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Author: Masoud Mahjouri-Samani | info@nanoprintek.com For decades, printed electronics has promised a future of rapid, flexible, and low-cost manufacturing. From wearable sensors and smart packaging to flexible antennas and next-generation energy systems, the vision has been compelling. Yet despite impressive progress, many technologies still struggle to transition into reproducible manufacturing platforms. Besides the challenge of what materials can be printed, the greater challenge is whether they can be manufactured reliably, repeatedly, and independently of fragile material supply chains. Traditional printed electronics rely heavily on highly engineered liquid formulations composed of nanoparticles, solvents, binders, surfactants, dispersants, rheology modifiers, and proprietary additives. While these formulations enable printing, they also introduce a significant burden on manufacturing consistency and qualification. Small variations in ink composition, aging, storage conditions, viscosity, or supplier changes can drastically alter print performance and final device characteristics. Even more challenging, many inks are proprietary and evolve over time. Suppliers may discontinue formulations, modify ingredients, or change processing routes, forcing manufacturers and researchers to repeatedly recalibrate and requalify processes. For industries requiring long-term reliability, including aerospace, defense, medical systems, and energy infrastructure, this creates substantial barriers to adoption. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in action. NanoPrintek was founded on the belief that the future of advanced manufacturing requires a fundamentally different approach. Instead of relying on liquid inks, NanoPrintek’s technology directly uses solid raw materials, including metals, ceramics, dielectrics, and composites, to generate nanoparticles in real time during printing, without ink, solvents, binders, or post-processing steps. This transforms manufacturing from a formulation-dependent process into a physics-defined process. In traditional workflows, qualification often becomes an ongoing challenge because even small changes in ink chemistry may require revalidation of electrical performance, adhesion, curing conditions, reliability, and environmental stability. In contrast, direct-from-raw-material manufacturing offers a pathway toward more stable and repeatable process definitions rooted in measurable physical parameters. This is especially important as industries increasingly seek supply-chain resilience and domestic manufacturing capabilities. Instead of depending on specialized liquid formulations with limited shelf life, manufacturing can be performed directly from stable solid materials that are easier to source, store, transport, and standardize. We are presenting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and listen to our presentation. We are presenting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Artificial intelligence further strengthens this vision. With NanoPrintek’s AI-enabled Smart Manufacturing Interface (AI-SMI) module, manufacturing evolves beyond static process execution into a continuously learning system. Process conditions, print outcomes, and characterization data can be streamed directly into AI-driven optimization frameworks that autonomously identify improved manufacturing parameters. This enables closed-loop process optimization in which the system can design, print, characterize, learn, and refine process conditions with minimal human intervention. As manufacturing becomes increasingly digital and AI-assisted, reproducibility and scalability become easier to achieve across different users, facilities, and applications. The combination of ink-free manufacturing and AI-driven optimization creates a powerful foundation for next-generation electronics production. The impact of this approach is particularly compelling in aerospace, defense, and remote manufacturing environments where logistics, reliability, and adaptability are critical. Eliminating liquid ink reduces storage complexity, contamination risks, and material degradation concerns while enabling on-demand manufacturing in locations where conventional supply chains may not exist. At its core, NanoPrintek represents a shift in how advanced manufacturing is defined, toward digitally programmable, physics-based manufacturing systems designed for reproducibility, sustainability, and resilience. The future of printed electronics will be defined by not only what we can print, but also by how reliably, intelligently, and independently we can manufacture it. NanoPrintek is helping define the future of standardized, qualified, and supply-chain-resilient electronics manufacturing.

Picture: Ms. Jennifer Lin, AUO Corporation Vice President of Innovation Development, and Mr. Ness Benamran, Aledia Chief Financial Officer, announced the partnership in the presence of the Minister of Economic Affairs of Taiwan, Mr. Kung Ming-Hsin Grenoble, France & Hsinchu, Taiwan - April 10th 2026 -AUO Corporation ("AUO") and Aledia today announced a strategic partnership to develop a new generation of microLED display technology combining high brightness, low power consumption, and high resolution. The collaboration will integrate Aledia's high-voltage microLED {µLED) technology-based on its proprietary 3D nanowire architecture-onto AUO's advanced display backplane. MicMiD project for enhanced microLED displays The project has been selected as part of the France-Taiwan cooperation funding program, announced in Paris on March 31, 2026, in the presence of representatives from both governments and industry. The objective is to enable energy-efficient, high-performance displays addressing the growing demand for next-generation display technologies. By combining AUO's expertise in display engineering and system integration with Aledia's microLED technology designed for high-volume semiconductor manufacturing, the partnership aims to accelerate the industrialization of microLED displays and support their adoption across emerging applications. Beyond display use cases, the collaboration also opens opportunities in adjacent domains such as optical interconnects for Al data centers and microLED-based solutions for augmented reality devices. "This marks the beginning of a close and strategic partnership between AUO and Aledia. While we are starting with displays, we are looking to extend our collaboration beyond, opening opportunities in optical interconnects for Al data centers, as well as augmented reality glasses." said Ness Ben am ran, CFO of Aledia. AUO and Aledia acknowledge the support of the Taiwanese and French governments in fostering this collaboration, which contributes to strengthening innovation ecosystems and advancing microLED technologies on a global scale. The partnership was formally introduced in Paris in the presence of Taiwan's Minister of Economic Affairs Mr. Kung Ming-Hsin, French and Taiwanese public organizations, and participating companies. ''AUO is aggressively pushing next-generation display technologies based on microLED. On my wrist, I wear the world's first microLED watch, which is the result of more than one-decade efforts of development. Our ambition is to bring this technology to every consumer, and we expect Aledia's unique 8-inch silicon-based 3D nanowire technology can help us to scale it to the next level." said Jennifer Lin, Vice President of Innovation Development, AUO. Acknowledgments AUO and Aledia thank the organizations supporting this initiative, including the French Direction Genera le des Entreprises (DGE), Bpi France, the France 2030 investment plan, the Taiwanese Industrial Technology Research Institute (ITRI), the Taiwanese Department of Industrial Technology (DOIT), and Taiwan Ministry of Economic Affairs. Technical Contact Eric BUTAUD - Senior Director Product Marketing +33 6 15 95 20 11 eric.butaud@aledia.com Press contact Nathalie N ERi - Communication, Marketing & Customer Relation officer +33 6 85 23 50 27 Nathalie.neri@aledia.com

Author: Varun Vohra, Engineering Department Manager, Brilliant Matters | v.vohra@brilliantmatters.com Organic Photovoltaics (OPVs) for Solar Heat Gain (SHG) Mitigation Buildings are among the largest contributors to global energy consumption and greenhouse gas emissions, accounting for a significant portion of worldwide energy-related CO₂ output. They are responsible for roughly one-third of global final energy use, with operational energy demand dominated by heating, ventilation, and air conditioning (HVAC). In modern commercial and high-performance residential buildings, HVAC systems typically represent 30% to 60% of total building energy consumption [1]. In recent years, buildings with high glazing ratios or window-to-wall ratios (WWRs) exceeding 70% have become increasingly common worldwide. This trend has been enabled by advances in high-strength glazing materials and window-frame engineering, which allow large glass façades to be implemented safely while enhancing daylight access and spatial openness for occupants. However, high WWRs also substantially increase cooling demand, often making HVAC systems the dominant contributor to building electricity consumption, accounting for more than 75% of total electrical use in some cases [2]. Conventional glazing lets through a large fraction of near-infrared (NIR) solar radiation (700–2500 nm), which carries more than half of the sun’s thermal energy. Transmitted NIR radiation is absorbed by interior surfaces and re-emitted as heat, increasing indoor temperatures and driving up cooling loads. Technologies that selectively filter NIR radiation, such as those used in Burj Khalifa, directly address this challenge by mitigating SHG at the façade and glazing levels. Similar to conventional solar heat-blocking technologies—i.e., solar control films that reflect or absorb NIR radiation, OPV panels strongly attenuate NIR transmission while preserving usable visible light transmission and maintaining aesthetically pleasing, neutral or soothing colors. As global roadmaps and agency reports consistently identify buildings as a key sector for energy efficiency and decarbonization [3], OPV panels demonstrate strong potential as next-generation SHG mitigation technologies that can simultaneously reduce HVAC loads and contribute to on-site power generation, thereby improving the overall energy efficiency of modern buildings without compromising architectural design. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in action. Brilliant Solutions for Next-Generation Energy-Saving Windows Unlike conventional silicon PV panels, which are manufactured through energy-intensive processes, flexible OPV panels are produced using low-temperature, high-throughput, and high-yield roll-to-roll techniques similar to newspaper printing (Figure 1a). As a result, OPV panels can achieve energy payback times that are significantly shorter than those of conventional PV technologies [4]. Since they typically weigh less than 1 kg/m² and, in many cases, around 0.5 kg/m²—about 20 times lighter than silicon PV panels—they impose minimal additional structural loads and reduce stress on building structures. Despite their favorable weight, form factor, and NIR-blocking capability, OPV panels have not yet achieved widespread adoption. Figure 1: (a) Photograph of roll-to-roll manufacturing of OPV prototypes, provided by PHD Semicon, a Brazilian semiconductor company specializing in the large-scale printing of flexible OPV panels; (b) Schematic representation of the multilayer structure of an OPV panel. The first barrier to widespread adoption has been the limited advancement of active layer systems in commercial OPV modules over the last decade, resulting in stagnation in operational power output and lifetime. Throughout that decade, commercial OPV panels relied on the same organic semiconductor system in the active layer—i.e., the key layer responsible for absorbing sunlight and converting it into electricity (Figure 1b). While this pioneering industrial active layer played an important role in launching the industry and enabling the development and optimization of roll-to-roll manufacturing processes for OPV panels, the technology continued to exhibit limited performance, with power outputs stagnating at around 30 W/m² under standard test conditions and operational lifetimes restricted to approximately five years. Drawing on Brilliant Matters’ expertise in chemistry, ink formulation, and engineering, alongside years of collaboration with leading printed electronics manufacturers, we commercialized the BM7 active layer solution in 2025. BM7 is produced via low-complexity synthetic routes and without toxic precursors, making this OPV solution highly scalable while maintaining production costs compatible with mass-market adoption. Additionally, BM7 was developed to ensure hassle-free manufacturing of industrial OPV panels by focusing on producing high-quality, defect-free active layers. Commercial 32-cell OPV panels employing BM7 active layers produce 60–70 W/m² and open-circuit voltages of approximately 25.6 V (0.8 V per cell) under standard test conditions. Their outdoor operational lifetime is estimated to be approximately 10 years, a significant improvement compared to the aforementioned first generation of OPV panels. As a result, BM7 has emerged as the market-leading active layer for see-through flexible and lightweight commercial PV panels, paving the way for the large-scale adoption of OPV technology, particularly for retrofitted building-integrated photovoltaics (BIPV) applications. Figure 2: OPV-based BIPV window modules developed and manufactured by OET Energy Technologies, a Greek pioneer in advanced roll-to-roll manufacturing of semi-transparent OPV panels for next-generation BIPV applications, seamlessly integrated onto building glazing for energy-generating architectural façades; and self-powered roller shades with integrated OPV panels from PHD Semicon. In fact, BIPV provides an ideal framework to address the second major barrier to the widespread adoption of OPV technology, namely, the lack of clear real-world case studies demonstrating the short monetary payback time (MPBT) and high return on investment (ROI) of OPV panels. When applied to transparent surfaces such as the glazing of modern or high-rise buildings, BM7’s subtle tint can create a visually soothing atmosphere for occupants while still allowing views of the outside. This soft blue coloration resembles the tone of the sky, allowing OPV surfaces to blend naturally with surrounding environments. The lightweight flexible panels, which are less than 1 mm thick, can easily be retrofitted with minimal cost to existing façades and glazing or integrated into modern smart designs like self-powered roller shades, all of which generate electricity while providing solar control (Figure 2) [5]. The panels block more than 75% of radiation in the 700–1400 nm range and approximately 95% in the 1400–2500 nm range (Figure 3a). To assess the thermal control capacity of BM7 panels, we simulated SHG in buildings with high glazing ratios using an acrylic box with one side exposed to a halogen lamp—i.e., artificial sunlight. A mild temperature rise of 14°C over 15 min was observed when the BM7 panel was applied to the exposed side of the building model, which is significantly lower than the approximately 40°C rise measured for the uncoated building model (Figure 3b). This experiment also confirms that BM7 panels provide superior thermal control compared to a commercial solar-control film under identical conditions, as the latter produced a higher temperature increase of 20°C, highlighting the potential of BM7 panels to reduce cooling demand and associated energy costs [6]. Figure 3: (a) UV-Vis-NIR spectrum of BM7 panels along with solar spectral irradiance and (b) SHG experiment results of BM7 OPV panels compared to conventional solar heat-blocking films. SHG experiments were carried out by GSI Creos, a key Japanese player in advanced materials and technology development. Applying conventional solar heat-blocking films to apartment windows can generate annual energy savings of 9–16% in Mexico [7]. Depending on location, solar exposure, WWR, baseline glazing performance, and building characteristics, even higher savings may be achievable. Based on findings from the Mexico study and previous customer case studies, installing BM7 panels in the southern United States is expected to reduce HVAC energy demand by more than 10%, consistent with reported SHG mitigation benefits associated with solar-control glazing technologies. However, the magnitude of HVAC-related savings will vary depending on building envelope properties, HVAC system configuration, shading conditions, orientation, and local climate. For a modern industrial building with 240 m² of glazing, installing BM7 OPV panels across all available surfaces would cost under US$170,000, with estimated annual savings of approximately US$60,000 from reduced HVAC demand and an additional US$5,000 from on-site energy generation. This illustrative case assumes a conservative power output of 50 W/m² and an operational lifetime of 10 years, while excluding any government incentives. Under these assumptions, the BM7 OPV panel-based system would deliver an MPBT and ROI of approximately 2.7 years and 280%, respectively. These results demonstrate that, beyond their energy-generation capability, BM7 OPV modules can provide substantial operational cost reductions through simultaneous HVAC load mitigation. Although the projected economic performance remains sensitive to site-specific factors such as electricity prices, solar exposure, orientation, and shading conditions, the system compares favorably with similarly sized silicon photovoltaic installations by offering a substantially shorter MPBT while remaining near the upper end of the typical ROI range. Summary and Outlook In conclusion, BM7-enabled OPV technology represents a meaningful advancement in retrofitted building-integrated energy solutions, addressing SHG mitigation, on-site power generation, and seamless architectural integration. By overcoming historical limitations in performance and lifetime, BM7 enables the practical and economic deployment of OPVs at scale. As the industry moves toward more distributed energy models such as low-voltage DC microgrids in commercial buildings, the concepts of delivering “power where it is needed” and “efficient energy use to reduce overall demand” are gaining traction, positioning integrated OPV systems as a natural fit for next-generation building design. In parallel, BM7 OPV panels contribute to contemporary aesthetics. Their subtle blue hue complements modern architectural design while minimizing visual impact, blending naturally with elements such as the sky seen through glazing surfaces (Figure 4). Figure 4: View of the Tokyo metropolitan area from the GSI Creos headquarters seen through conventional glazing and through a BM7 OPV panel. Looking ahead, continued progress in materials and system integration is expected to further expand the role of OPVs across both new construction and retrofit applications, thereby supporting broader decarbonization efforts. Brilliant Matters welcomes collaboration with partners seeking to integrate OPV technology into their projects. Stakeholders are encouraged to engage with our team to explore tailored solutions that combine performance, cost efficiency, and design integration. Join the flagship TechBlick events in California on 10-11 June 2026, and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the California event will also feature. The Future of Wearables Reshaped References [1] Ryu, D.; Yoo, W. Ventilation-dominated energy savings in large commercial buildings: Multi-measure assessment revealing HVAC optimization priorities for hot-humid climates. Case Stud. Therm. Eng. 2025, 74, 107034. https://doi.org/10.1016/j.csite.2025.107034 [2] Abdou, Y; Kim, Y.K.; Abdou, A.; Anabtawi, R. Energy Optimization for Fenestration Design: Evidence-Based Retrofitting Solution for Office Buildings in the UAE. Buildings 2022, 12, 1541. https://doi.org/10.3390/buildings12101541 [3] https://www.ipcc.ch/report/ar6/wg3/chapter/chapter-9/ https://www.iea.org/energy-system/buildings [4] Yue, D.; Khatav, P.; You, F.; Darling, S.B. Deciphering the uncertainties in life cycle energy and environmental analysis of organic photovoltaics. Energy Environ. Sci. 2012, 5, 9163-9172. https://doi.org/10.1039/C2EE22597B [5] https://opv-installations.com/building-integration-biopvs/ https://www.nacleanenergy.com/alternative-energies/introducing-the-orenge-printed-semiconductor-shade-system [6] https://www.3m.com/3M/en_US/home-window-solutions-us/solutions/energy-savings/ [7] Chavez-Galan, J.; Almanza, R. Solar filters based on iron oxides used as efficient windows for energy savings. Sol. Energy. 2007, 81, 13-19. https://doi.org/10.1016/j.solener.2006.06.009 This year, the Berlin event will also feature: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED

Author: Jurgen Westerhoff | jurgen.westerhoff@spgprints.com Why printed electronics projects succeed or fail at the business case stage Printed electronics has moved well beyond the experimental phase. Applications such as RFID antennas, in-mould heaters, biosensors, and energy components are increasingly transitioning into industrial-scale production. The technical promise is clear: lightweight designs, scalable manufacturing, and new functional integration possibilities. Yet many projects stall at a critical point — not because the technology fails, but because the business case remains unclear. In most development trajectories, technical feasibility comes first. Teams focus on whether the application works: signal performance, resistance levels, feature resolution, and material compatibility. These are essential steps. Without them, there is no viable product. However, technical validation alone does not justify investment. A recurring issue in printed electronics projects is that financial validation happens too late. Organizations often confirm that a product works before asking whether it can be produced profitably, reliably, and at scale. This creates a structural risk. By the time cost models, yield assumptions, and capital requirements are analysed, significant time and resources have already been committed. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in action. Two dimensions that define a viable business case 1. Product economics At scale, small process variations translate into significant financial impact. Key variables include: Cost per unit of output Yield and repeatability at production speed Sensitivity to raw material costs such as silver volatility Competitive positioning against alternative production technologies In high-volume applications such as antennas, material consumption alone can determine profitability. Even marginal improvements in ink deposition or yield can shift the economics substantially. 2. Capital investment Beyond unit economics, investment decisions depend on: Required CapEx and installation timeline Total Cost of Ownership (TCO) Expected return on investment (ROI) Alignment with growth strategy A common pitfall is improving individual components without considering system-level performance. Printed electronics production is an interdependent system where throughput, yield, material usage, and uptime are tightly linked. Business cases fail when this system perspective is missing. We are presenting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and listen to our presentation. We are presenting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. As production scales, consistency becomes more important than peak performance. The key question becomes: can it work continuously, predictably, and within defined cost limits? Achieving this requires alignment between equipment, process parameters, and application requirements. To help with this analysis SPGPrints made an ROI calculator to find out the financial differences between flatbed and rotary screen printing: Printed Electronics ROI Calculation Tool The role of an integrated technology partner For many organisations, bridging the gap between feasibility and a robust business case requires more than in-house engineering. It requires a partner that understands both process performance and production economics. SPGPrints approaches printed electronics from a system perspective, combining rotary screen printing technology, screen manufacturing, and application expertise. This integrated approach reduces variability between process steps and enables more predictable outcomes at production scale. Rather than focusing on individual components, the emphasis is on line-level performance: consistent ink deposition, controlled feature definition, and repeatable results at industrial speeds. These factors directly influence yield, material efficiency, and ultimately cost per unit. In parallel, application specialists support the translation of technical parameters into economic models. By linking process settings to cost drivers such as silver consumption, uptime, and scrap rates, organisations can build more accurate and defensible business cases. Successful projects bring technical and financial evaluation together from the start. Instead of sequential decision-making, they model cost-per-output alongside feasibility testing, validate yield under realistic conditions, and assess sensitivity to process variation. This reduces the risk of late-stage surprises and strengthens internal decision-making. Conclusion: Treat the business case as a design parameter Printed electronics projects do not fail due to lack of innovation. They fail when economic validation lags behind technical progress. By integrating financial analysis early, focusing on system-level performance and working with partners who understand both technology and production conomics, organisations can move beyond feasibility and build a credible path to scale. The key shift is simple: treat the business case not as a final checkpoint, but as a core design parameter from the outset. Join the flagship TechBlick events in California on 10-11 June 2026, and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the California event will also feature. The Future of Wearables Reshaped This year, the Berlin event will also feature: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED

Author: Kyle Pucci | pucci@imagexpert.com At ImageXpert, we design inkjet development platforms with one goal in mind: enabling users to develop, validate and scale applications with confidence. In this context, curing is no longer a downstream step. In advanced functional and industrial applications, even small changes in UV dose, wavelength or timing can determine whether a printed layer performs as intended—or fails later during testing or scale-up. Collaborative Success Traditionally, curing has been treated as a secondary consideration in inkjet R&D, often handled using stand-alone lamps or externally controlled units. However, as applications become more demanding, this separation can limit development accuracy and process understanding. To overcome this, ImageXpert has partnered with IST INTECH to bring fully integrated UV-LED curing directly into our JetXpert printing platforms. By embedding it within the core system architecture, ImageXpert enables users to treat curing as a fully controllable and optimisable process parameter—alongside jetting, motion and fluid behaviour. Adjustable Operating Window A defining strength of ImageXpert equipment is flexibility. Our platforms are built to support a wide range of applications, allowing users for example to evaluate different fluid chemistries and viscosities, jetting and long-term reliability, layer application and thicknesses, print process speeds and quality seamlessly. All towards end-use requirements—and within a single system. The integration of a modular UV-LED solution extends this flexibility towards investigating curing processes. Users can explore a wide operating window of output levels ranging from approximately 3–28 W/cm² using a single adjustable lamp head. This enables rapid comparison of curing strategies directly within the ImageXpert platform. Lower-power pinning can also be simulated through software control or via integration of compact pinning units. Arc lamps can be integrated additionally when required. Print Pod _ UV LED Pin As Kyle Pucci, Director of Applications Engineering at ImageXpert, explains: “When our customers are first getting started with a new inkjet application, there are so many things to learn in the jetting and printing process, including the right way to cure their material for top performance. The ability to avoid committing to a fixed curing setup early on—and instead adapt it as development progresses—gets a tremendously positive response from users.” We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in action. Fully Integrated, Open Architecture ImageXpert platforms are built around an open and fully integrated control architecture. The curing system is not an add-on—it is embedded within the same control environment as the printheads and motion system. This means lamp settings, triggering and output levels can be managed directly through the ImageXpert user interface, providing the same level of programmability and synchronisation as every other process parameter. Complex, multi-step processes can be developed dynamically, with curing precisely aligned to jetting and substrate movement. Multi-Wavelength Capability To support the broad application scope of ImageXpert equipment, multiple wavelengths—including 365nm, 385nm, 395nm and 405nm—can be configured within a single system. This capability allows users to work with advanced and specialised chemistries, including those requiring multi-wavelength exposure for optimal cure depth and adhesion. Where formulations extend beyond LED capabilities, ImageXpert platforms can also integrate Arc lamp solutions, enabling hybrid curing approaches within the same machine. Matching System Configuration And Understanding Dose Another key advantage of the JetXpert inkjet development platforms is scalability. Avoiding the inefficiencies associated with oversized or daisy-chained lamps ensures that development results are highly representative of production conditions. Platforms can be configured in fine width increments, ensuring that curing is closely matched to the printed area. For reliable process development, a strong emphasis on real-world curing conditions is placed — particularly the concept of dose. While intensity (W/cm²) describes lamp output, delivered dose (J/cm²)—a function of intensity and exposure time—is what determines whether a chemistry fully cures. By integrating curing into the ImageXpert platform, users can evaluate dose under true process conditions, accounting for print speed, lamp positioning and exposure dynamics. Reducing the risk of incomplete cure, adhesion failure or long-term durability issues during scale-up. IST INTECH UV Dose vs Intensity A Clearer Path To Production A core strength of ImageXpert equipment is the ability to bridge development and production. Through our collaboration with IST INTECH, the same curing platform can be used across different system sizes, ensuring continuity of process parameters. This enables customers to move seamlessly from PrintLab or Print Station platforms into customised production or pre-production systems—without re-engineering the curing process. The result is reduced development risk, faster time-to-market and simplified system specification. Print Station _ IST UV Hg and LED Supporting Development Of New Inkjet Applications ImageXpert platforms are increasingly used for advanced applications where tight process requirements and performance is critical to functionality—not just visual appearance. Applications such as advanced coatings, adhesives, functional materials and biomedical materials require precise control from the earliest development stage. By combining ImageXpert’s flexible platform with integrable print process add-ons such as curing, or pre-treatment or print quality inspection tools, users can fine-tune print processes during initial trials and establish robust, scalable processes. Enabling Progress Through Collaboration At ImageXpert, we believe that innovation happens through close collaboration. By working with partners such as IST INTECH, we integrate specialist technologies directly into our platforms to solve real process challenges. This approach ensures that curing parameters can be defined, measured and optimised early in development—removing barriers to innovation and enabling confident progression to production. Demonstrated Performance – Seeing Is Believing The capabilities of ImageXpert equipment with integrated curing have been demonstrated at leading industry events, including RadTech North America, the European Coatings Show and the Printed Electronics event LOPEC in Munich. ImageXpert continues to work closely with ink developers, formulators and system integrators, helping them explore new applications, optimise processes and scale with confidence using fully integrated inkjet development systems. Connect with our team for your live demonstrations using ImageXpert platforms equipped with print process Add-Ons, such as LED curing—allowing faster, more reliable qualification of new applications. Join the flagship TechBlick events in California on 10-11 June 2026, and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the California event will also feature. The Future of Wearables Reshaped This year, the Berlin event will also feature: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED

How the SPS ASTRON QX Series Advances Cylinder Printing for Printed Electronics Author: Ron Hayden | ron@rhsolutionsllc.com Figure 1: The automatic 4-post SPS ASTRON QX57 - The newest generation of STOP cylinder screen printing machines In printed electronics, a few microns can determine whether a device performs as intended or fails entirely. Conductive traces must align precisely with dielectric layers, resistive elements must maintain consistent geometry, and each deposited layer must deliver repeatable electrical performance. Achieving this level of consistency depends on one critical factor: the stability of the printing platform. Applications such as membrane switches, capacitive sensors, automotive HMI interfaces, and flexible electronics rely on the controlled deposition of conductive, dielectric, and resistive inks. Each layer must be printed with high positional accuracy while maintaining uniform ink thickness across the substrate. Even minor variations in the print process can affect conductivity, resistance, or sensor response. Figure 2: Live video of SPS Astron QX57 operating For manufacturers of functional devices, printing stability is not simply a measure of visual quality. It is fundamental to product reliability. To meet these requirements, new press architectures are emerging that move beyond the mechanical drive systems traditionally used in cylinder screen printing. The SPS ASTRON QX series represents a significant step in this evolution. Built around a fully servo-driven motion platform, it replaces cam-driven and pneumatic systems with digitally synchronized motion control designed for high-precision functional printing. Figure 3: Servo-motor main cylinder drive Figure 4: Linear electromagnetic drive We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in action. Servo Motion Brings New Control to Cylinder Printing Traditional cylinder presses rely on cam drives and pneumatic components to generate motion during the print cycle. While robust and productive, particularly in decorative printing, these systems inherently introduce small variations in acceleration, stroke dynamics, and positional repeatability. Functional printing demands tighter control. The ASTRON QX series replaces these mechanical systems with coordinated servo drives governing all critical movements. The printing cylinder is powered by a direct-drive servo motor, enabling precise synchronization between cylinder rotation and the print stroke. This design eliminates the inertia effects found in older presses, where rack-and-pinion drives operating from one side introduce lag across the cylinder width. At the same time, the screen carrier is driven by linear electromagnetic motors on both sides of the press. This dual-sided drive maintains balanced forces across the full print width, improving positional stability. The result is a digitally synchronized motion system in which cylinder rotation, screen movement, and print stroke operate under unified control. Eliminating mechanical backlash and uncontrolled acceleration improves sheet-to-sheet repeatability and stabilizes the print stroke. Direct-drive servo accuracy reaches ≤30 µm. In functional screen printing, this level of control directly affects ink transfer. Conductive silver pastes, carbon-based inks, and dielectric coatings are sensitive to shear forces during printing. Variations in squeegee motion can alter layer thickness, distort fine features, or reduce line definition. Servo-controlled motion minimizes vibration and maintains consistent stroke dynamics across the entire print area. Figure 5: High lift quick screen insert function Figure 6: High lift quick screen insert controls Precision Control of the Print Stroke Ink transfer in screen printing is governed by the interaction between the squeegee, stencil, and substrate. For functional applications, this interaction must be tightly controlled. The ASTRON QX incorporates a servo-driven squeegee and flood system designed for precision and repeatability. A heavy-duty assembly, driven by servo motors with precision ball screws and hydraulic support, allows accurate control of vertical positioning throughout the print cycle. Squeegee pressure is generated through servo motors, hydraulics and mechanical functions, and adjusted digitally via the human-machine interface (HMI). Pressure is defined in newtons per centimeter, enabling consistent force distribution across varying print widths. This level of control allows the print stroke to be tuned to the rheology of specific inks. High-viscosity silver pastes may require slower, controlled strokes to maintain fine line definition, while dielectric or protective layers can be printed at higher speeds to increase throughput. All parameters are digitally stored and recallable, with capacity for up to 500 recipes. This reduces setup time and ensures repeatable process conditions across production runs. The system also incorporates a high-lift screen and carriage design. Operators can slide screens in from the operator side, remove them for cleaning, and return them without losing registration. Raising the four-post screen and squeegee carriage, combined with a lowered delivery section, provides clear access to the cylinder, lay stops, and side guides, improving both usability and maintenance efficiency. Figure 7: Vacuum transport belts Figure 8: Double sheet detection sensor Stable Handling for Sensitive Substrates Functional printing often involves thin and flexible materials such as PET, polycarbonate, Mylar, polyimide, and coated specialty substrates. These materials require controlled handling to prevent distortion, scratching, or registration drift. The ASTRON QX integrates a fully servo-driven single-sheet feeder designed for reliable separation and transport. Spring-loaded suction elements assist with sheet pickup, while ultrasonic double-sheet detection prevents feeding errors—particularly important when processing thin substrates. Servo-driven vacuum transport belts guide sheets smoothly through the print section while minimizing surface contact. Independent speed synchronization between transport and downstream drying systems helps maintain sheet stability while protecting sensitive surfaces or previously printed layers. For improved accessibility, the substrate exit table lowers to provide unobstructed access to the cylinder area, including lay stops, hold-downs, and side guides. By synchronizing feeder motion with cylinder rotation and screen movement, the system maintains consistent sheet positioning throughout the entire print cycle. Figure 9: CCD camera-based registration Camera-Based Registration for Multilayer Structures Most printed electronic devices are built from multiple functional layers. Conductive traces, dielectric coatings, resistive elements and protective layers must align with high positional accuracy to create reliable electronic structures. To support these requirements, the SPS ASTRON QX incorporates a CCD camera-based registration system designed for precision multilayer printing. Two CCD cameras positioned near the side-lay stops detect fiducial marks on each sheet during the print cycle. After the substrate reaches the front lays, the side-lay system positions the sheet and the gripper closes. The cameras then measure the exact position of the fiducials. Based on this data, multiple servo-driven screen axes automatically compensate for positional deviation before printing begins. The system delivers repeatable registration accuracy of ≤30 µm. This closed-loop registration process compensates for substrate variation and dimensional changes in previously printed layers. The result is improved layer-to-layer alignment and reduced cumulative registration drift during long production runs. For multilayer printed electronics, camera-based registration provides significantly greater process stability and repeatability than conventional manual alignment methods. 10: Digital Process Control Interface Figure 11: Digital parameter settings for squeegee and floor bar pressure Digital Process Control for Modern Production The servo-driven platform is supported by an advanced human-machine interface that centralizes control of machine parameters and production data. Operators can configure print speeds, stroke profiles, and pressure settings while monitoring system performance in real time. Up to 500 production recipes can be stored and recalled, enabling consistent setup across repeat jobs. Production data and machine logs can also be integrated into factory monitoring systems, with optional software to support Industry 4.0 connectivity and process traceability. For manufacturers focused on repeatability, documentation, and quality control, digital process management reduces setup variability while maintaining consistent machine performance. A Platform Designed for Functional Printing As printed electronics expand into applications such as smart surfaces, automotive systems, and energy technologies, the demands placed on screen printing equipment continue to increase. Precision registration, controlled ink deposition, and stable multilayer production are no longer optional—they are required. By combining servo-driven motion control, camera-based registration, and digitally managed process parameters, the SPS ASTRON QX series provides a platform engineered for these demands. The result is a cylinder screen printing architecture designed not only for print quality, but for the level of process stability required by modern functional devices. About RH Solutions LLC. RH Solutions LLC is a North American supplier of functional screen printing equipment and process solutions, supporting manufacturers across printed electronics, automotive, packaging, glass, and functional print applications. The company partners with leading global manufacturers, including ATMA and SPS, to provide high-precision printing systems, integration support, and technical expertise. Through its focus on application-driven solutions, in-house testing, and customer training, RH Solutions helps engineers and production teams optimize print processes, improve repeatability, and scale functional printing technologies from development to full production. Website: https://www.rhsolutionsllc.com/ Telephone: 513-407-5399 Address: 4295 Armstrong Blvd, Batavia, OH 45103 USA Join the flagship TechBlick events in California on 10-11 June 2026, and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the California event will also feature. The Future of Wearables Reshaped This year, the Berlin event will also feature: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED

21 & 22 OCT 2026 Berlin, Estrel Congress Centre co-located with the TechBlick Electronics RESHAPED Show echBlick is launching the Sustainable Electronics RESHAPED conference and exhibition - an event dedicated to Sustainable Electronic Materials, Resource Efficient Electronic Manufacturing, and Circular Designs. This event will be co-located with the Future of Electronics RESHAPED in Berlin on 21 and 22 OCT 2026 - our flagship event dedicated to additive manufacturing of electronics. The synergy is natural. Additive electronics enables material-efficient, low-energy, and resource-conscious manufacturing, making it intrinsically aligned with sustainable and circular electronics. The combined event will feature 650 participants, 85 exhibitors and over 100 conference talks. World-Class Program We will curate a fantastic program. In fact, confirmed speakers include Signify Research, AT&S, AUMOVIO, 4MOD, PrintOCell, Fraunhofer IZM, Yamagata University, Silicon Austria Labs GmbH, University of Maryland, Auburn University, DP Patterning, EMPA and others Exhibition - special pricing We are offering a special exhibition package to our Sustainable Electronics RESHAPED exhibitors. The special pricing is possible thanks to our close collaboration with the Smart Textile Alliance. Please contact tom@techblick.com for further information regarding pricing and the details of the packages

Applications: Antennas · Electrodes · Conductors · Heaters · Circuit Boards Conventional flex-PCB production is still dominated by wet chemical etching or printed conductive inks—processes built around multiple material steps, hazardous chemicals, and inherently unstable cost structures driven by silver and other volatile inputs. While widely adopted, these methods are increasingly misaligned with what the market now demands: scalable production, supply chain resilience, regulatory compliance, and verifiable sustainability. Across industries, regulatory pressure is tightening. ESG (Environmental, Social and Governance) reporting requirements, restrictions on hazardous substances, and increasing scrutiny of chemical-intensive manufacturing processes are forcing companies to rethink not only what they produce, but how it is produced and documented. At the same time, geopolitical uncertainty and material volatility are exposing the fragility of globalized, chemistry-dependent supply chains. DP Patterning’s patented Dry Phase Patterning (DPP) technology was developed to remove these constraints entirely. At its core, DP Patterning replaces chemistry-based etching processes with a fully dry, mechanical roll-to-roll method. Instead of defining circuit geometry by selectively removing material through etchants and chemical processes, the pattern is formed directly in a metal-clad flexible substrate—typically aluminum-based laminates—using mechanical processing. The process is based on two important steps to achieve well-defined structures: First, a cliché is patterned with the desired geometry. Second, a high-precision milling wheel removes only the protruded metal regions, leaving behind fully formed conductive traces on a flexible carrier. The result is a continuous roll-to-roll production flow that converts raw laminate into finished flexible circuits without any wet chemistry, inks, or curing steps. This has direct implications not only for performance and cost, but also for regulatory compliance and supply chain resilience. Why DP Patterning is Outperforming Conventional Methods Performance: Solid-metal conductivity instead of particle-based inks Because DP Patterning uses solid aluminum and copper cladded aluminum (CCA)- foils rather than printed conductive inks, it delivers significantly higher and more stable electrical performance. Conductivity is typically 2–3× higher than printed electronics solutions, with improved long-term stability due to the absence of particle sintering or binder degradation. Cost efficiency: Decoupling from material volatility and process complexity By design, DP Patterning enables the use of widely available conductive materials and substrates such as aluminium-clad aluminium, and flexible carriers based on plastic or paper. This reduces dependence on silver-based inks and other high-cost, high-volatility materials, creating a more stable and predictable cost base. In addition, the process eliminates multiple conventional manufacturing steps such as printing, drying, and sintering, thereby simplifying the overall production flow. Simplicity and scalability: Fewer steps, higher industrial robustness Traditional flex-PCB manufacturing relies on multi-step chemical sequences, each introducing variability, yield loss, and environmental burden. DP Patterning collapses this into a continuous mechanical process, significantly reducing process variability and enabling high-throughput roll-to-roll manufacturing suitable for industrial scale-up. Sustainability & regulation readiness: Designed for a changing compliance landscape Because DP Patterning is fully mechanical, it eliminates the need for etchants, solvents, and water-intensive processing. This directly reduces hazardous material handling, simplifies environmental reporting, and supports compliance with increasingly strict chemical and sustainability regulations in global manufacturing. Material removed during patterning is generated as dry metal particles that can be recycled, avoiding liquid waste streams entirely. This is confirmed by an Independent Fraunhofer Institute Life Cycle Assessment (LCA), which reports up to ~98% reductions in CO₂, emissions and energy use compared to wet etching production - achieved through process step elimination rather than downstream compensation. In a regulatory environment increasingly shaped by traceability, chemical restrictions, and ESG accountability, this represents a structurally compliant manufacturing model by design—not adaptation. Supply chain resilience: From global dependency to local production By removing reliance on complex chemical supply chains and volatile raw material inputs, DP Patterning enables a more robust and geographically flexible production model. Combined with roll-to-roll scalability and modular deployment, this supports localized manufacturing closer to end markets. This reduces exposure to geopolitical disruption, shortens lead times, and increases control over critical production capacity—key requirements in an increasingly fragmented global supply environment. From Process Innovation to Industrial Large-scale Production Dry Phase Patterning introduces a fundamentally new approach to FLEX Electronics-manufacturing. It represents a different process architecture —one that removes chemical processing entirely, reduces material cost volatility, and enables scalable production without sacrificing electrical performance. In doing so, DP Patterning addresses a challenge the industry has faced for decades: how to achieve high performance, low cost, regulatory compliance, supply chain resilience, and real sustainability at the same time—without trade-offs. This is what makes Dry Phase Patterning fundamentally different. And why it is emerging as a new standard for flexible electronics manufacturing. We look forward to discussing the technology and its applications in practice. Visit DP Patterning at booth #E11. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026 Please register to meet us in person and see our technology in action. Join the flagship TechBlick events in California on 10-11 June 2026 This event is the global hub for Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the event in California will also feature. The Future of Wearables Reshaped The event in Berlin will also feature: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED

Researchers and product developers continually push the limits of precision and resolution in material dispensing. Dot dispensing in electronics and other advanced fields such as additive manufacturing, chemical engineering, and biomedicine provides the fine control needed for cutting-edge applications, enabling features such as fine solder paste application, DNA microarrays (a kind of biochip), or adhesive micro dots. How dot dispensing works In dot dispensing (a form of drop-on-demand printing), a small volume of functional material is ejected from a nozzle to form a droplet (”dot”) that lands on a substrate at a specified location. Each dot is typically on the order of microliters, nanoliters, or even picoliters in volume. The process is digitally controlled: each droplet is generated only when and where needed, allowing precise patterning and minimizing waste. By adjusting process parameters (such as pressure pulses or actuator voltage), the system controls the volume of each drop and thus the dot size on the substrate. Applications of dot dispensing The applications of dot dispensing include microelectronics packaging (e.g., solder paste, conductive adhesives), flexible printed electronics, microfluidics fabrication, biomaterial and cell-based bioprinting, LED phosphor dispensing, underfill encapsulation, and the construction of microstructured sensors and actuators for electronic skin and wearable technology. They provide high accuracy, repeatability, and scalability critical for complex device fabrication and advanced material development [1]. Types of dot dispensers There are several engineering approaches to generate and dispense tiny dots. Based on one classification framework of Lee J M, et al. [2], dot dispensing mechanisms fall into two broad categories: Material jetting: A non-contact method that uses actuation mechanisms such as piezoelectric or solenoid jet valves to eject discrete droplets Material extrusion: A contact-based method where material is deposited through pressure-driven flow, including pneumatic time-pressure and positive displacement systems Each category is suited to a different viscosity range and precision level. Material jetting Piezoelectric inkjet dot dispensers Piezoelectric inkjet dispensers use a piezoelectric actuator to create a pressure pulse in a small ink chamber, ejecting a droplet through a fine orifice. They produce extremely small droplets (single picoliters), enabling high-resolution patterning and precise application in the form of thin, accurate deposit dots and lines [3][4]. A piezoelectric actuated jetting system © Agarwal, S., CC BY 4.0 The limitation of piezoelectric inkjet, however, is that they impose strict ink property requirements: typically a viscosity below 40 cP and surface tension in the 20-70 mN/m-1 range for reliable jetting [5]. As such, piezoelectric inkjet dispensers are only suitable for micro volume dispensing of low-viscosity functional inks such as conductive polymers and nanoparticle inks [3]. Quality of epoxy adhesive droplets with ~300 µm diameter jetted by a piezo-driven dispense valve © Agarwal, S., CC BY 4.0 Solenoid jetting dot dispensers A pneumatic-solenoid valve droplet dispensing system, adapted from © Lee, S., et al., CC BY 4.0 Different from a piezo-actuated valve dispenser, where a piezoelectric stack or bending element drives the needle open and closed, in a solenoid jet valve, a coil generates a magnetic force to lift the valve needle off its seat momentarily, allowing fluid to jet out until the spring or magnetic force closes it again. Similar to piezoelectric jetting systems, solenoid jetting dispensers excel at very high-speed dotting (up to kHz firing rates) and tiny dot sizes (tens of microns), but can handle viscosities up to about 40 cP. Although researchers have been experimenting with pushing jetting into the higher viscosity range, challenges of pattern fidelity remain to be solved. In addition, a material jetting system is more complex than a simple time-pressure syringe. It requires a precision-machined valve assembly and a dedicated driver (for the solenoid or piezo). These systems are often more expensive per dispense head than a basic pneumatic time-pressure dispenser, limiting their scalability. Material extrusion Pneumatic time-pressure dot dispensers A time-pressure pneumatic dispenser uses a controlled pressure (air or inert gas) applied to a fluid reservoir to push material through a nozzle. By adjusting pressure and valve open time, discrete droplets can be dispensed [6]. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026 and in Berlin on 21-22 October 2026. Please register to meet us in person and see our technology in action. A pneumatic time-pressure dispenser © Xiao, X., et al., CC BY 4.0 Compared to piezo or microvalve systems, pneumatic dispensers tolerate higher viscosity fluids than inkjet heads (typically 100-100,000 cP), making them versatile in their applications. They are suitable for thick adhesives, silicone sealants, solder pastes, or polymer gels that piezo inkjets cannot eject [7]. GelMa hydrogel beads containing tumor cells dispensed by a pneumatic dispensing system, © Wei, X., et al [8], CC BY 4.0 However, the precision and minimum dot size achievable by pneumatic dispensers are more limited. The dispensed volume depends on several factors (pressure level, time, fluid viscosity, nozzle diameter, and even air compressibility) [9], which makes ultra-fine control challenging. Without additional feedback or mechanical pinch-off, achieving very small, consistent dot volumes (in the low-nanoliter range) is difficult due to variability in how the fluid stream breaks off [1]. Positive displacement dot dispensers Solder dots dispensed by Voltera’s NOVA materials dispensing system under different settings Positive displacement dot dispensing machines use mechanical actuators (e.g., pistons, auger/screws) to directly displace fluid, eliminating air compressibility errors inherent in pneumatic systems. This enables superior volumetric accuracy (< about 1.5% coefficient of variation for 100 nL volumes) and precise control over high-viscosity fluids (up to 1,000,000 cP) [10]. Extrusion-based direct ink writing equipment, such as NOVA (pressure-feedback positive displacement dispensing), falls into this category, capable of accommodating highly viscous, paste-like inks that are orders of magnitude thicker than inks for inkjet dispensers. For example, silver-filled conductive adhesives with nano- or micro-particles, or solder paste with metal alloy powder, can be dispensed by DIW systems when they would clog a fine inkjet nozzle. The ability to deposit such high-solids, thixotropic fluids is a key advantage of extrusion-based dot dispensing [9]. Conclusion Dot dispensing technology continues to evolve, expanding its scope into new materials and applications. Improvements in actuator design, fluidics, and control software are pushing the boundaries of what can be dispensed in tiny dot form. By choosing the appropriate dispensing mechanism for a given material and feature size, scientists and engineers can reliably deposit microscopic amounts of material exactly where needed, enabling the fabrication of next-generation devices and materials, one tiny drop at a time. Ready to learn more about materials dispensing? Explore these resources: Blog: What are Precision Fluid Dispensing Systems? Blog: What is Viscosity? Blog: High-Resolution Electronics Prototyping: Pushing the Limits with Closed-Loop Dispensing Systems Video: Dot, Dot, Dot...Optimized Dispensing for Silver-Filled Conductive Epoxy Adhesives Want to discuss your dot dispensing needs? Book a meeting to speak with one of Voltera’s technical representatives. References [1] Lee, S., Choi, I. H., Kim, Y. K., & Kim, J. (2014). Velocity control of nanoliter droplets using a pneumatic dispensing system. Micro and Nano Systems Letters, 2(1). https://doi.org/10.1186/s40486-014-0005-8. [2] Lee, J. M., Sing, S. L., Zhou, M., & Yeong, W. Y. (2018). 3D bioprinting processes: A perspective on classification and terminology. International Journal of Bioprinting, 4(2). https://doi.org/10.18063/ijb.v4i2.151. [3] Bernasconi, R., Brovelli, S., Viviani, P., Soldo, M., Giusti, D., & Magagnin, L. (2021). Piezoelectric Drop‐On‐Demand Inkjet Printing of High‐Viscosity Inks. Advanced Engineering Materials, 24(1), 2100733. https://doi.org/10.1002/adem.202100733. [4] Ng, W. L., Lee, J. M., Yeong, W. Y., & Win Naing, M. (2017). Microvalve-based bioprinting – process, bio-inks and applications. Biomaterials Science, 5(4), 632–647. https://doi.org/10.1039/c6bm00861e. [5] Tsai, H.-L., Hwang, W.-S., Wang, J.-K., Peng, W.-C., & Chen , S.-H. (2015). Fabrication of Microdots Using Piezoelectric Dispensing Technique for Viscous Fluids. Materials, 8(10), 7006–7016. https://doi.org/10.3390/ma8105355. [6] Durham, M., Wade, G., Judd, B., & Boggiatto, J. (n.d.). Process Optimization for Fine Feature Solder Paste Dispensing. Retrieved May 9, 2025, from https://www.ipc.org/system/files/technical_resource/E40%26S16_01%20-%20Maria%20Durham.pdf. [7] Xiao, X., Li, G., Liu, T., & Gu, M. (2022). Experimental Study of the Jetting Behavior of High-Viscosity Nanosilver Inks in Inkjet-Based 3D Printing. Nanomaterials, 12(17), 3076. https://doi.org/10.3390/nano12173076. [8] Wei, X., Huang, B., Chen, K., Fan, Z., Wang, L., & Xu, M. (2022). Dot extrusion bioprinting of spatially controlled heterogenous tumor models. Materials & Design, 223, 111152. https://doi.org/10.1016/j.matdes.2022.111152. [9] Polychronopoulos, N. D., & Angeliki Brouzgou. (2024). Direct Ink Writing for Electrochemical Device Fabrication: A Review of 3D-Printed Electrodes and Ink Rheology. Catalysts, 14(2), 110–110. https://doi.org/10.3390/catal14020110. [10] Ando, T., Hirano, M., Ishige, Y., & Adachi, S. (2016). Precise Dispensing Technology Using Electroformed Tubes for Micro-Volume Blood Diagnosis. IEEE journal of translational engineering in health and medicine, 6, 2800506. https://doi.org/10.1109/JTEHM.2018.2852664. Join the flagship TechBlick events in California on 10-11 June 2026, and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature. In California: The Future of Wearables Reshaped In Berlin: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED

The status quo of additive manufacturing and inkjet printing How EHD technology is pushing the boundaries EHD in practice – applications for industry Implementation of EHD technology into the Notion Systems ecosystem The status quo of additive manufacturing and inkjet printing Author: Simon Rihm | Notion Systems |https://www.linkedin.com/in/rihmsimon/ (1) The status quo of additive manufacturing and inkjet printing Over the past two decades, additive manufacturing has undergone a profound transformation, evolving from a technology primarily confined to prototyping into a cornerstone of modern industrial production. This transformation is driven by its high flexibility, strong potential for customization, shorter development cycles, and efficient use of materials. By depositing material only where needed, additive processes significantly reduce waste compared to conventional methods - an advantage that is particularly important for expensive or scarce materials such as titanium alloys or high-purity metals. Additionally, additive manufacturing enables the production of complex structures that are difficult or impossible to achieve with traditional techniques, leading to lighter and higher-performance components. The growing significance of additive manufacturing is especially evident in the electronics and semiconductor industries. These fields are defined by ongoing miniaturization, increasing integration density, and extremely stringent precision requirements. Conventional lithographic and mechanical fabrication methods are progressively approaching their technological limits, particularly in the context of flexible substrates, novel material systems, and cost-efficient large-area production. In this regard, additive technologies, most notably inkjet printing, offer decisive advantages and are becoming increasingly integrated into production processes worldwide. From both an economic and technological perspective, it is becoming increasingly untenable to disregard the trend toward additive manufacturing. In most cases, the required investment amortizes rapidly, further reinforcing its attractiveness. It is therefore only a matter of time before additive manufacturing establishes itself as a dominant paradigm in industrial production. (2) How EHD technology is pushing the boundaries While inkjet printing is a well-established digital manufacturing technique, its inherent limitations - particularly in terms of feature size, ink viscosity, and adaptability to complex surfaces - restrict its use in advanced microscale research and semiconductor-grade applications. Electrohydrodynamic (EHD) printing addresses these challenges by utilizing electrically driven jetting mechanisms. This approach enables the fabrication of structures in the single-digit micron range, supports a much wider range of ink viscosities, and operates entirely contactlessly. As a result, EHD printing allows precise patterning on non-planar and sensitive substrates, opening new possibilities in areas such as semiconductor packaging, heterogeneous integration, advanced interconnects, sensor technologies, and emerging nanoelectronic devices. The key to these advantages lies in the fundamentally different droplet generation mechanism. In conventional inkjet systems, droplets are formed by pressure waves generated via piezoelectric actuation, which forces ink through a nozzle and inherently limits droplet size to the nozzle diameter while incurring energy losses due to fluid resistance. In contrast, EHD printing generates droplets through electric fields acting directly on the conductive liquid. This creates a balance between electrostatic forces and surface tension, forming a meniscus at the nozzle tip where energy is highly concentrated. Droplets are emitted from this localized region, allowing feature sizes significantly smaller than the nozzle diameter. Image 1: Comparison of droplet formation This alternative droplet generation mechanism offers several significant advantages. By decoupling droplet size from nozzle geometry, EHD printing substantially expands both the range of processable ink viscosities and the achievable resolution. While conventional inkjet systems typically produce feature sizes between 30 µm and 50 µm, EHD printing can achieve resolutions below 5 µm. At the same time, the viscosity window is greatly extended: whereas inkjet printing is generally limited to around 30 cP, EHD systems can handle viscosities exceeding 10,000 cP. However, such extreme conditions often require specialized printhead designs and may involve trade-offs in resolution, making it necessary to carefully balance viscosity and precision depending on the application. Beyond droplet formation, the controlled transport of droplets is crucial for high-quality results. In EHD printing, electric fields are used not only to generate droplets but also to guide them with high precision. Unlike conventional methods that deposit material on predefined planar positions, EHD dynamically adapts to the substrate’s topography. This enables accurate patterning on curved, stepped, or otherwise irregular surfaces, significantly broadening the range of compatible geometries and allowing the fabrication of three-dimensional electronic structures and advanced packaging solutions. Overall, this represents a substantial technological advancement over traditional inkjet processes, opening up new possibilities for manufacturing and functional integration. (3) EHD in practice – applications for the industry In practical applications, EHD printing is increasingly emerging as a key enabling technology across a wide range of disciplines. Its unique capability to combine ultra-high resolution, broad material compatibility, and precise, contactless deposition fundamentally expands the design space available to engineers and researchers. Unlike conventional manufacturing approaches, EHD does not merely optimize existing processes - it enables entirely new ones. This shift is particularly relevant in fields where established fabrication technologies are approaching physical, economic, or material-related limits. Against this backdrop, EHD printing acts as a technological catalyst, unlocking new degrees of freedom in device architecture, material integration, and system performance. The following application areas are intended to illustrate where the strengths of EHD technology lie. a. Enhanced topography printing Topography printing enables precise material deposition on complex, non-flat surfaces and represents a key advantage of EHD-based processes. In particular, the MEMS-based printheads developed by Scrona ensure highly accurate and consistent droplet placement, even on curved, stepped, or irregular structures. This capability significantly surpasses conventional printing methods and opens new opportunities for the realization of three-dimensional electronics and advanced packaging solutions. Closely related to this is the concept of step printing, which allows controlled material deposition across discontinuities such as edges, gaps, or height variations on a substrate. This is particularly critical for applications in advanced packaging, conformal coatings, and optical structures. By enabling high-resolution, distortion-free printing over complex three-dimensional features, EHD technology avoids issues such as material overflow and loss of precision. As a result, it unlocks new degrees of design freedom and facilitates the development of increasingly sophisticated and integrated device architectures. Image 2: Printing on topography with commercially available conductive silver ink b. Novel display technologies The rapid evolution of display technologies - driven by applications such as augmented reality (AR), virtual reality (VR), and next-generation consumer electronics - is placing unprecedented demands on resolution, brightness, and energy efficiency. Emerging concepts such as Micro-LED and Quantum Dot displays are widely regarded as key candidates to meet these requirements. However, their large-scale and cost-efficient manufacturing remains a significant challenge. In this context EHD printing systems provide a fundamentally new approach to display fabrication. One of the central challenges in Micro-LED displays lies in the precise placement and patterning of color-converting materials, such as quantum dots, at extremely small pixel pitches. Conventional techniques - often relying on photolithography or transfer printing - face limitations in scalability, alignment accuracy, and material efficiency. EHD printing overcomes these barriers by enabling the direct, maskless deposition of quantum dot materials with sub-micron precision and highly controlled layer thickness. This capability allows for the fabrication of high-brightness, full-color microLED displays, where pixel density and optical performance are critical. Beyond microLEDs, EHD technology also offers significant advantages for established display technologies such as OLED and LCD. By simplifying layer deposition processes and reducing reliance on complex masking steps, EHD can streamline manufacturing workflows, lower production costs, and enable more flexible design iterations. c. Advanced semiconductor packaging As the scaling of transistors in accordance with Moore's Law approaches both physical and economic limits, the semiconductor industry is undergoing a paradigm shift. Increasingly, performance gains are being achieved not through further miniaturization of individual transistors, but through innovations in system integration and packaging - an approach commonly referred to as “More than Moore”. Advanced packaging techniques - such as heterogeneous integration, chiplet architectures, and 3D stacking - require new methods for interconnection, material deposition, and fine-structure fabrication. Traditional photolithographic processes, while highly precise, are often cost-intensive and inflexible when applied to these emerging architectures, particularly for non-planar or heterogeneous substrates. EHD printing introduces a transformative alternative by enabling high-resolution, additive structuring directly onto wafers, chips, or package substrates. Its capabilities extend across a wide range of applications, including wafer and chip marking, solder bumping, via filling, and the direct patterning of redistribution layers (RDLs). The latter is especially significant, as RDLs are critical for routing electrical signals in advanced packages. With its ability to achieve micrometer resolution and high aspect ratio structures, EHD printing is uniquely suited for fabricating dense interconnect architectures required in next-generation devices. Moreover, the digital, maskless nature of the process offers the potential to reduce fabrication costs by up to an order of magnitude compared to conventional photolithography, while simultaneously increasing design flexibility. d. High-definition structures Antenna printing represents another important application of EHD-based additive manufacturing, enabling the precise deposition of conductive materials to form high-performance antenna structures. This is particularly relevant for devices such as consumer electronics, drones, and IoT components, where compact design and reliable signal transmission are essential. Image 3: Ultra-fine, low-loss antenna structures on various substrates EHD technology allows the fabrication of ultra-fine, low-loss antenna patterns on a wide range of substrates, significantly improving signal quality while supporting ongoing miniaturization. At the same time, it facilitates seamless integration of antennas into increasingly compact and complex electronic systems. As a result, EHD printing contributes to the development of highly efficient, space-saving communication components and expands the design possibilities for next-generation electronic devices. Image 4: Conductive silver traces, 3 µm line width (4) Implementation of EHD technology into the Notion Systems ecosystem Through an exclusive collaboration, Notion Systems and Scrona have successfully translated advanced electrohydrodynamic printing into a user-friendly, high-precision research platform: the n.jet EHD. This partnership combines Notion Systems’ expertise in functional material printing systems with Scrona’s innovative multi-nozzle MEMS-based EHD printhead technology, aiming to accelerate the adoption of EHD printing in fields such as display technology, electronics manufacturing, and semiconductor production. Within this framework, Notion Systems is responsible for manufacturing and servicing the n.jet EHD, which is specifically designed for advanced research and development applications. The system offers ultra-high precision and stability, including a printing resolution below 5 µm, repeat accuracy down to 1 µm, and a motion system with seven independently controlled axes. Additional features include an encoder resolution of 10 nm and support for substrates up to 150 × 150 mm. Mechanical stability is ensured through a granite base and vibration isolation, while integrated high-resolution top and bottom microscope systems enable precise alignment and real-time process monitoring. As with conventional inkjet technologies, printheads play a decisive role in determining overall process performance. In the case of the n.jet EHD system, the latest generation of multi-nozzle MEMS printheads developed by Scrona (Gen3) significantly expands the operational capabilities available to the user. These printheads enable not only extremely high-resolution patterning but also the reliable processing of inks with elevated viscosities. Whereas traditional inkjet systems typically reach their functional limits at viscosities above approximately 50 cP, Scrona’s Gen3 printheads can handle viscosities of up to 300 cP while maintaining high print quality. The advanced capabilities of the latest generation of EHD printheads are further reflected in a range of highly optimized technical features that enhance both process stability and application flexibility. Building on the multi-nozzle MEMS architecture, these systems are designed to meet the stringent requirements of high-resolution, high-performance additive manufacturing in research and industrial contexts. Image 5: GEN3-128 (128 nozzles) and GEN3-8 (8 nozzles) printheads The current generation of printheads is available starting from configurations with eight nozzles (Gen3-8), enabling parallelized material deposition and thereby increasing throughput without compromising precision. A key innovation lies in the implementation of nozzle-level ink circulation, which ensures consistent ink delivery, minimizes the risk of clogging, and contributes to overall process reliability - particularly when working with functional materials of higher viscosity. Thermal management is another critical aspect: integrated printhead heating of up to 75 °C allows precise control over ink rheology during operation. This capability is essential for stabilizing jetting behavior and expanding the range of compatible material systems. Image 6: Printed EHD sample We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026 Please register to meet us in person and see our technology in action. Join the flagship TechBlick events in California on 10-11 June 2026 This event is the global hub for Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed!

The Future of Electronics RESHAPED USA   conference and exhibition ( 10 & 11 JUNE 2026, Mountain View ) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum , this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks  from around the world, 8 industry- or expert-led masterclasses , 2 tours , and over 75 onsite exhibitors . In this article, we discuss and highlight various innovative talks at the event around the theme of Material Innovations in Printed Electronics . In previous articles we covered process advancements, R2R manufacturing, smart surfaces and sensing, printed photovoltaics and more. Explore the   full agenda  now and join the global industry in Mountain View on 10 & 11 JUNE 2026 . Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire Tatsuta – Robert Wilson  discusses silver-coated copper particle conductive pastes . Robert explores the critical challenge of copper oxidation, which severely impacts the reliability of low-cost interconnects when replacing expensive silver. By engineering silver-coated copper particles, Tatsuta combines the cost advantages of copper with the stability of silver. This work offers a scalable, eco-friendly solution for PCB and FPC manufacturing, reducing CO₂ emissions to 18% compared to traditional subtractive etching. Copprint – Ofer Shochet  discusses the structural shift from silver to copper inks . Ofer explores how the surge in demand from EVs and data centers has created a "Silver Tax," imposing a $24B+ burden that directly compresses margins for printed electronics manufacturers. The presentation maps the transition landscape, highlighting how high-performance copper inks now offer a viable substitute for silver. This solution provides an intelligent risk-management framework for manufacturers to reclaim margins through direct material substitution. Electroninks – Mitchell Smith  explores Silver MOD Inks as an advancement beyond particle pastes . Mitchell explores the chemical limitations of traditional particle-based pastes, which often require high-temperature curing and high metal loading. Metal-organic decomposition (MOD) inks achieve comparable conductivity using less metal and can be cured at much lower temperatures. This work offers a pathway for integrating high-performance electronics onto heat-sensitive plastic substrates that were previously incompatible with standard conductive pastes. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire 👉 iGii (Integrated Graphene) – Michelle Ntola  highlights 3D carbon nanomaterials (Gii) . Michelle explores the volatile pricing and supply chain risks associated with metal-heavy electrode formulations in microheaters and batteries. Gii is a proprietary 3D carbon platform that delivers robust thermal performance (up to 400 °C) and high surface quality without relying on silver. This technology offers a sustainable, drop-in alternative for roll-to-roll manufacturing, capable of producing up to 80 million parts per year. 👉 Arieca Inc. – Navid Kazem  discusses liquid metal embedded elastomer (LMEE) composites  for AI cooling. Navid explores the thermal bottleneck in next-generation high-performance computing, where power densities are projected to reach 4 W/mm², far exceeding the capabilities of current thermal interface materials (TIMs). LMEEs combine the high thermal conductivity of dispersed liquid metal microdroplets with the mechanical compliance of soft elastomers. This work offers a transformative TIM solution that reduces data center power consumption by effectively managing heat in large silicon dies with significant warpage. Graphene Engineering Innovation Centre – Andrew Strudwick  presents printed electronics based on graphene and 2D materials . Andrew explores the "tipping point" of graphene, moving from lab curiosity to real-world solutions for environmental monitoring and health sensors. The talk highlights how GEIC's pilot-scale printing equipment helps companies bridge the gap between material research and product launch. This solution offers partners a world-class facility to design, develop, and scale the next generation of energy-efficient heating elements and flexible devices. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire Nagase ChemteX – Brandon Peters  discusses innovations in fine line conductive ink printing . Alan explores the complex interplay between ink chemistry, screen parameters, and substrate surface energy that often prevents reliable sub-micron printing features. The presentation examines how optimizing mesh count and emulsion profiles can improve line definition and electrical performance. This work offers a practical roadmap for manufacturers to achieve consistent, ultra-fine resolution across diverse advanced electronic applications. Henkel – Julie Ferrigno  explores materials and processes for printed antennas . Julie explores how high-frequency designs require low surface roughness and uniform thickness, which are difficult to achieve with standard silver pastes. The talk presents silver-filled and emerging silver-plated copper (SPC) inks that deliver comparable RF behavior at lower costs. This solution enables high-throughput manufacturing of 3D antenna structures via pad printing, facilitating the mass adoption of smart connectivity. Heraeus Electronics  highlights optimizing design principles for PTC heater circuits . The talk explores the common manufacturing challenges with printed carbon-based heaters, such as print consistency and resistance tolerance under accelerated processing. In collaboration with Boyd, Heraeus investigates how print formfactor and roll-to-roll conditions impact heat-up characteristics. This work offers a set of best practices to enhance both the performance and manufacturability of flexible heaters for automotive and personal devices. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire University of Southern California – Hangbo Zhao  explores high-resolution liquid metal-based stretchable electronics . Hangbo explores the difficulty of achieving feature sizes below the standard limit for liquid metal patterns used in implantable biomedical devices. By integrating colloidal self-assembly and micro-transfer printing, patterns as small as 5 µm are realized. This work offers a method for creating cardiac mapping devices that maintain exceptional conductivity (2.4×10⁶ S/m) even under extreme 1200% strain. Sunray Scientific – John Yundt  discusses fine-pitch direct die attach with reduced cost and higher throughput . John explores the constraints of traditional bonding technologies like solder and silver-filled ECAs, which often suffer from brittle properties, low bond strength, or slow micro-dot dispensing. ZTACH® ACE utilizes magnetically aligned columns of ferromagnetic particles to create an anisotropic electrical interconnection. This work offers a pressure-less, low-temperature process that simplifies assembly to a single step while increasing bond strength by 5-10x. ACI Materials – Richard Morris  highlights materials for durable FHE and E-Textiles . Richard explores the issue of galvanic corrosion in electrically conductive adhesives (ECA) under damp heat, which limits the durability of wearables. The presentation introduces solderable printed conductors that enable higher-density circuits and smaller SMDs. This solution provides a cost-effective, additive pathway for manufacturing stretchable e-textiles that can withstand harsh environmental conditions. Applied Nanotech Inc. – Richard Fink  concludes with novel ink development for extreme environments . Richard explores the lack of functional inks capable of maintaining electrical integrity under the extreme temperatures and pressures found in aerospace and industrial monitoring. The presentation details the characterization and testing of specialized conductive formulations. This work offers a robust material set designed to ensure reliability where conventional printed electronics would fail. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire

The Future of Electronics RESHAPED USA   conference and exhibition ( 10 & 11 JUNE 2026, Mountain View ) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum , this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks  from around the world, 8 industry- or expert-led masterclasses , 2 tours , and over 75 onsite exhibitors . In this article, we discuss and highlight various innovative talks at the event around the theme of Wearable Sensors, Actuators and Soft Robotics .  In other articles we cover themes like materials innovation, additive electronics in packaging and PCBs, wearables and sensors, soft robotics, additive electronics in packaging and PCB production, sustainable electronics, and more. Explore the   full agenda  now and join the global industry in Mountain View on 10 & 11 JUNE 2026 . Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire GE Healthcare – Gurvinder Singh Khinda  discusses sustainability in single-use medical sensors and devices . Gurvinder explores the significant environmental burden of biohazardous single-use products and the sanitation issues inherent in the biomedical industry. The talk highlights the use of Flexible Hybrid Electronics (FHE) and environmentally conscious design practices to create sustainable demonstrators like vital sign monitors. This work offers a life cycle assessment (LCA) methodology to reduce costs and environmental impact in medical device manufacturing. Medtronic – Dr. Rohan Sonawane  discusses Data and AI in Cardiac Monitoring . Rohan explores the challenge of "data overload," where care teams are overwhelmed by vast streams of information that lack timely, meaningful insight. The session focuses on AI algorithms that interpret continuous physiologic data to filter out false signals and identify early signs of risk. This solution shifts healthcare from reactive responses to proactive prevention, improving both clinical efficiency and the patient experience. Genentech (Roche Group) – Paul Upham  explores wearables in pharma . Paul explores the need for objective, real-world data from a patient's environment to develop more accurate clinical endpoints during drug development. The presentation provides use cases for how wearable technology can measure disease progression and treatment efficacy across multiple domains. This work offers pharmaceutical researchers a critical tool for improving the accuracy and impact of clinical trials. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire 👉 Stanford University – Angela McIntyre  highlights wearables as embodied AI . Angela explores the shifting paradigm where wearable devices are no longer just passive sensors but are becoming active participants in human-AI interaction. This talk examines how integrating intelligence directly into the wearable form factor enables more intuitive and responsive user experiences. This technology offers a glimpse into a future where "embodied AI" seamlessly supports health, productivity, and physical interaction. 👉 GE Aerospace – Deepak Trivedi  highlights FHE-enabled soft robotics . Deepak explores the opportunities and challenges of moving away from rigid robotic systems toward flexible, soft-bodied machines that can safely interact with humans and complex environments. The talk examines how Flexible Hybrid Electronics (FHE) act as the "nervous system" for these robots. This work offers a technical roadmap for overcoming integration hurdles to realize the full potential of soft robotic systems. 👉 Artimus Robotics – Eric Acome  discusses the development of polymer-based electrohydraulic actuators . Eric explores the limitations of traditional electric motors, which are mechanically complex, generate high heat, and are difficult to miniaturize for next-gen robotics. By combining thin polymer films and liquid dielectrics, Artimus has developed "HASEL" actuators that function like artificial muscles. This solution offers a high power-to-weight ratio and fast response times for dexterous robotic hands and wearable devices. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire NGK Insulators LTD – Masahiro Furukawa  introduces ceramic-based Li-ion rechargeable batteries for health monitoring . Masahiro explores the safety and form-factor constraints of organic-based batteries in close-contact wearable patches for preventive care. These ceramic-based batteries feature a semi-solid structure that is thin, bendable, and exceptionally safe for skin contact. This technology offers a multi-year storage solution with fast-charging capabilities, optimized for home disease management devices. Quad Industries – Wim Christiaens  discusses scaling wearable printed electronics for mass-market applications . Wim explores the technical gap between promising lab prototypes and the reliable, repeatable manufacturing required for large-scale commercial success. The presentation uses case studies to show how design choices and process development influence final production costs. This work offers an industrial perspective on moving wearable systems from the laboratory to cost-effective mass production. Screentec – Antti Tauriainen  discusses the future of supply chains for medical electrodes . Antti explores how shifting medical regulations and environmental requirements are creating instability in traditional material supply chains. The session covers approaches to design that account for technical, usability, and environmental requirements for disposable goods. This solution offers new strategies for manufacturing and supply chain management to ensure a steady supply of high-quality medical sensors. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire University of North Carolina – Wubin Bai  explores a multi-modal noninvasive in vivo biosensing system . Wubin explores the limitations of existing muscle tracking devices, which often rely on indirect surface measurements or specialized skin adhesion. This system utilizes near-infrared (NIR) light to capture muscular locomotion while an IMU decouples complex motion signals. This AI-boosted solution offers an adaptive model for classifying muscle activities, facilitating better diagnostics for neuromuscular disorders. University of Southern California – Hangbo Zhao  presents high-resolution liquid metal-based stretchable electronics . Hangbo explores the difficulty of achieving scalable, high-resolution patterning for liquid metal circuits used in cardiac mapping and soft robotics. By integrating colloidal self-assembly and micro-transfer printing, feature sizes as small as 5 µm are achieved. This work offers a method for creating microelectrode arrays that maintain high performance even under 1200% strain. Yamagata University – Shizuo Tokito  highlights flexible printed sensors for robotic hands . Shizuo explores the lack of human-like tactile sensing in current robotics, which prevents machines from handling fragile objects with precision. The talk details the use of porous piezoresistive layers and piezoelectric polymer inks printed on flexible substrates to emulate human skin. This work offers a lightweight, conformable sensing system that allows robotic hands to detect pressure, texture, and temperature. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire Datwyler Switzerland Inc. – Mattia Lucchini  discusses unlocking internal physiological and mental insights via next-gen wearables . Mattia explores how current wearables focus almost exclusively on external behavior and activity levels, missing deeper contextual health data. The session reviews advancements in functional materials that enable the continuous collection of EEG and EMG biosignals. This solution offers a transformative opportunity for objective assessments of a user's mental and physiological status through sensor fusion. Texavie – Peyman Servati  explores MarsWear smart apparel for personalized therapy . Peyman explores the discomfort and lack of accuracy in traditional wearable devices used for long-term health monitoring and clinical assessment. MarsWear integrates yarn sensor technologies and machine learning into comfortable apparel to provide real-time feedback with high fidelity. This platform technology offers a groundbreaking solution for personalized wellness, gaming, and AR/VR control. VTT – Tuomas Happonen  highlights elastic multilayer printed circuits (EMPC) . Tuomas explores the challenges of manufacturing sensitive, interference-tolerant elastic circuits using traditional rigid PCB methods. The approach uses stacked, pre-perforated TPU films with screen-printed filled vias to create robust multilayer architectures. This work offers an industrially feasible sheet-based process for creating complex, flexible circuits suitable for wearable RF applications. Voltera – Giovanni Obando  and East West Manufacturing  conclude with mass-producing wearable biosensors . The sessions explore the specific challenges of printing silver conductive inks directly onto cotton fabrics and scaling these biosensors for volume production. By validating optimal print settings for textiles, these works move the industry closer to truly integrated "smart clothing." These combined solutions offer a pathway to mass-producing reliable, fabric-based heaters and biosensors for consumer and medical markets. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire