represents a significant advancement in the creation of eco-friendly devices. This demonstrator not only showcases the feasibility of using biodegradable substrates in electronics but also sets a precedent for future innovations in sustainable technology.  Figure 3: l-CNF PCB with assembled components in mouse housing a); Bottom view of the l-CNF PCB with inkjet printed conductive traces Smart furniture A key demonstration of HyPELignum’s approach is the smart furniture demonstrator, which integrates wood-based electronics, energy-efficient µchips, and sensors into a functional furniture design (see Figure 4). This render illustrates how wood-derived materials can host electronic components in a practical, aesthetically pleasing application, highlighting the synergy of sustainability, design, and functionality.   Figure 4: Smart Furniture Demonstrator Module (Rendered): Showcases integrated wood-based electronics in a functional furniture setting. New wood-derived materials were created from lignocellulosic waste and biopolymers, like lignocellulose printed circuit board. Authors Václav Procházka¹, Yuliia Dudnyk², Pavel Kulha¹, Thomas Geiger², Max Scherf¹ [ 1 ]: Profactor GmbH, Steyr, Austria  [ 2 ] Cellulose and Wood Materials Laboratory, Empa – Swiss Federal Laboratories for Material Science and Technology, Dübendorf, Switzerland Visit us at booth G01 in Berlin and see for yourself the capabilities of inkjet-printed sensors and PCBs. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend What to expect in Berlin? Download Conference Handout

We shine the spotlight on a relatively unknown yet vital component in the printed electronics sector: the substrate. Interview with Christophe Geffray, CEO of Normandy Coating, a company based in Dieppe on the Normandy coast in France. Christophe Geffray, CEO Christophe, you are the CEO of a company specialising in polymer film surface treatment. Could you briefly describe your know-how?   Christophe: We have two production units, in Arques-La-Bataille near Dieppe: one .has been specialising in the  chemical coating and heat stabilisation o f polyester films for over 50 years. We also have a Plasma coating unit (NORCOP) which enables us to offer nanometric molecular coating on a wider range of substrates from PET, PEI, PEN, PI and PC to paper, etc. To put it simply, we give naturally inert films or paper the properties requested by our customers: Adhesion Printability Transfer/release “Barrier” effects Thermal stability Most importantly though, we are recognised for our ability to provide surface treatments tailored to the specific needs of our customers. If you need finely tuned adhesion, an instant release effect or a water-repellent film which can still be printed on, we are there! We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend List of properties added to the substrate In your opinion, why is the substrate and its surface treatment so important in the printed electronics sector? Christophe: Often we make the mistake of focusing on the conductive ink and trying to select this ink according to a standard film available on the market. And yet there is everything to be gained by using the opposite approach! Thanks to chemical and molecular coating technologies, it is the properties of the substrate that will be adapted to the requirements of the printer and the ink used, not the other way around. This is often the way we get the best results.   Can you give us some examples? Christophe: Yes, of course. Some customers ask us for rock-solid adhesion for Plastronic type thermoformed applications or flexible flat cables. We then perform a TCA type surface treatment which will give optimum and long-lasting adhesion properties to our PET films. Thus, with a coating thickness in the µm range, our chemical unit will enable the surface energy of the substrate to be increased to over than 70 dynes/cm! For others it is the fineness of the printed lines and a constant space between lines which is the most important. In this case we will use Plasma coating unit, which can align the surface energy of the substrate with the surface tension of the printed ink. Fine lines Plasma coating unit Listening to you, it appears fairly obvious that coating technology and its various properties are relatively unknown and overlooked in the field of printed electronics. Why do you think that is? Christophe:  It is important to keep in mind that even though printed electronics has recently developed a great deal through numerous applications in the automotive, medical and aeronautical fields, it is a fairly young sector of activity and has been slow to take off. So, it is not unusual that all the areas for improvement are not yet known. There are still huge possibilities for innovation and substrate surface treatment techniques are part of these, both in terms of coating and also in terms of thermal stability, a quality which is so important for printed circuits that need to avoid any breakage or discontinuity after printing. Here at Normandy Coating we fully understand this requirement and our PET Arcophane STE (super stabilisation) range, for example, will enable you to achieve thermal shrinkage of only 0.1% after 30 minutes in an oven at 170°C. My message is clear: let’s put polymer film at the focus of OPEN INNOVATION discussions and approaches. Let’s tell the industry world about the qualities that can be obtained by the right surface treatment. The importance of the substrate will once more be recognised and will help the entire sector in its continuous innovation approach.   Normandy Coating What markets do you work on and what requirements do your customers demand? Christophe: Normandy Coating works for the automotive sector with eminent end customers such as VW and Tesla. For example, we participate in the development of passenger safety features and heating elements in the seats. Due to the requirements in this sector, we are certified ISO 9001 & ISO 14001 and therefore have a managerial system worthy of the big guns! Our company is also active in the field of medical devices with applications such as biosensors or blood glucose test strips where the requirements can be high in terms of hygiene, reliability and the addition of barrier properties (02/H20, etc.).  But we  also produce high-performance release liners designed to support the coating and release of PU-based layers or inks used in stretchable printed electronics such as wearables (smart clothing and insoles). As you can see, we are strongly committed to innovation and the markets of the future. In this context, our New Business Manager, Bruno Ricordeau — with a solid background in the automotive sector — works closely with our customers to bring these high-potential projects to life. Plasma hydrophobic treatment TechBlick: A final comment, President? Christophe : As surface treatment techniques on polymer films are little known, I encourage anyone likely to be interested to come and visit our production units near Dieppe, which have the undeniable advantage of being on the Normandy coast. And don’t forget that by coming to see us, you will discover two treasures: our craftsmanship on polymer and paper rolls but also...the famous “Coquille Saint Jacques” scallops, probably the best seafood in the world! We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend What to expect in Berlin? Download Conference Handout

Authors: Caitlin Ho, Michelle Ntola, Oliver Semple, Neil Vyas, iGii, marketing@igii.uk The focus and development of new advanced materials has significantly increased as technology has evolved and increased the demand for high-performance and sustainable solutions for integration into new technologies. 3D carbon nanomaterials are a versatile and adaptable material with potential to revolutionise multiple industries. The combination of properties such as high surface area, electrical and thermal conductivity and anti-fouling, make 3D carbon films exceptional materials. For example, in applications like sensing, advanced materials are paving the way for versatile, high-performing, miniaturised, and low-power consumption platforms applicable across a wide variety of fields. Whilst in applications such as heating elements, energy and catalysis, they offer a more cost-effective, efficient and more sustainable solution by improving performance and lifespan. iGii’s pure, porous, 3D carbon nanomaterial, Gii, offers a high-performance, cost-effective and more sustainable solution for number of applications across sensing, energy, thermal and more. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend   Sensing 3D carbon nanomaterials are revolutionising the sensing industry. With its excellent properties and flexibility in design it offers a solution that enables diverse application and customisation to seamlessly integrate into existing products or new prototypes. High Performance – The large electrochemically active area of 3D carbon nanomaterials enables lower limits of detection of specific analytes, down to the femtomolar. Anti-fouling – The innate anti-fouling properties means that you can achieve high specificity of detection/binding without requiring pre-treatment or blockers to ensure integrity of the material. 3D carbon nanomaterials can be used for analysis of milk samples without degradation of material or impacting performance due to non-specific binding, commonly found in sensors using precious metals. Multi-analyte capabilities – From biological biomarkers in human diagnostics to heavy metal testing in water, 3D carbon nanomaterials can be tailored for detection of any analyte. Reliable –3D carbon nanomaterials that have simple manufacturing systems enables robust, reproducible sensors to give reliable results. Flexibility in design – With the advancement of technology, customisation in the size, shape, substrates and elements of electrodes without impacting performance is now more achievable. Battery Printed batteries are meant to deliver thin, flexible power sources for wearable and other small IoT devices; however, existing materials today were not designed for true scalability. With various challenges that have created barriers in the wide spread of the application due to the material, including maintaining conductivity at thin layers, complex manufacturing and cost and supply risks, new innovative materials offer a path to overcome them. Cost-effective Thinner, reliable and scalable manufacturing High Performance Low toxicity and sustainability Customisable – design and capacity 3D carbon nanomaterials like Gii provides a high-performance energy device with its high carbon content, low carbon footprint and a toxic solvent and binder free process. This enables thinner and more manufacturable flexible designs across applications like IoT, wearables, diagnostics and more. We are Presenting in Berlin. Register now to hear our talk at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend Heating Element The development of microheater systems has been fuelled by the growing demand for miniaturised, thin and light components that seamlessly integrate into existing systems. Current systems are generally based on 2D printed conductive inks on flexible substrates. Gii-based microheater systems utilises a 3D pure carbon film as the heating element, reducing the need for precious metal-based inks, and additional binders used in ink formulations which could limit the performance and durability of the heating element. The Gii-based microheaters have a high surface area and tunable film thickness. Switching from printed microheater elements could improve heater performance, energy efficiency, increase heater lifespan and reduce the number of conditioning cycles required for the burn-in phase. Cost-effective More sustainable – No dependence on noble metals or high impact chemical etching Scalability Customisable – form factor, output and substrate iGii has demonstrated flexible heating solutions above normal range from 100-200C to 300-400C and an alternative to reduce costs for higher temperature inflexible heaters up to 600C. 3D carbon nanomaterials have proven to have immense potential in a broad range of applications to address gaps in the market, improving existing products and offer a more sustainable solution. The capability to be flexible, high performing and reliable, scalability to meet market demands. Materials like Gii that are already available in the market are being implemented to enhance existing and upcoming products across various markets. The potential is endless and there is much to be desired and expected from 3D carbon nanomaterials in the near future.   About us iGii pioneering a new era of advanced materials, helping industries move beyond costly, unsustainable, and supply-constrained resources. We are revolutionising industries with Gii, the world’s most sustainable and high-performance carbon nanomaterial. Join us in transforming the future of point-of-care diagnostics, veterinary care, water safety and beyond with scalable, sustainable carbon nanotechnology. Our team will be exhibiting at stand S03.   Contact Us: Marketing@igii.uk , www.igii.uk   We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend What to expect in Berlin? Download Conference Handout

Smarter. Cleaner. Faster. Cheaper. Autonomous. Author: Masoud Mahjouri-Samani  info@nanoprintek.com   In every industry, government, and research lab, there is a common struggle. A researcher has a bold idea — a new material, a new device, a new way to connect the world — but the path from idea to realization is paved with many obstacles. Complex inks that take from months to years to formulate. Unthinkable cost of ink. Fragile chemistries that clog and contaminate. Post-processing steps that delay progress and drive up costs. In the end, too much time, too much money, and too much waste stand between vision and reality. At NanoPrintek, we asked a simple question: what if all those barriers could be removed? We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend From Raw Materials to Reality Our answer is the world’s first ink-free multi-material printing platform — a system that bypasses inks entirely, printing directly from solid raw materials. Metals, ceramics, dielectrics, composites — all transformed into pure, functional patterns in real time. There are no binders, no solvents, no drying or curing stages. Just direct, clean, and precise printing. The impact is immediate: Devices built in hours, not months Materials costs slashed by 10–1000X Near-zero chemical waste, near-zero compromises A Platform That Learns But freedom from inks was only the beginning. With the launch of our new AI module, NanoPrintek printers now do something extraordinary: they learn . Each time the printer operates, it records the process parameters and measured results — a full fingerprint of what happened during the print. This data doesn’t stay locked inside the machine. Instead, it flows outward, into the user’s AI/ML program, where it becomes knowledge. And then the roles reverse. The AI, trained on the data, proposes new parameters. The printer accepts, executes, and reports back. The cycle repeats, each round sharper and smarter than the last. For the first time, a printer doesn’t just print objects. It collaborates. It teaches and learns. It becomes a partner in discovery . From Trial-and-Error to Autonomous Discovery Imagine an R&D lab where days of trial-and-error are compressed into a lunch time autonomous operation. The printer runs, the AI learns, the AI suggests, the printer tries, and after lunch, dozens of new possibilities are discovered. A new alloy optimized. A new high-performance material composition discovered. A flexible sensor perfected without a human touch. A new process optimized not by chance, but by intelligence. We are Speaking in Berlin. Register for the TechBlick event on 22-23 October 2025 in Berlin .  Contact us for your special discount coupon to attend The New Era of Intelligent Manufacturing By merging ink-free multi-material printing with AI-driven autonomy, NanoPrintek is breaking barriers once thought immovable: Materials, cost, and time. Waste, contamination, and complexity. And now, even the limits of human bandwidth. We are entering an age where machines do not just follow instructions — they think alongside us. The Invitation NanoPrintek’s technology is more than a tool. It’s a catalyst for change. For researchers, it means accelerating discovery. For manufacturers, it means reducing risk and cost. For innovators, it means turning bold ideas into reality faster than ever before. The story of innovation has always been about removing barriers. With NanoPrintek, those barriers are gone. And with AI at its side, the path from concept to creation has never been more open. Ink-free. Multi-material. AI-enabled. Autonomous. That’s not just the future of manufacturing. It’s the beginning of a new way of thinking.   We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend What to expect in Berlin? Download Conference Handout

H. Richter, D. Bischoff, E. A. Jackson, R. M. Carty, H. Ghiassi, T. A. Lada, M. J. Ricci, M. Kollosche and P. C. Brookes Nano-C, Inc., 33 Southwest Park, Westwood, MA 02090, USA, email: hrichter@nano-c.com New global energy demand is being driven by vehicle electrification, datacenters, and AI computing.  According to IEEE, over 70% of all newly installed energy generation capacity in 2024 came from photovoltaics.  Traditional solar cells based on silicon and cadmium telluride were key to this rapid adoption, however, these universal technologies are reaching their practical conversion efficiency.  The primary solution to offer a step change in efficiency while promising to reduce the levelized cost of energy (LCOE) comes from the use of perovskite-based solar cells in tandem with traditional technologies. In addition, the implementation of organic thin film PV as well as flexible perovskite PV enables installations and integrations not feasible with traditional glass-based architectures.  We are Exhibiting in Berlin. Visit our booth at the TechBlick Perovskite Connect  event co-located with the  Future of Electronics RESHAPED  on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend In order to meet increasing global energy demand while also seeking to achieve reductions in global CO₂ emissions, a new generation of organic and perovskite photovoltaics are needed to: a) enhance the performance of existing, e.g., silicon solar PV and b) allow for the energy- and cost-efficient manufacturing of photovoltaic devices on light-weight flexible substrates. While the emerging silicon-tandem perovskite architectures can result in the rapid deployment of PV modules with significantly higher performance by leveraging existing manufacturing and installation infrastructure, single- or multijunction OPV and perovskite photovoltaics have the potential to significantly extend the range of use cases including building integrated applications (BIPV) for indoor, semi-transparent uses (e.g., for windows) as well as roof top where weight limitations are a factor. The global implementation of organic and perovskite PV requires all key materials to be economically viable at  industrial scale. Nano-C’s mission has been to develop and manufacture materials critical for the success of these next generation solar technologies. Spun-off from the Massachusetts Institute of Technology (MIT) in 2001, initially with the focus to scale-up patented technology to manufacture fullerenes, particularly C 60  and C 70  used in solar applications. A reactor used for the production of fullerenes at Nano-C is shown in Fig. 1. Fig.1  Fullerene reactor at Nano-C. Realizing the potential of using fullerene-based materials as electron acceptor material in the active layer of organic photovoltaic (OPV) devices, Nano-C  developed a large portfolio of proprietary fullerene derivatives enabling increased performance, particularly in terms of stability. Current performance of light-soaking stability under 1 SUN (at 55 – 65 °C) of a small-scale device fabricated at Nano-C is shown in Fig. 2. Reaching power conversion efficiencies of > 14% based on fully solution-processed active and inter-layers material.  This device was fabricated in an industrially relevant inverted architecture using a proprietary fullerene derivative combined with a commercially available polymer as well as a scalable non-fullerene acceptor (NFA). Fig.2  Light soaking (at 55 to 65 °C) of OPV device using proprietary fullerene derivative from Nano-C.   In addition to its activities regarding active and inter-layer materials, Nano-C is developing coat-ready formulations based on silver nanowires as well as hybrid systems that also contain single-walled carbon nanotubes targeting transparent top and bottom electrodes. Leveraging the foundational product development in OPV materials, including NFAs, has been critical to supplying current and future perovskite PV architectures. Industrial-scale supply of standard C 60 and sublimed C 60  have been optimized for electronic applications, particularly vapor-deposition of electron transport layers.  More importantly, as high volume PV applications start to utilize solution processing of their interface layers, a significant library of products exists to optimize performance based on particular application requirements and production equipment.  Based on market needs, Nano-C’s active development roadmap also includes next generation electron transport (ETM) and hole transport (HTM) materials. Some examples of interface materials available from Nano-C are shown in Fig. 3. These materials are available as mono- and bis-adduct that allows for the improvement of band alignment (and minimizing non-radiative recombination) depending on the bandgap of the perovskite material used. Increased performance, also in terms of thermal, light-soaking and mechanical stability is targeted. Fig. 3 Examples of interlayer materials available from Nano-C (from left to right): C 60 -C 6 -PA, CPPA, C 60 -malonate-2NH 3 l, 4-phosphonic acid-triphenylamine. We are Speaking in Berlin. Register now to hear our talk at the Perovskite Connect  event co-located with the  Future of Electronics RESHAPED  on 22-23 October 2025 in Berlin . We are Speaking in Berlin. Register now to hear our talk at the Perovskite Connect  event co-located with the  Future of Electronics RESHAPED  on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend In this context, a range of fullerene derivatives bearing carboxylic and, particularly, phosphonic acid have been synthesized and are available to cell developers. Having the capability to form self-assembled monolayers (SAMs), e.g., on SnO 2 , particularly bis-versions of such molecules, offers the ability to stabilize the perovskite phase. Ammonium bearing fullerene derivatives, such as C 60 -malonate-2NH 3 l, target interface passivation, particularly, in p-i-n architectures. Recently, a tri-phenylamine bearing phosphonic acid has been synthesized and is available for evaluation as HTM. Further, Nano-C offers coat-ready formulations of carbonaceous nanomaterials, particularly but not only, single-walled carbon nanotubes to be used as opaque top-electrode for single-junction Perovskite devices. Materials like fullerenes, NFAs, nanocarbons, and silver nanowires all promise to play an important role in the large-scale adoption of next generation solar cells.   The need for materials with unique properties, such as high electron mobility, chemical and thermal stability when accepting electrons, and ability to form thin, defect-free semiconductor films, is essential for high-performance devices. We are Exhibiting in Berlin. Visit our booth at the TechBlick Perovskite Connect  event co-located with the  Future of Electronics RESHAPED  on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend We are Exhibiting in Berlin. Visit our booth at the TechBlick Perovskite Connect  event co-located with the  Future of Electronics RESHAPED  on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend

Author: Thibaut Soulestin, PhD; Technology Manager Printed Electronics; Henkel Adhesive Technologies; thibaut.soulestin@henkel.com   Henkel Adhesive Technologies holds leading market positions worldwide in the industrial and consumer business. As a global leader in the adhesives, sealants, and functional coatings markets, Henkel has developed a large material portfolio of LOCTITE ®  conductive inks and coatings. The LOCTITE ®  Printed Electronics portfolio offers more than 100 different material solutions. Among those, Henkel silver inks are known to be exceptionally reliable, easy to use, and require only simple handling. This portfolio refers to products with proven superior performance in terms of conductivity and printability. This article focuses on a handful of silver inks to provide insights into the selection of the most cost-effective inks for various applications, such as membrane switches, capacitive touch sensors, heaters, and antennas. It introduces the latest Henkel developments in very high conductive inks with LOCTITE ®  ECI 1017 and cost-efficient silver-plated copper inks with the LOCTITE ®  ECI 4000 series. Efficient manufacturing of hybrid electronics is also enabled by proven compatibility with a range of electrically conductive adhesives or low-temperature solder pastes. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend 1. Silver Inks Overview 1.1 Main properties With the large range of silver inks available for PET substrates - selecting the most cost-efficient is not easy as you need to balance the material cost in €/kg, electrical conductivity, coverage and processability. Ink cost is strongly driven by the silver content, the quality of the silver particles, and performances of the polymer binder. 1.1.1 Sheet Resistance Electrical conductivity is expressed as sheet resistance. ASTM F1896 describes the test method. From the sheet resistance value, it is easy to calculate the expected track resistance: By using a low sheet resistance ink, you can reduce the thickness of the ink by printing with a finer screen or print narrower tracks. 1.1.2 Theoretical Coverage Theoretical coverage is the surface you can print in m², at a target dry thickness (often normalized to 10 µm), with 1 kg of liquid ink. The higher the coverage, the higher the number of prints you can make with 1 kg of ink. *DFT = Dry film thickness 1.1.3   Curing Process Ink curing can refer to different processes related to ink solidification. Solvent evaporation: Most of the silver inks for PET substrates become solid by simple solvent evaporation. The evaporation speed is driven by the temperature and air flow. Solvent evaporation + cross-linking: The chemical cross-linking reaction can be activated by heat or UV. Solvent evaporation + sintering: Heat sintering can be performed in a standard oven or may require high energy radiation sources like near-infrared, xenon, or photonic. 1.2 Highlighted LOCTITE ®  Silver Inks Among more than 30 different silver inks in LOCTITE ®  portfolio, 4 are particularly relevant for screen-printing on PET and covers are large range of applications ( Table 1 ). Table 1.  Overview of high-runners Henkel LOCTITE ®  silver inks. a Drying time depends on oven air flow. Inks are typically dried in less than 2 min in conveyor ovens. b  150°C is required for the sintering of the sub-micron silver particles. LOCTITE ®  EDAG PF-410  is a highly reliable silver ink qualified in numerous applications across industries. The formulation brings long-open screen time. It has good adhesion on a large range of substrates, including metals, glass or ceramics. This ink is compatible with a wide range of carbon inks, dielectric inks, but also numerous electrically conductive adhesives or low-temperature solder pastes. Processing up to 180°C for a few minutes will not trigger accelerated aging. It is the go-to ink when low sheet resistance is not mandatory. LOCTITE ®  ECI 1001  is suitable for non-demanding applications where low track resistance is not required. Excellent choice for membrane switches or capacitive touch sensors. This ink has the lowest price in the Henkel silver ink range thanks to the low silver content. The cost-efficiency is even improved with the high coverage of 17 m²/kg at 10µm dry. The cost performance still comes along with good reliability in 85°C/85%RH and excellent flexibility. LOCTITE ®  ECI 1010  is Henkel state-of-the-art silver inks. With one of the lowest sheet resistances (0,006 Ohm /sq/25µm) for a flexible ink on the market, this ink is the perfect balance between electrical conductivity and cost. It is very flexible and shows minimal resistance increase under double-crease test. Thanks to the small silver flake size, this ink can be printed with fine screens for low thickness and narrow tracks, improving further the cost-efficient without compromising the technical performances. Next to HMI applications, LOCTITE ®  ECI 1010 is suitable for antenna or heaters up to 100°C. LOCTITE ®  ECI 1011  is the lowest sheet resistance ink in the portfolio with 0,003 Ohm /sq/25µm. Such a low sheet resistance is enabled by sub-micron particles that sinter at 150°C in traditional conveyor ovens. In comparison to nano-particles inks or molecular inks, the use of sub-micron inks provides higher dry thickness and higher production throughput. The small particle size gives low surface roughness and sharp edges. Combined with the excellent electrical conductivity, LOCTITE ®  ECI 1011 is particularly suitable for antenna applications. We are Presenting in Berlin. Register now to hear our talk at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend 1.3 Reliability All LOCTITE ®  silver inks undergo accelerated ageing for at least 1000 hrs in a climate chamber at 85°C and 85% of relative humidity before commercialization in Henkel R&D laboratories. The bare silver ink on PET is tested. Compatibility by overprinting carbon and dielectric inks is also evaluated. Figure 1 displays the sheet resistance change of the 4 highlighted silver inks after 1000 hrs in 85°C/85%RH condition. Due to the low silver content, ECI 1001 shows a slight increase of sheet resistance, not detrimental for the targeted applications. EDAG PF-410 sheet resistance decreases until stabilization. This decrease can be explained by the improved stacking of the large silver flakes. Both ECI 1010 and ECI 1011 demonstrate excellent sheet resistance stability. Figure 1.  Sheet Resistance change versus time for 4 silvers inks printed on un-treated 125 µm polyester film stored in a climate chamber at 85°C and 85 % relative humidity. Dry heat storage tests at 100°C or above, for the bare silver inks or when overprinted with carbon or dielectric inks, are available upon request to your Henkel contact. 2  Towards More Cost-Effective Inks 2.1 Very Low Track Resistance - LOCITITE ®  ECI 1017 Launched in 2025, LOCITITE ®  ECI 1017 completes the range of very high conductivity sintered silver inks. Similarly to LOCTITE ®  ECI 1011, it sinters in traditional conveyor ovens at 140-150°C. With a sheet resistance of 2.6 m Ohm /sq/25µm, the main difference with ECI 1011 lies in the dry films thickness. ECI 1017 prints 2x thicker than ECI 1011. Figure 2.  Average dry ink thickness in µm after printing one layer of silver inks with a 79-55 polyester screen The higher dry ink thickness and the very low sheet resistance gives extremely conductive silver tracks. Particularly suitable for sensing or antenna applications. Figure 3  shows the influence of temperature and time, in a ventilated box oven, for 3 silvers inks: ECI 1010, ECI 1011, and ECI 1017. ECI 1010 dries in 10 min at 120°C while 5 min is only required at 150°C. Shorter times are observed with conveyor ovens. ECI 1011 needs 150°C for sintering as observed by the resistance drop between thermal treatments for 15 min at 120°C or 150°C. ECI 1017 dries and sinters faster than ECI 1011. Partial sintering already occurs at 120°C but it is recommended to process at 140-150°C to achieve the lowest track resistance. Figure 3.  4-wires track resistance of silver inks printed with a 79-55 polyester screen after drying in a laboratory ventilated box oven for 5, 10, 15, 30 min at 120°C or 150°C. As displayed in Figure 3 , there is a 3x resistance difference between ECI 1010 and ECI 1017 when printed with the same screen. ECI 1010 has a remarkable sheet resistance of 0,006 Ohm /sq/25µm combined with an excellent flexibility. The resistance increase after a double crease test is below 10%. All sintered silver inks can withstand small bending radius of a least 4 mm but will crack under double-crease test. 2.2       Silver-plated copper – LOCTITE ®  4000 series Silver price volatility is a constant challenge for the Printed Electronics industry. After record prices in 2011, above 40 USD/oz, in 2025 prices are again at a similar level. Pure copper inks are expected to offer more stable prices and overall lower cost. Different technologies have been developed to prevent copper oxidation. They all require additional processing like 2K ink blending, inert atmosphere sintering, hot pressing, high-power radiation. In addition, sintering reduces the flexibility of the printed copper tracks. Those drawbacks slowed down the adoption rate of those inks. Silver-plated copper inks appear as an alternative solution for more cost-effective conductive inks. The silver shell protects the copper from oxidation in high-humidity environments. Recent developments in flake manufacturing and ink formulation are now leading to flexible conductive inks with good electrical conductivity, and high reliability in high-humidity environment, suitable for membrane switches or capacitive touch sensor applications. 3 Hybrid Electronics 3.1 Electrically Conductive Adhesives Henkel is the premier materials supplier for the electronics assembly and semiconductor packaging industries. The advanced formulations include a range of products that facilitate electrical interconnect, provide structural integrity, offer critical protection, and transfer heat for reliable performance. Figure 4.  Overview of Henkel solution for electronics assembly Attaching components, such as LEDs, on printed silver lines is enabling Hybrid Electronics and combines the “best of the two worlds”. Compatibility between silver inks and electrically conductive adhesives (ECA) were tested by accelerated aging for 1000 hrs at 85°C and 85% relative humidity. The die shear stress (DSS) and the single joint contact resistance (SJCR) were measured. EDAF PF-410, ECI 1010, and ECI 1011 are compatible with Ablestik CE 3104WXL, Ablestik 3103WLV, Ablestik 2030SC, Ablestik QMI516IE, and Ablestik 57C 2K. After 1000 hrs at 85°C/85%RH, the die shear stress is above 0,5 kg and single joint contact resistance below 50 m Ohm . The main adhesion failure is between the substrate and the silver ink. For even higher long-time reliability, it is recommended to use noble component finish like AgPd or Au instead of Sn. A straightforward way to evaluate the compatibility between an ECA and a silver ink is by looking from the bottom side of the print. Any discoloration of the silver under the ECAs indicates a risk of incompatibility ( Figure 5 ) Figure 5 . Backside pictures of a component bonded with electrically conductive adhesive onto silver inks printed on polyester foil. The left side shows no discoloration and good compatibility while the right side shows typical discoloration and risk of long-term degradation. 3.2 Low Temperature Soldering In addition to ECAs, it is possible to bond components using Tin-Bismuth, Sn 42 Bi 58 , low-temperature solder paste. To allow the formation of a good intermetallic compound and keep adhesion on the substrate, a thick layer of silver ink is needed. A second print can be done on the contact pads. LOCTITE ®  EDAG PF-410 is recommended for its compatibility with low temperature soldering and can also be used as an additional layer on the contact pads when other silver inks are printed. 4. Conclusion Built on decades of expertise in Printed Electronics, Henkel ink portfolio keeps evolving to offer more sustainable, more conductive, more reliable, and more cost-efficient solutions to the industry. This article highlighted the main silver inks for screen-printing onto PET substrates. All new developments aim at improving the end product sustainability by (i)  reducing the ink carbon footprint, (ii) improving the sustainability of the manufacturing, and (iii) improving the end product life cycle. Supporting claim (i) , product carbon footprint of all Henkel inks and calculation methodology are available for Henkel customers. The silver ink range is much wider with inks for a variety of substrates such as PC for In-Mold-Electronics, TPU for medical and wearables, FR-4 for printed circuit boards. It is also worth mentioning the available wide variety for a large range of printing processes such as 3D printing by pad-printing or jetting; or high-speed printing with rotogravure and flexographic printing. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend What to expect in Berlin? Download Conference Handout

By Pierre Laboisse, President & CEO of Aledia For more than a decade, microLED technology has captured the imagination of display engineers, semiconductor innovators, and industry analysts. The promise has always been clear: unmatched brightness, durability, and energy efficiency. The challenge has been turning that promise into a mass-market reality, a process that has proven to be complex and slow. Now, in 2025, the pieces are finally coming together. From materials breakthroughs to smarter manufacturing methods, microLED is at a critical inflection point. At Aledia, we have always believed that solving physics was only part of the equation. True success also depends on solving economics, process scalability, and systems integration. This year, momentum is building across all these areas. We are Exhibiting! Visit our booth at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025   At the Core: Materials and Emission Mechanics At Aledia, we are pioneering a fundamentally different approach to microLEDs. Unlike traditional planar technologies, our 3D microLED architecture, built from silicon nanowires, enables far greater light extraction, power efficiency, and manufacturability using existing 200 mm IC manufacturing lines. Our innovations in GaN-on-silicon nanowire growth allow full-color emission from a single material system. This directly addresses the long-standing RGB alignment challenge in lining up red, green, and blue sub-pixels at microscopic scales, which is essential for accurate color and high-yield manufacturing. The nanowire array structures also make it possible to engineer emission directionality at the pixel level, which reduces the need for additional optics and simplifies integration into end devices. Across industry, we are also seeing the adoption of porous-layer mesa structures and horn-shaped collimator arrays. These innovations enhance light output and beam precision, reinforcing our belief that optimizing emission geometry at the nanoscale is essential for next-generation performance. Chart: Aledia 3D miroLED Core technology  Fixing the Bottlenecks: Smarter, Faster, Scalable Scalability has historically stalled many promising microLED programs. Our 3D nanowire-based process is designed from the start for mass production in standard IC manufacturing fabs, removing the need for entirely new infrastructure. This approach lowers capital expenditures and avoids many of the bottlenecks related to wafer yield and die uniformity. Across the ecosystem, process improvements are accelerating as well. AI-assisted binning and transfer methods, such as those pioneered by Rayleigh Vision Intelligence, are reducing processing times by up to two-thirds. At Aledia, our proprietary approaches to deterministic die placement and wafer-level testing allow us to maintain high yields, even with ultra-small pixel sizes.   Beyond RGB: Achieving Full-Color at High Brightness One of Aledia’s defining strengths is the ability to generate red, green, and blue directly from nanowires, without relying on quantum dot conversion or multilayer stacking. This reduces optical losses, increases brightness, and simplifies overall system design. Figure: SEM image of typical Aledia Native Color RGB color Pixel made of GaN Nanowires grown on Si   in a RGB pixel arrangement While other companies are achieving impressive specifications with blue LED arrays and quantum dot layers—such as 7,000 PPI and 150,000 nits—our monolithic RGB emission provides a more scalable and emissive-native path. This approach is especially relevant for AR applications. Market Readiness: Moving from Prototypes to Products This year’s SID Display Week highlighted a clear shift from experimental demonstrations to commercial readiness. MicroLEDs are now appearing in transparent displays, automotive dashboards, wearable prototypes, and spatial computing systems. Tier-one device manufacturers are already evaluating our own development kits, and we are preparing for limited production runs ahead of CES 2026. Market analysts at Yole Group forecast microLED display market projection close to $8 billion by 2032. Meeting this demand requires more than interest—it requires manufacturing at scale. With our CMOS-compatible process and intellectual property portfolio of more than 225 patent families, Aledia is well positioned to play a leading role. Photograph : Aledia’s own $200M production line in France for fast product development and mass production is a strong competitive advantage What’s Next: Challenges Worth Solving Despite progress, several challenges remain. Yield optimization at sub-10μm pixel sizes, long-term reliability testing, and integration with flexible backplanes are still works in progress across the sector. Hybrid models such as miniLEDs or quantum dot–layered systems provide useful steppingstones but fall short of delivering the efficiency and precision of true microLEDs. We are closely following the efforts of the MicroLED Industry Association to establish standards for wafer formats and system architectures, a critical step in avoiding market fragmentation. At Aledia, we are contributing to these discussions while advancing our roadmap, which includes automotive-grade reliability testing, custom driver IC integration, and partnerships with OEMs in Europe, North America, and Asia. The Stakes and the Payoff What makes 2025 different is not only the technical maturity of microLED but also the alignment across the ecosystem. For the first time, display makers, chip manufacturers, and materials innovators are moving in unison toward the same goal. As we look ahead to Touch Taiwan, and SID Display Week 2026, the industry is preparing for the first wave of commercial microLED products. At Aledia, we are not just anticipating that future. We are building it now, pixel by pixel and wafer by wafer. To learn more about  MicroLED and AR/VR displays, please join the show in Eindhoven on 24 and 25 Sept 2025 . Download Conference Handout Download Conference Handout

Author: Jon E. Carlé, infinityPV ApS, jegc@infintiypv.com How do you take a breakthrough fuel cell material from the lab bench to the factory floor without losing performance, consistency, or time? The answer lies in how you scale your process. While headlines often focus on gigafactories and industrial roll-to-roll (R2R) systems, the real work of scaling starts much earlier. In fact, it starts in the lab. Before any fuel cell can be mass-produced, it must first survive the transition from small-batch experiments to continuous processing, and that transition is where many innovations stumble. The secret to success is not just in the chemistry. It is in recreating real production conditions as early as possible, using lab-scale R2R equipment that mirrors industrial workflows. This article explores why laboratory-scale roll-to-roll fuel cell processing is the cornerstone of scalable production, how it bridges the gap between research and manufacturing, and what choices such as coating methods can make or break your scale-up efforts. Setting the Stage for Scalable Fuel Cell Manufacturing The capability to coat, dry, and assemble fuel cell layers continuously on flexible substrates brings benefits in speed, cost-effectiveness, and uniformity. However, while the long-term promise of roll-to-roll fuel cell production is evident, its success depends greatly on what occurs at the laboratory level. Before materials advance to pilot lines or full production, they must be tested, optimized, and validated using lab-scale roll-to-roll methods that closely replicate the conditions of high-volume manufacturing. Laboratory-scale roll-to-roll processing is not merely a smaller version of full-scale production. It is the point where initial design decisions meet practical implementation. Every formulation, coating technique, and drying schedule must be suitable not only for the final fuel cell design but also for the continuous processes that enable industrial-scale manufacturing. A dependable and consistent lab-scale system creates the groundwork for this transition, reducing risks and speeding up development. Perovskite Connect talks are part of the  full conference agenda . From Materials to Metrics: The Importance of Early Process Fidelity Fuel cell materials are evolving at a rapid pace. High-performance membranes, catalysts, gas diffusion layers, and bipolar plates are now central in many research projects. These materials often behave in unique ways during coating and drying. Properties like viscosity may change when sheared, solvents can interact with substrates, and drying speeds may vary widely depending on environmental conditions. The only way to fully understand and control these factors under realistic manufacturing conditions is to replicate them at the lab scale. The thickness of the coating, drying rates, and uniformity of membrane and electrode layers directly impact fuel cell performance. Flaws such as pinholes or cracks can cause short circuits, reduce fuel cell life, or diminish capacity. Lab-scale roll-to-roll equipment allows researchers to adjust key parameters including web speed, coating gap, slot-die head positioning, and drying temperature profiles. These changes are much harder to make once a material is moved to a pilot line. Perfecting the process early saves time and resources down the line. A key advantage of using a precisely controlled lab-scale roll-to-roll system is the ability to produce reliable, repeatable data. In fuel cell development, small inconsistencies can lead to large variations in electrochemical results. By standardizing process parameters from the start, teams can separate effects caused by the materials themselves from those introduced by processing variability. This consistency is vital not only for in-house research but also for collaboration between academic groups, suppliers, and manufacturers. Slot-Die Coating vs. Spray Coating in Roll-to-Roll Processes When it comes to coating fuel cell membranes and electrodes in roll-to-roll systems, two main approaches dominate: slot-die coating and spray coating. Both methods have distinct advantages and challenges that influence their suitability for lab-scale and industrial production. Slot-die coating involves dispensing a precisely controlled liquid film from a narrow slot onto the moving substrate. It offers excellent control over film thickness and uniformity, making it ideal for thin, highly consistent layers. Because the fluid flow is well managed, slot-die coating reduces material waste and improves repeatability. This precision is crucial for fuel cell membranes and electrodes, where layer thickness can directly affect performance. Spray coating, by contrast, typically involves atomizing a liquid suspension or solution and depositing it onto the substrate. Spray methods are well suited for applying catalyst inks and forming porous layers with good gas diffusion characteristics. However, spray coatings can be less uniform and more prone to defects such as agglomerates or uneven drying, which may require additional process optimization. At lab scale, slot-die coating systems offer tighter control and faster adjustments, which can accelerate development and scale-up. Spray coating, while sometimes simpler to implement, may present more challenges when transitioning to continuous roll-to-roll production due to the complexity of maintaining consistent layer quality. STEP 1:  The substrate is smoothly fed from the roll with precise tension and alignment, making setup quick and reducing the risk of material waste. STEP 2:  Functional layers, such as catalysts or electrolytes, are applied with exact control over thickness and uniformity. This ensures consistent results while minimizing expensive material use and eliminating costly trial-and-error. STEP 3:  The coated layers are quickly dried or cured and rewound onto a roll, ready for the next step. This continuous, streamlined process saves time, reduces handling, and allows seamless transition from lab-scale experiments to larger production. Choosing between slot-die and spray coating depends on the fuel cell chemistry, required electrode thickness, and production goals. Both methods can be integrated into lab-scale roll-to-roll equipment, enabling researchers to evaluate process feasibility and scalability early in development. Anticipating Scale-Up Challenges in the Lab An additional benefit of early roll-to-roll development is the chance to evaluate how well new materials and processes can be scaled. Not every promising lab result can be translated successfully into continuous production. Materials that perform well when processed in small batches may be incompatible with continuous coating, requiring reformulation or substrate changes. Spotting these issues early allows teams to focus on the most promising candidates and avoid costly dead ends. Although lab-scale roll-to-roll systems are critical, they come with challenges. Adapting continuous processes to compact setups demands careful control of web handling, tension, and coating behavior. Many labs also impose special constraints such as inert atmospheres or solvent containment that must be accommodated without losing process accuracy. Drying methods that scale effectively, like infrared or convective heating, must be modified to maintain temperature uniformity and airflow control in the lab. Measurement is another key area that needs special attention in lab-scale roll-to-roll. Inline sensors commonly used in industrial lines to measure layer thickness, solvent levels, or surface treatments are less frequently installed in lab setups. However, these measurements are vital to understanding process trends and pinpointing sources of variability. Integrating data logging and control software can reveal insights into coating stability, tension shifts, and environmental factors like humidity or temperature fluctuations. Such information is critical to confidently scaling up production. Perovskite Connect talks are part of the  full conference agenda . Designing for Scalability From Day One Moving from lab to pilot production involves more than simply increasing web width or speed. It requires a thorough understanding of how materials behave over time, under stress, and in different environments. Planning experiments at the lab scale with scale-up in mind ensures a smoother transition. This includes running tests at relevant speeds, using solvents that are practical for large-scale use, and replicating drying techniques and residence times expected on industrial lines. The closer lab conditions match production realities, the more valuable the findings. Fuel cell development today faces intense pressure to deliver new chemistries fast. Goals like decarbonization, supply chain security, and better consumer products drive this urgency. Efficient use of time and resources is critical. Lab-scale roll-to-roll systems allow multiple formulations and electrode designs to be tested in parallel, manufacturability to be screened, and process parameters to be refined quickly. This flexibility helps developers fail fast, learn fast, and move forward with confidence. Scaling fuel cell production is more than just making more units. It requires a comprehensive understanding of how materials, processes, and equipment interact. Lab-scale roll-to-roll processing is key to building this knowledge. By allowing researchers and engineers to evaluate, refine, and reduce risk early, it cuts uncertainty and lays the foundation for high-yield, high-performance fuel cell manufacturing. In an industry where consistency, safety, and speed to market are essential, investing in lab-scale roll-to-roll equipment and expertise is a necessity. It is the best way to ensure that what works on paper also works on the factory floor.  Laboratory-scale roll-to-roll systems that mimics industrial production lines are essential in the development of new materials and processes within fuel cells. Conclusion Laboratory-scale roll-to-roll fuel cell processing is not just a step in the development pipeline. It is the foundation that determines whether a promising material ever makes it to mass production. By simulating industrial conditions early, researchers can test real-world feasibility, reduce costly surprises, and accelerate the path to commercialization. Choosing the right coating method, understanding material behavior under continuous processing, and capturing reliable data are all crucial to building a process that scales. Lab-scale systems make it possible to explore these factors in a controlled, flexible environment that mirrors full-scale manufacturing. As fuel cell technologies continue to evolve and markets demand faster innovation, companies and research institutions that invest in lab-scale roll-to-roll capabilities will be better positioned to lead. The road to industrial fuel cell production starts in the lab, and success depends on treating it with the same precision, attention, and purpose as the factory floor itself. Perovskite Connect talks   are a part of the  full conference agenda 22-23 October 2025 | Berlin, Germany Download PDF Handout Perovskite Connect talks are part of the  full conference agenda .

TechBlick’s The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is just three weeks away!  This year’s agenda once again covers the state-of-the-art across the full innovation spectrum of additive, sustainable, printed, hybrid, R2R, 3D and wearable electronics.    In this article, we introduce the conference agenda, summarising the innovations that will be showcased as part of the conference program. The list below does not correspond to actual agenda timings.    Please book before 10 OCT 2025 when FINAL early birds end Full agenda | Exhibition floor  | Masterclasses Fuji Corporation Inkjet-printed silver nano-inks on UV-curable substrates for multilayer circuits with embedded components. GE Aerospace Additive RF sensors and packaging for aerospace applications rated up to 1000 °C.   Lockheed Martin Case study on flexible hybrid electronics adoption, incl. copper additive manufacturing and flexible RF circuits.   Valeo Printed and in-mold electronics integration into vehicles, addressing automotive specs and quality demands.   Akoneer Laser-processed multilayer glass PCBs for semi-additive semiconductor packaging, demonstrating high-density interconnections on glass substrates.  AMAREA Technology Multi-material 3D printing of ceramic components with integrated electronics. CEA-Leti Additive PCB fabrication replacing subtractive methods to enable sustainable electronics. NanoPrintek Inkless nanoparticle-based dry printing without sintering via laser particle generation and in-situ sintering. DR Utilight Laser pattern transfer printing enabling 10 μm PV lines or 20 μm solder bumps. Eastman Kodak Roll-to-roll flexography for high-resolution, high-volume printed circuits, surpassing screen printing. ELANTAS Europe Functional pastes for flexible, durable in-mold automotive electronics. Enjet EHD multi-nozzle printing for high-throughput deposition of viscous functional inks. Fraunhofer EMFT Roll-to-roll UV digital lithography enabling seamless, high-resolution flexible circuits. Ceradrop (MGI Digital Technology) Agile PCB and etching production using digital additive manufacturing. Coatema Slot-die coating fundamentals and live demos showing how rheology, tension, and process control define scalable coating windows for R2R production. Hahn-Schickard Multi-material additive manufacturing combines molten metal StarJet printing with polymer processes for 3D embedded circuitry and conformal devices. HighLine Technologies Scalable microextrusion of metals (<20 µm lines at >500 mm/s) for metallization.   Hummink Capillary printing enabling nanoscale (100 nm–50 µm) interconnects, bumps, and biosensors.   iGii 3D carbon nanomaterials via scalable R2R processes for point-of-care diagnostics.  Lithoz Co-printing dielectric ceramics with Cu/Ag for functional multi-material electronic components.   Mesoline Microchannel particle deposition (MPD) for wafer-scale micron-precision material placement.  Wiliot Battery-free Bluetooth IoT tags produced roll-to-roll with printed multi-sensors.  Toyota Cross-industry innovations incl. SMA wire actuators, NIR pigments for hidden data transfer, and metamaterial vibration damping.   XTPL Ultra-precise dispensing for bonding and defect repair.   Würth Elektronik PCB sustainability via selective solder masks and recyclable base materials.  X-Fab Micro-transfer printing of ultra-thin chiplets for heterogeneous integration.   Myrias Optics & UMass Amherst Wafer-scale metaoptics via nanoimprint lithography and nanoparticle inks.   NRCC Canada Volumetric additive electronics manufacturing enabling rapid 3D overprinting of conductors.  Prio Optics Anti-reflective and optical coatings via additive inkjet printing.  Printed Electronics Limited Viscous-jet deposition for highly loaded functional inks (>5k cP), expanding drop-on-demand printing.  Q5D 5-axis laser-assisted processes enabling 3D metallization.  RISE Stretchable circuits via screen-printed liquid metal inks.  Perovskia Solar Digitally printed perovskite PV scaled to 1M units for IoT and consumer devices.   Sonojet SAW-based aerosol printing enabling clog-free, tunable deposition   Please book before 10 OCT 2025 when FINAL early birds end Full agenda | Exhibition floor  | Masterclasses GraphEnergyTech Carbon inks for scalable, low-resistance printed electronics.  Gunter Erfurt  Outlook on EU/US solar manufacturing under Chinese overcapacity; advocates industrial policy and innovation ecosystems.  Hamamatsu NIR laser sintering for greener, energy-efficient printed electronics.  Hareraus Electronics Polymer thick-film conductors with improved solderability and thermal stability.  Heliatek Lightweight flexible PV modules, IEC 61215-certified, produced via R2R multilayer deposition.  Helmholtz-Zentrum Berlin Scaling solution-processed perovskite PV with standardized metrology and data handling.  Henkel Silver/copper inks for hybrid integration and 3D functional electronics.  Heraeus Electronics Printable thick-film heaters using polymer and cermet pastes (incl. PTC) enable reliable, scalable thermal management for automotive and consumer systems.  Holst Centre Closed-loop recyclability for in-mold electronics via recovery of plastics and metals. Hoenle Adhesives Solder-free adhesives enabling durable encapsulation for flexible devices.  ImageXpert Structured printhead evaluation to optimize inkjet adoption.  INO Modular screen printing lines enabling smooth R&D-to-production scaling.  Intellivation Flexible PV via R2R sputtering of barrier and conductor films.  IPVF (Institut Photovoltaïque d’Île-de-France) Paris-Saclay pilot line supports lab-to-fab perovskite manufacturing with qualification across substrates, encapsulants, and precursors.  Karlsruhe Institute of Technology Sustainable interconnections using copper busbars and low-Ag metallization pastes. Please book before 10 OCT 2025 when FINAL early birds end Full agenda | Exhibition floor  | Masterclasses     Nagase ChemteX Property-driven conductive ink selection optimizes resistivity, rheology, adhesion, curing, and stability for reliable printed electronics.  NextFlex Commercialization of additive manufacturing of electronics through a 200+ partner ecosystem.  NGK Europe Ultra-thin semi-solid Li-ion batteries with ceramic electrodes for safe wearables and IoT.  Notion Systems Advancing EHD printing for high-viscosity deposition beyond inkjet.  OET Energy / Coatema Flex2Energy Giga Fab integrates R2R printing, assembly, metrology, and AI for industrial-scale OPV/PV.  Panasonic Self-healing Toughtelon films for slimmer, tougher electronic devices.  SATO Global RFID-driven digital twins enabling real-time manufacturing intelligence and predictive maintenance.  Signify Research Printed LEDs on flexible foils for novel lighting form factors and sustainable devices.  Silicon Austria Labs Life cycle assessment-driven design strategies for sustainable printed electronics.  Sofab Inks Soluble, cost-efficient formulations for scalable perovskite PV.  Solaires Entreprises Slot-die and blade-coated perovskite modules for scalable photovoltaics.  SOLRA-PV Printed encapsulated perovskite solar modules for battery-free IoT and consumer devices.   SparkNano R2R spatial ALD for SnO₂ ETLs, enabling gigawatt-scale perovskite PV production.  Sunray Scientific UV-cured anisotropic conductive epoxy for fine-pitch, pressure-less interconnects with underfill.  Swansea University Transitioning perovskite PV from sheet-to-sheet to R2R slot-die printing tackles uniformity, interconnection, defect mitigation, and stability at scale.  Swift Solar Scaling perovskite–silicon tandems with wafer-level processes, reliability testing, and high-throughput manufacturing.  TracXon Patented R2R VIA fabrication enabling high-density double-sided printed circuits.  Trusscore Electrochromic PVC enabling color-changing wall panels.  TU Dresden Leaf-based lignocellulose substrates with metallized electrodes for eco-friendly flexible electronics.  University of Coimbra Liquid metal composites enabling recyclable, repairable electronics.  University of Glasgow Battery-free, chip-free RF sensors for sustainable monitoring and supply-chain applications.  University of Manchester Graphene inks for multifunctional printed devices and heaters.  University of Rome Tor Vergata Fully printed perovskite PV with ambient processing and >1000 h lifetimes.    Voltera Direct ink write (DIW) prototyping of multilayer flexible circuits accelerates design iteration using screen-print-compatible conductive inks.  Please book before 10 OCT 2025 when FINAL early birds end Full agenda | Exhibition floor  | Masterclasses     3E Smart Solutions / ZSK Enabling scalable, washable, and multifunctional e-textiles via embroidery technology that integrates PCBs, sensors, and electrodes directly into textiles.  AeroSolar Enhancing perovskite film uniformity with Aerosol CVD recrystallization.  Antolin Dynamic automotive interiors using E Ink Prism™ trim surfaces. Armor Smart Films Piezoelectric coatings for sensors, haptics, heating, and medical devices. Auburn University Thermoformed IME circuits replacing wire harnesses and enabling driver-monitoring sensors. Blackleaf Graphene heating inks for efficient, uniform thermal control in flexible foils and coatings. Caelux High-density solar architecture maximizing module output, reducing land use and costs while improving resilience under market volatility. CEA Low-T printing, interface advances, and long-term encapsulation for scaling Si–perovskite tandems. CondAlign Particle alignment for anisotropic films that cut filler use and cost. Conductive Technologies Screen printing high-performance sensors via optimized material stack-ups. CubicPV Decoupled tandem design for durable perovskite–silicon modules, NREL-certified ~22% top cells and ~30% tandems validated by accelerated aging. CurveSYS Sensors Flexible pressure arrays for security sensing, differentiating impacts in real time. DELO High-barrier encapsulants extending perovskite PV lifetimes and efficiency. Fraunhofer IFAM Screen printing of conductive paths, sensors, and actuators enables high-throughput functional integration into industrial components. Fraunhofer ILT Selective laser sintering to optimize conductivity and stability in printed sensors. Fraunhofer ISE Sustainable perovskite PV fabrication addressing toxic solvents and critical materials.   Please book before 10 OCT 2025 when FINAL early birds end Full agenda | Exhibition floor  | Masterclasse s

Authors:  Andrew Stemmerman, John Yundt, Kathy Ritter | SunRay Scientific Inc., Eatontown, NJ USA | andrew@sunrayscientific.com   johny@sunrayscientific.com , kathy@sunrayscientific.com        SunRay Scientific of Wall Township, NJ, USA has developed a versatile interconnection technology for flexible and stretchable electronics on Thermoplastic Polyurethane (TPU) substrates for wearables. This article will outline the developments of this suite of conductive and dielectric stretchable inks with strong adhesion to mechanically flexible substrates, paired with a high-performance magnetically aligned Anisotropic Conductive Epoxy (ACE). The ACE interconnect material, with ferromagnetic conductive particles aligned along the z-axis, forms vertical conductive pathways to connect multiple component styles to the stretchable circuits on flexible TPU. The ACE additionally provides the strong mechanical bond for the components, with the entire assembly capable of surviving wearables’ wash cycles. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend   Introduction Thermoplastic urethane (TPU) substrates, with flexibility, wear resistance and skin-compatibility, are ideal for wearable electronics applications. Wearables require stretchable circuitry with high density for integration and miniaturization. Printable materials enable low-cost electronic circuit fabrication processes.   SunRay Scientific has developed a complementary set of additively printed circuit materials; a conductive silver ink called StretchS and a stretchable dielectric. StretchS ink is a low-resistance polymer thick film silver ink designed for compatibility with SunRay’s ZTACH ®  ACE, an anisotropic (Z-axis) conductive epoxy. This ink is designed to have reduced silver migration and is intended for applications where mechanical performance, environmental stability, low resistance, and cost effectiveness are needed.   SunRay Scientific’s low-temperature thermal-cured anisotropic conductive epoxy offers a way to integrate and miniaturize electronic assemblies without the thermal and mechanical penalties of traditional interconnects. Temperature-sensitive components and low-temperature substrates often force compromises in design and process, while conventional anisotropic conductive adhesives and films depend on controlled pressure and heat, lengthening cycle time and risking damage to components. Thermode bonding adds keep-out constraints and can threaten neighboring features. There is an industry demand for an interconnect that supports fine pitch, cures rapidly at low temperature, protects delicate materials, and reduces total manufacturing cost—without sacrificing reliability.   ZTACH ®  ACE meets that need with a pressure-less, low temperature, 80°C-160°C cure, which consolidates interconnect and underfill into a single operation. An illustration of the novel approach is shown below in Figure 1 . The formulation is a curable resin system loaded with ferromagnetic particles bearing a highly conductive coating. During cure, the magnetic field generated from SunRay’s patented ZMAG ®  Magnetic Pallet causes these particles to align into vertical, z-axis columns across the thin bond-line. These columns create low-resistivity pathways between component terminations and substrate pads while maintaining lateral insulation between adjacent pads, delivering anisotropic conduction. Figure 1.  X-Ray photos of Z-axis magnetically aligned particles in an Anisotropic Conductive Epoxy (ACE)   Because conduction arises from column formation in the epoxy matrix, ZTACH ®  ACE can be stencil-printed or dispensed over all the entire circuit’s component footprints, reducing reliance on intricate, precision-tooled deposits. Alignment tolerances are more forgiving than patterned solder, ECA, and ACA/ACF processes. Figure 2 is an example of a component area, full footprint stencil deposit of ZTACH ®  ACE, clearly illustrating the simplicity of application. This view is prior to a 24-pin Quad Flat No-lead (QFN) package placement and magnetic cure of the epoxy. The result is a scalable, high-throughput process that protects heat-sensitive parts and flexible substrates, enables lower-profile attachments, and miniaturization. The entire assembly process and materials set is compatible with surface mount technology (SMT) manufacturing lines. Figure 2. Large area ACE deposit for bonding a 24-pin device on TPU circuit, without need for individual pad patterning and with easier alignment. Figure 3.  QFN bonded with ZTACH ® ACE Figure 3 is a view of a bonded QFN, with the vertical columns of ferromagnetic particles seen from a side angle.   Figure 4 is a photo of a TPU test vehicle for stretch testing and 85/85%RH testing showcasing the full material set of StretchS conductive ink, stretchable dielectric, and ZTACH ®  ACE bonded components. Figure 4. Test patterns on TPU with SunRay’s stretchable materials set A test demonstrator, seen in Figure 4, was created utilizing printed StretchS stretchable silver ink for the circuitry, with resistors, voltage regulators and LEDs mounted with ZTACH ®  ACE onto TPU for a wearable test product that needed to perform in the field and meet exceptional performance requirements like multiple washing machine cycles.    The level of robustness can be clearly seen in the Figure 5 video link below: Figure 5.  Link to video: https://youtu.be/lDgNNMO0KWM An experimental study to understand ZTACH ®  ACE’s adhesion and performance under active stretching was done. The design involved two TPU circuits laminated into fabric swatches, with ZTACH ®  ACE as the bond between the TPU circuits. In the research illustrated in Figure 6, 11 samples and controls were tested. The ZTACH ®  ACE electrical and mechanical bond remained intact through 100 cycles of fatigue cycling at 30% strain without losing conductivity. Electrical resistance of the bond increased with strain but recovered, returning to value upon release. Figure 6.  ZTACH ®  ACE bond and strain performance testing In another wearable product development, a 3.5” x 6” TPU substrate was used, with 2” x 4.5” of the area dedicated for circuitry and devices. StretchS was stencil printed for the first conductor layer and thermally cured at 125°C for 15 minutes. Next, the dielectric was selectively printed at locations defined for second conductor layer crossovers, where insulation was required, and cured at the same conditions. StretchS was used for the second conductor-crossover layer and cured. We are Presenting in Berlin. Register now to hear our talk at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend   ZTACH ®  ACE was stencil printed over the circuitry on the TPU substrate, using a 0.004” thick stencil.  The ACE was applied in a single print, for bonding all 27 of the components of various package styles.  Devices were SMT resistors, capacitors, diodes, a sensor, and two QFN packages.  One was a thin plastic QFN with 24 terminals at 0.5mm pitch; the other was a transistor. After the components were positioned by a pick-and-place machine, the entire TPU circuit was put over the magnetic pallet and ZTACH ® ACE thermally cured for 125°C for 15 minutes. The populated TPU circuit was then laminated onto the wearable demonstrator. Eight out of eight assemblies had 100% electrical yield.  The assemblies were connected to power, NFC and read temperature accurately.   Another example was a pulse oximeter product demonstration shown in Figures 7 and 8. SunRay’s StretchS silver ink conductor was printed on the TPU flexible substrate, and two components were interconnected to the circuit traces with thermally cured ZTACH ®  ACE. Figure 7.  StretchS conductive ink traces on TPU, with ZTACH ®  ACE bonded devices at the contact ends Figure 8.  The demonstrator Pulse Oximeter made with SunRay’s ink and ACE on TPU (courtesy of Covestro) The final example in this article illustrates the flexibility of a large area TPU circuit with 36 LEDs mounted with ZTACH ®  ACE onto conductive StretchS traces. The flexible circuit can be folded, unfolded, rolled and remain fully functional. The video in Figure 9 captures the flexibility of a TPU electronic device with these high performance, compatible inks and ACE interconnect. Figure 9. Rolling and unrolling of operational 36-LED TPU circuit Conclusion A suite of complementary materials developed for flexible electronics has been demonstrated in high performance wearable applications. The stretchable conductive ink and stretchable dielectric provide strong adhesion to low surface energy substrates, allowing for multilayer conductors with crossovers. Multiple device package styles, from 0201 to 0603 SMT passives to QFNs, can be bonded at the same time with the 80°C-160°C low temperature cure ACE. Strong adhesion, low contact resistance, high x–y isolation and high yield were achieved. The inks and interconnect material set are compatible with standard SMT manufacturing lines. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend What to expect in Berlin? Download Conference Handout