The Future of Electronics RESHAPED USA conference and exhibition (10 & 11 JUNE 2026, Mountain View) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum, this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks from around the world, 8 industry- or expert-led masterclasses, 2 tours, and over 75 onsite exhibitors. In this article, we discuss and highlight various innovative talks at the event around the theme of Wearable Sensors, Actuators and Soft Robotics. In other articles we cover themes like materials innovation, additive electronics in packaging and PCBs, wearables and sensors, soft robotics, additive electronics in packaging and PCB production, sustainable electronics, and more. Explore the full agenda now and join the global industry in Mountain View on 10 & 11 JUNE 2026. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨Explore the Full Agenda and Register before 3 May when early bird rates expire GE Healthcare – Gurvinder Singh Khinda discusses sustainability in single-use medical sensors and devices. Gurvinder explores the significant environmental burden of biohazardous single-use products and the sanitation issues inherent in t...

The Future of Electronics RESHAPED USA conference and exhibition (10 & 11 JUNE 2026, Mountain View) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum, this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks from around the world, 8 industry- or expert-led masterclasses, 2 tours, and over 75 onsite exhibitors. In this article, we discuss and highlight various innovative talks at the event around the theme of Hybrid Electronic Manufacturing and Scale-Up. In other articles we cover themes like materials innovation, additive electronics in packaging and PCBs, wearables and sensors, soft robotics, additive and 3D electronics, sustainable electronics, and more. Explore the full agenda now and join the global industry in Mountain View on 10 & 11 JUNE 2026. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨Explore the Full Agenda and Register before 3 May when early bird rates expire NextFlex – Dan Gamota discusses manufacturing readiness for hybrid electronics. In this session, Dan explores the lack of standardized data and validated qualification pathways that currently slow the transition from lab innovation to industrial deployment. Emphasi...

The Future of Electronics RESHAPED USA conference and exhibition (10 & 11 JUNE 2026, Mountain View) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum, this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks from around the world, 8 industry- or expert-led masterclasses, 2 tours, and over 75 onsite exhibitors. In this article, we discuss and highlight various innovative talks at the event around the theme of Additive, Digital and/or 3D Electronics: Process Innovation. In other articles we cover themes like materials innovation, additive electronics in packaging and PCBs, wearables and sensors, soft robotics, additive electronics in packaging and PCB production, sustainable electronics, and more. Explore the full agenda now and join the global industry in Mountain View on 10 & 11 JUNE 2026. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨Explore the Full Agenda and Register before 3 May when early bird rates expire Lockheed Martin – Paul Gaylo discusses enabling high-temperature antennas with additive manufacturing. Paul explores why material availability alone fails to solve high-temperature design, as traditional fabrication cannot a...

Andrew Stemmermann & John Yundt SunRay Scientific Inc. Wall Township, NJ USA andrew@sunrayscientific.com johny@sunrayscientific.com SunRay Scientific Inc of Wall Township, NJ, USA continues to develop new and innovative technologies for electronic component assembly with their portfolio of novel ZTACH® ACE anisotropic conductive adhesives, printed conductive inks and dielectric and encapsulation materials. Introduction Today’s electronics manufacturers are confronted with a growing need for higher performance, lightweight, cost competitive, printed flexible hybrid electronics. This often requires the bonding of fine pitch components in high density and volumes. Factors for success include the capability of the conductive bonding technology to manage the pitch, bond strength requirements, cost constraints, and manufacturing throughput needs. Most available technologies employed in today’s FHE environment have limitations that can either hamper one or more of these important factors. Traditional component bonding technologies can struggle with the requirements for printed FHE applications. Solder, while very low cost and highly conductive, has limitations due to the required processing temperatures, brittle properties, and low bond strength. As a result, it will always require secondary encapsulation of the bonded component to ensure structural integrity. Silver-filled conductive adhesives (ECA) require patterning, which drastically limit component size and pitch, are heavily f...

Applications: Antennas · Electrodes · Conductors · Heaters · Circuit Boards Conventional flex-PCB production is still dominated by wet chemical etching or printed conductive inks—processes built around multiple material steps, hazardous chemicals, and inherently unstable cost structures driven by silver and other volatile inputs. While widely adopted, these methods are increasingly misaligned with what the market now demands: scalable production, supply chain resilience, regulatory compliance, and verifiable sustainability. Across industries, regulatory pressure is tightening. ESG (Environmental, Social and Governance) reporting requirements, restrictions on hazardous substances, and increasing scrutiny of chemical-intensive manufacturing processes are forcing companies to rethink not only what they produce, but how it is produced and documented. At the same time, geopolitical uncertainty and material volatility are exposing the fragility of globalized, chemistry-dependent supply chains. DP Patterning’s patented Dry Phase Patterning (DPP) technology was developed to remove these constraints entirely. At its core, DP Patterning replaces chemistry-based etching processes with a fully dry, mechanical roll-to-roll method. Instead of defining circuit geometry by selectively removing material through etchants and chemical processes, the pattern is formed directly in a metal-clad flexible substrate—typically aluminum-based laminates—using mechanical processing. The process is based ...

The Future of Electronics RESHAPED USA conference and exhibition (10 & 11 JUNE 2026, Mountain View) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum, this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks from around the world, 8 industry- or expert-led masterclasses, 2 tours, and over 75 onsite exhibitors. In this article, we discuss and highlight various innovative talks at the event around the theme of Material Innovations in Printed Electronics. In previous articles we covered process advancements, R2R manufacturing, smart surfaces and sensing, printed photovoltaics and more. Explore the full agenda now and join the global industry in Mountain View on 10 & 11 JUNE 2026. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨Explore the Full Agenda and Register before 3 May when early bird rates expire Tatsuta – Robert Wilson discusses silver-coated copper particle conductive pastes. Robert explores the critical challenge of copper oxidation, which severely impacts the reliability of low-cost interconnects when replacing expensive silver. By engineering silver-coated copper particles, Tatsuta combines the cost advantages of copper with ...

The Future of Electronics RESHAPED USA conference and exhibition (10 & 11 JUNE 2026, Mountain View) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum, this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks from around the world, 8 industry- or expert-led masterclasses, 2 tours, and over 75 onsite exhibitors. In this article, we discuss and highlight various innovative talks at the event around the theme of Additive Electronics in Packaging and PCB Manufacturing. In other articles we cover themes like materials innovation, hybrid electronic manufacturing and scale-up, wearables and sensors, soft robotics, additive and 3D electronics, sustainable electronics, and more. Explore the full agenda now and join the global industry in Mountain View on 10 & 11 JUNE 2026. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨Explore the Full Agenda and Register before 3 May when early bird rates expire GE Aerospace Research – David Lin discusses 3D MEMS IMU enabled by additive packaging. In this session, David explores how traditional 3D assembly is highly susceptible to long-term drift driven by package-induced stress. By utilizing an additively printed Aluminum Nitr...

21 & 22 OCT 2026 | Berlin Co-located with the Electronics RESHAPED conference and exhibition Winter early bird rates expire end of this week (3 April 2026) Preliminary list of confirmed speakers Perovskite Connect 2026 is the most important conference and tradeshow dedicated to all aspects of the perovskite industry, bringing together the entire community from around the world in Berlin on 21 and 22 OCT 2026.

Explore and Book This Week When Winter Early Birds Expire (3 April)
Preliminary speaker list includes Oxford PV, Microquanta, Qcells, Caelux, Kunshan GCL Optoelectronic Material Co.,Ltd, Hust/WonderSolar, CubicPV, Energy Material Corp, Power Roll, Bergfeld Lasertech, Homerun Energy, HB Fuller, imec, Helmholtz-Zentrum Berlin, Nano-C, Inc., PINA CREATION, Solar and Renewable Industry Leader, Tandem PV, Kalpana, Zentrum für Sonnenenergie-und Wasserstoff-Forschung Baden-Württemberg ZSW, Eternal Sun, Everlight, Nanyang Technological University, Unijet, etc. Learn more here
Winter early bird rates expire end of this week (3 April 2026) Explore and Book This Week When Winter Early Birds Expire (3 April) The 2026 edition is building on the great success of Perovskite Connect 2025 which was a sell-out event with packed conference tracks and buzzing exhibition stands. This event is already established as the most important event of the year dedicated to perovskite technology. The Perovskite Connect exhibition area is part of the Eectronics RESHAPED show in Berlin. There are...