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MicroLED are the ultimate display technology, but the grand challenge of mass transfer at low cost and high yield with variable pixel pitch and no mura effect remains an important theme. On 29-30 NOV 2023, JJ Lee from eLux, Inc. will present at www.MicroLEDConnect.com on their novel simple fluidic self-assembly (FAS) mass transfer process, which positions each µLED by capture of the device in a well structure that also contains the connecting electrodes. This process uses gravity to trap µLED ✅ Simple µLED and substrate structures, recyclable µLED after FSA, and extremely simple and scalable FSA tools. ✅ Handle µLEDs sized from 5 to 200 µm offering flexibility to make a wide variety of displays with resolutions from 400 to 10 ppi or larger. ✅ Assembly speed as high as tens of millions µLEDs per hour on large panels. ✅ µLED emitter area to µLED size ratio adjustable ✅ Fluidic assembly applies relatively low force on the device so brittle materials such as red µLEDs fabricated from AlGaInP can be assembled in the same way as blue and green emitting GaN µLEDs. Slide [1] shows the progress from LED wafer to uLED array, offering also information on eutectic bonding of TFTs and uLEDs as well as on yield, de-trap, orientation control parameters Slide [2] shows how select harvest of known-good dies as well as randomization in the ink ensure that FAS has low defectivity and no stamp mura. The mura from pick-and-place solution is very clear, resulting from wavelength and luminance difference between stamps. In this presentation, µLED structure, the FSA mechanism and selective harvest will be introduced. A comparison between FSA and other mass transfer technologies clearly validate FSA’s advantages. Finally, we will also compare eLux FSA with other recently published FSA technologies. Slide [4] shows a benchmarking table, comparing in detail FSA on TFT glass and FSA on carrier vs PnP and laser transfer. It suggests that the ability to handle known-good dies, avoid mura, achieve self alignment with a simple etc are amongst key advantages Join us on 29-30 NOV 2024 at MicroLED Connect to hear the latest from innovative players in microLEDs and quantum dots from around the world. The speakers include VueReal, Toray Engineering, eLux, Lextar, GE Research, Mikro Mesa, Q-Pixel, Delo, Mojo, Yole and many others Explore the full agenda here www.MicroLEDConnect.com MicroLED Connect is a joint offering by TechBlick and MicroLED-Info, offering the first-ever MicroLED focused series of onsite and online conferences and exhibition. #MicroLED #QuantumDot #Printing #ColorConversion #AR #VR #MR #FutureofDisplays #AdditiveManufacturing #Assembly #MassTransfer #uLEDs #NoMura

How can equipment manufacturers innovate to meet current and future needs of microLED production? You can join us on 29-30 NOV 2023 at https://www.microledconnect.com/ where Katsumi Araki from Toray Engineering Co., Ltd. will present how they are addressing some of these challenges including 1] Handling of ever smaller microLED die with a stable process: as you can see in slide #2, dies size have shrunk and will continue to do so. To give a sense of the transition consider that a traditional LED is >1mm wherea a microLED die can be less than 2um, a shrinkage of 500-1000 times! This require innovative equipment to handle, to transfer, to bond, to inspect, to repair, etc with near perfect yield 2] Efficient repair process: this is a vital challenge in the industry. To highlight the scale of the challenge, as shown in slide 2, consider a 4mm smart watch. This watch will include 500,000 microLED chips. Thus, a 1% defect will translate into 5000 repair tasks, which would take 7 hours with a standard pick-and-place machine. Or consider a 4k TV. This would have 25M chips and thus at 1% defect rate 250000 chips would need to be repaired, translating to 347 hours with a conventional pick-and-place machine 3] Minimizing image discoloration: when mass transfer is performed using the conventional method (e.g., stamp), uneven brightness and wavelenght are transferred as they. This will need to be addressed In slide [3] you can see the entire process chain from LED chip manufacutring to wafer inspection to 1st repair to mass transfer to bonding to inspection to 2nd repair and beyond, showing also where Toray Engineering is innovating Join us on 29-30 NOV 2024 at MicroLED Connect to hear the latest from innovative players in microLEDs and quantum dots from around the world. The speakers include VueReal, Toray Engineering, eLux, Lextar, GE Research, Mikro Mesa, Q-Pixel, Delo, Mojo, Yole and many others Explore the full agenda here https://www.microledconnect.com/ MicroLED Connect is a joint offering by TechBlick and MicroLED-Info, offering the first-ever MicroLED focused series of onsite and online conferences and exhibition. #MicroLED#QuantumDot#Printing#ColorConversion#AR#VR#MR#FutureofDisplays#AdditiveManufacturing#Repair#Bonding#LIFT#Transfer

Future of MicroLEDs: wafer level integration combining III-V devices with CMOS transistors to achieve truly monolithic microdisplay? Daniel Lepkowski and Kenneth Lee from nsc (New Silicon Corp) will join https://www.microledconnect.com/ on 29-30 NOV 2023 to explain how they are enabling and progressing technology. Slide [2] shows the approach to front-end heterogeneous integration enabling wafer-scale CMOS+GaN LED systems. First the circuit is designed using CMOS EDA tools running a custom nsc PDK that allows designers to layout, simulate, and iterate CMOS + LED circuits like never before. Then during the tapeout phase, the CMOS front end is produced using a properly suited 200 mm CMOS process at one of many established CMOS foundries. This front-end CMOS wafer is then integrated with an as-grown GaN-on-Si wafer using a proprietary double layer transfer technique. The wafer is then returned to the foundry where LED devices are fabricated and interconnected with CMOS devices using standard CMOS back-end processes. This enables higher interconnect densities and greater manufacturability than is possible using traditional hybrid bonding schemes. Slide [3] shows how they have achieved this on a 200 mm silicon manufacturing line. The device cross section shows how the heterogeneous integration of CMOS and GaN-on-Si looks like on a 200mm Si wafer. Slide [4] also shows how this integration technique can increase reliability, yield and design freedom of packaging and bonding schemes. In the traditional approach, each LED is bonded to a Si chip. In the new approach (PixelatedLightEngine™ technology), system level integration allows increasing the density of interconnects and shifts the questions of reliability and yield to silicon manufacturing lines. This is an important advance Slide [5] shows how they enable rapid technology development through expertise in all aspects of the CMOS technology development pathway including: PDK development and implementation, hybrid III-V/Si circuit design, device physics and compact modeling, process development, and failure analysis. Join us on 29-30 NOV 2024 at MicroLED Connect to hear the latest from innovative players in microLEDs and quantum dots from around the world. The speakers include VueReal, Toray Engineering, eLux, Lextar, GE Research, Mikro Mesa, Q-Pixel, Delo, Mojo, Yole and many others Explore the full agenda here https://lnkd.in/dXcu5Qeb MicroLED Connect is a joint offering by TechBlick and MicroLED-Info, offering the first-ever MicroLED focused series of onsite and online conferences and exhibition. #MicroLED #QuantumDot #Printing #ColorConversion #AR #VR #MR #FutureofDisplays #AdditiveManufacturing #GaN #CMOS #heterogeneousintegration #Epitaxy #PDK #Wafer

In this presentation, Ronald Maandonks will elaborate on Signify's efforts to drive the transition from a linear to a circular economy. He will highlight the significant advantages that technologies like additive manufacturing bring to customers, with a particular focus on 3D printed luminaires. These luminaires are purposefully designed to cater to specific needs and applications across various sectors. Whether it's achieving performance enhancements with higher efficacies in lumen per watt (lm/W) or delivering superior light quality, meeting diverse aesthetic preferences through different colors, textures, or shapes, or enabling seamless system upgrades, the modular concept lies at the heart of addressing these requirements. By allowing for the exchange or addition of modules, this approach not only preserves the value of the product but also minimizes waste, leading to a substantial reduction in CO2 emissions. Furthermore, this innovative method enhances local production capabilities, empowering the ability to manufacture where the products are sold. Overall, the presentation will shed light on Signify's commitment to sustainability, CO2 reduction, and waste reduction through its transformative approach to lighting solutions. SAVE THE DATE

Andrew Stemmerman & John Yundt SunRay Scientific Inc. Eatontown, NJ USA andrew@sunrayscientific.com johny@sunrayscientific.com SunRay Scientific of Eatontown, NJ, USA has developed a new and innovative approach to electronic component assembly. This article will outline the developments of this technology and show examples of this magnetically aligned Anisotropic Conductive Epoxy packaging method used on various substrates. Progress will be shared for dense and fine pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Introduction Flip-chip die and die-to-die bonding, from dense to fine pitch, typically require solder balls and underfills. Underfill and/or edge encapsulant is often utilized to provide additional mechanical strength and stress reduction. The result is a complex assembly process flow. Localized placement of Anisotropic Conductive Adhesive (ACA) or Anisotropic Conductive Film (ACF) for specific components typically involves the fine-pitchuse of thermocompression bonding, an additional process step that could also be damaging to thin silicon. Another drawback for traditional interconnect materials is relatively slow processes, limiting the utility of such technologies. Development towards a wafer scale compatible packaging method will be shared, using a pressure-less and low-temperature magnetically aligned Anisotropic Conductive Epoxy (ACE). Figure 1. Flip Chip assembly comparisons: traditional solder balls & underfill attachment (Left); Die attach with z-axis magnetically aligned conductive epoxy (Right) A summary of the novel approach is shown above in Figure 1. First, ferro-magnetic particles dispersed within an epoxy are coated onto a substrate. The ferro-magnetic particles form z-axis magnetically aligned columns, fixed in place during the die-to-substrate cure process without any pressure applied. The formation of the columns during the curing process is illustrated in Figure 2. This technology simplifies the assembly process to a single adhesive application, which provides both electrical interconnection and mechanical reinforcement. No additional underfill material is needed. Fine patterning is not required as the entire area of the component target location is deposited with epoxy. The device alignment process is more forgiving relative to solder ball-to-solder pad alignment. Z-axis columns align after component placement, magnetic pallet exposure and cure is achieved. Figure 2. X-Ray photos of Z-axis magnetically aligned particles ferromagnetic in an Anisotropic Conductive Epoxy (ACE) Thermal or UV curing methods complete the component attachment without any thermocompression (cure method is epoxy formulation dependent). Thermal curing occurs within the 80°C to 160°C temperature range. This article outlines the developments of this technology and shows examples of this magnetically aligned Anisotropic Conductive Epoxy packaging method used on various substrates. Progress will be shared for dense and fine-pitch Land Grid Arrays (LGA) on a semi-rigid interposer. Additionally, advancements made for die-to-die bonding will be presented as well as updates towards achieving ≤ 60-micron pitch. Other proposed direct die-attach packaging concepts will be illustrated. Example #2 covers development work performed on attaching a 126-pin Land Grid Array (LGA) bare die to a polymer semi-rigid multi-layer substrate. The use of the substrate resulted in multiple challenges for bare die attach. The non-planarity of the conductive circuit pads was one issue. The electrical resistance variation between pads had to be minimized for optimum performance. The non-uniformity of the substrate’s conductor pads is evident in the photo on the left. The schematic on the right illustrates how the ACE material allows for “leveling” in connecting the bare die to the non-planar substrate. Figure 3. 126-pad semi-rigid substrate (Left) and illustration of bond between die and substrate Additional learning during this work was in identifying trapped moisture within the polymer-based substrate as a cause for voids in the ACE during cure. These bubbles not only prevented connection in some cases but interfered with proper z-axis column formation. Prebake for the substrate was added as a step for this particular type of assembly. Two formulations were the focus of the work in Example #3. These were the Fine particles ACE and the Ultra Fine particles version. Stencil thicknesses of 0.001” to 0.005” were studied, as this tool has the most impact on establishing bond line thickness. The target for choosing the best formulation, tool and bond line thickness was lowest average resistance values with lowest deviation among the 126 pads. Iterative testing was done. “Heat maps” based on the 126 pad locations were created to visually observe resistance values within set target and acceptance ranges. The next two Figures show results from early work on process development with each epoxy formulation and stencil tools, to the progress made with the final choices on material and stencil thickness. Ultimately the Ultra Fine particles ACE with a 0.001” thick stencil was chosen for this LGA-to-substrate assembly application. Summary Table 1 shows the results of the chosen ACE and stencil, and Figure 6 is a cross-section from the development study. Figure 4. Pad-by-pad resistance measurement studies, early iteration (Left: Ultrafine, Right: Fine) Figure 5. Pad-by-pad resistance measurement studies, final iteration (Left: Ultrafine, Right: Fine) Table 1. Summary of performance metrics (continuity, resistance & deviation, pad-to-pad) Figure 6. Cross-section of component attached and electrically connected with the Z-axis ACE (Photo courtesy of Rochester Institute of Technology) Example #2 takes the LGA and Substrate subassembly to the next level, a large area 8” x 10” circuit board populated with four of the subassemblies plus components of various sizes and function. This larger assembly involves attaching all the multiple components and subassemblies in one ACE attachment process. Passives range in size from as small as 0201 up to 2220. Other devices are a 26-pin SMT connector and SoICs. This project is underway, and results will be shown by SunRay at TechBlick live in October. Fine-pitch die-to-die bonding with the ACE is the third example. The development methodology is like the other projects. An initial focus was on measuring continuity and resistance at pad sites as part of identifying the optimum process parameters and stencil tool for this application. The degree of difficulty is greater with finer pitch. Dense arrays of 60 microns pitch die, with 30 microns pads and 30 microns spacing, were used. Join the FREE-TO-ATTEND Winter Festival to Hear About the Latest Innovations Spaces are LIMITED on a first come first served basis A Design of Experiments (DoE) was established for the stencil studies. Laser profilometry was used for 3D and 2D scans of the two surfaces to be bonded, as was employed for observing the non-planarity of the semi-rigid board in Example #1. All initial steps were done manually: hand stencil printing, die placement with die bonder, batch oven cure and electrical probing. Prior to using fully functional devices, Quartz substrates patterned with the top layer of each die in the bond pair, were procured and used in early studies. The purpose was to provide enhanced analysis of the bonded die pair before, during, and after bonding/curing has occurred. Bond parameters were observed at each step of the process: pre-bond, bond, and post alignment & cure. Figure 7. Left: Target overlay of quartz substrates; Middle: ACE deposit before bond; Right: Post-bond, before z-axis alignment and cure Due to the finer pitch requirements, the test vehicles have a nickel layer applied during wafer fabrication, at the bond pad locations. Past experimentation, as pictured in Figure 8, has shown nickel application may lower the resistance of the bonded circuit by directing column formation to the metallized bond pad boundary, the nickel pads, acting as localized magnets, attract column formation during exposure to the magnetic pallet. This only applies to the bond pads themselves, to concentrate the ferromagneticmetalized particles within the ACE more towards the connection points. This creates a higher density of columns within each pad. Figure 8. Left: No nickel interlayer and ACE; Right: ACE after cure with Nickel interlayer layer in pads Conclusion Besides the addition of the nickel layer to the functional die, key parameter targets were updated for the project’s next phase. In the short-term alignment, fiducials on the quartz plates were updated to improve bonding in X, Y, and theta; and the size of test probe pads were increased to improve accuracy and reduce testing time. The development efforts for all three examples are still underway. The conclusions thus far are: Successful demonstrations of Heterogenous Packaging using z-axis magnetically aligned epoxy for structural & electrical bonding. Similar established process techniques and test methodologies are usable across applications, although each has unique requirements. The Ultra Fine particles ACE formulation has the best performance for finer pitches and more challenging alignments. Uniform bond lines between device pads are critical for optimum electrical performance. Excellent performance results were obtained, even with manual assembly techniques. Performance will improve with automation. In concept this z-axis magnetically aligned conductive epoxy approach could integrate multiple silicon wafers on top of each other, creating the possibility for an exceptionally dense integrated System-In-a-Package (SIP). Processing temperatures can be as low as 80°C, opening room for alternate substrates and biocompatible assemblies. This anisotropic epoxy is not limited to specific device attachment; it can be used to bond multiple component sizes and styles across an entire substrate. Join the FREE-TO-ATTEND Winter Festival to Hear About the Latest Innovations Spaces are LIMITED on a first come first served basis

Recent advances in Additive Manufacturing (or 2D and 3D Print) have poised many of these technologies to displace or augment traditional electronics manufacturing methods, yet significant further advances are still needed in order to obtain broad adoption for high-volume manufacturing of electronics devices. After presenting a view of how additive manufacturing methods could be leveraged for wearable AR/VR devices as well as highlighting the benefits of additive methods, I will dig into key areas where significant developments are still needed, including: component-level and device reliability; design tools; close-loop in-situ process monitoring; integrated manufacturing workflows; productivity and yield; and material properties. I will then conclude with a few application examples, highlighting unique solutions promised by additive methods as well as gaps which remain. SAVE THE DATE

Company: Syenta Speaker: Jekaterina Viktorova SAVE THE DATE

Brewer Science's vision is to design, build, and deploy connected gas and water sensors that monitor environmental contaminants quantitatively on a large scale. For the last 10 years, Brewer Science has developed the technology to print cost-effective sensors that can measure contaminants in water, such as heavy metals (lead, cadmium), copper, nitrate, pH, and ORP, as well as sensors that assess air quality by measuring gases like carbon monoxide, carbon dioxide, hydrogen, VOCs, and oxygen. Brewer Science fabricates a variety of printable sensor materials and deposits them onto a substrate utilizing processes such as physical vapor deposition (PVD) sputtering, screen printing, stencil printing, ink-jet printing, and high-speed jet dispensing. Producing low-cost sensors with low-power electronics and wireless communication will enable the deployment of sensors over vast areas for real-time monitoring of environmental conditions. SAVE THE DATE

The convergence of lab-based discoveries and industry-need created reimagined products based on stretchable and/or flexible substrates.Soft electronics made of silicone were translated into a printed technology to create smart bedding products to monitor aged-care residents and improve quality of care. Working closely with manufacturers, the evolution of the technology from stretchable electrodes to a sensor array across a mattress, will be covered. This approach represented a new take on production of electronic textiles.Combining flexible substrates with surface mount components, composite structures have created a category of modular sensing skin patches. Based on clinical need, different sensor combinations have been utilised for aged-care health monitoring, with potential use cases targeted to dementia care and post-operative management. SAVE THE DATE

IoTech is introducing a new and patented digital additive manufacturing technology: the Continuous Laser-Assisted Deposition or CLAD. CLAD is a breakthrough multi-material production process for electronics, from semiconductor packaging to flexible electronics. CLAD enables the fast, precise, high-resolution, and high-volume deposition of most industrial materials, no reformulation required. Manufacturers can - use their standard industrial materials, - control the deposition of every single drop, - print at up to 30µm resolution and, - reach unmatched production yields. The system is fast, contactless, high-resolution and micron-accurate. It enhances manufacturing flexibility for advanced electronic designs. CLAD enables more compact, powerful product functionalities in a wide range of applications. It is compatible with most conductive and dielectric fluids, even of high viscosity. CLAD is also ESG-compliant and labour-efficient. It provides an alternative to highly polluting subtractive technologies, enabling the re-shoring of production processes to OECD countries SAVE THE DATE

Name:Łukasz Kosior Company: XTPL XTPL provides additive manufacturing technology and conductive materials at the micron scale to address complex issues in the advanced electronics industry. The company has developed its own solutions that allow for extremely accurate printing of functional features at the micron level with high resolution. This capability extends to both planar and non-planar complex substrates, including the ability to print continuous and highly conductive interconnections oversteps. In our presentation, we will showcase the available solutions for next-generation Flexible Hybrid Electronics, Advanced IC Packaging, and Flat Panel Display applications. Additionally, we will present our plans to introduce Ultra-Precise Deposition technology to the industry. SAVE THE DATE

Speaker: Ashok Sridhar Company: TracXon Printed Electronics is experiencing a strong growth phase of late. To sustain this growth and to turn the hype into actual products in the market, it is necessary to come up with new business models that provide demonstrable value to companies that want to adopt Printed Electronics in their products. Such added value should go above and beyond product-related benefits such as flexibility, stretchability, conformity, etc. At TracXon, a Netherlands-based foundry for Printed Electronics, we offer unique business models that can aid broader penetration of Printed Electronics products, by lowering the barrier to entry for OEMs and Tier-1s across domains such as automotive, healthcare, IoT, consumer electronics, etc. SAVE THE DATE