Ranell Santa Cruz.

Novel Graphene Composite Powder Alternatives to Dispersions

Dmitri Tsentalovich

Conductive Carbon Nanotube Threads and Fabrics for Wearables and Smart Textiles

Siva Bohm

Graphite and Graphene additive Anode Li-B Technology

Thomas Nugraha

Printed Electronics For Product Innovation & New Product Introduction

Aad van der Spuij

Enabling smart surface designs by 3D Printed Electronics

Samuel Stremsdoerfer

JetSelectiv®: Ultra-thin and eco-friendly selective metallization process

Marco De Angeli

Recent developments in Flexible Hybrid Electronic technologies and their applicability for successful manufacturing strategies.

Uwe Braun

Smart packages as enablers of digital therapy adherence

Didier Muller

Plastronics – a short introduction

Manabu Ito

Highly bendable Inorganic TFT Array for Sensor Applications

Gregory Hitz

The multilayer approach to solid-state battery electrolytes - Transforming traditional battery architecture

Ines Miller

Challenges And Opportunities For Solid-State Players - Can They Be Competitive On The Battery Market Within Automotive Applications?

Corsin Battaglia

Interface Stability in Solid-State Batteries

Gleb Yushin

Sila’s Drop-In Silicon Anode Technology for a Sustainable Future

Mauro Francesco Sgroi

The role of materials simulation in the design of Li-ion batteries: the case of Li2TiS3 cathode

Andriy Korchev

Advances in Carbon Conductive Additives for LIB Applications

Michael Niggemann

OPV for IOT applications – Smart Power to Data

Trystan Watson

The Challenges of Scale for Printed Perovskite

Olle Lundberg

Evolar’s PV Power Booster line – a turnkey fab solution based on perovskite technology

Salima Alem

Printed Organic Photovoltaics for Indoor Light Energy Harvesting

Jan Birnstock

Green & Clean Electricity from Organic Solar Films

Mathilde Billaud

Economic and Environmental Perspectives on Panel Level Packaging

Doug Hopkins

Ceramic-Epoxy Integrated Substrate Structures for E-Field Profiling in Ultra Dense Power

Roger Brewer

Capacitors for Energy Storage and as a companion to Wide Band Gap Power Electronics

Carl McCants

Electronic Resurgence Initiative Briefing

Eric Forsythe

PM NextFlex Manufacturing Institute, ARL-ERP 3D Hybrid Electronics Thrust Leads

Dennis Cormier

Printed Electronics Via On-Demand Jetting of Liquid Metal Droplets

Alex Wang

Semiconductor Package Design Solution for High Density Fan-out Packaging – Chiplets & SiP

Susan Trulli

Characterization and Development of Printed Multi-material Interconnects and Passive Elements for Microwave Applications

Steve Statler

How to Scale the IoT to Trillions – Sensing as a Service with Sticker Sized Computers

Nobi Kambe

Opportunities & Challenges in 2D Materials Investment

Martin Lohe

In-Situ At-Scale Functionalization Towards Few-Layer Graphenes Without Additives: For Batteries, Textiles And Beyond

Ben Harries

3DCP and Graphene additives for architecture and infrastructure

Ana Cortez

LEIMSA – Lightweight Electronics by Injection Moulding in Seamless Architectures

Melbs LeMieux

Metal-complex silver inks for EMI shielding and conformal metal coatings for semiconductor packaging

Ralph Birnbaum

Digital, Multi-Materials, Non-Contact Large Area Printer

Enid Kivuti

Recent developments in Flexible Hybrid Electronic technologies and their applicability for successful manufacturing strategies.

Mickaël Pruvost

Printed piezoelectric materials: review of applications from sensing to actuation to energy harvesting.

Masaaki Sugimoto

Electronic component fabrication with inkjet additive manufacturing.

Erik Kremers

Spatial Atomic Layer Deposition: From Lab to Fab

Simon Nieh

Cathode and anode considerations in the development of all solid-state Lithium battery

Richard Clark

Opportunities for cathodes in commercialized solid-state batteries

Shalu Agarwal

Solid-state battery – the next-generation battery system

Benjamin Park

Commercial Ready High Energy Density Ultra-Fast Charge Cells

Daniela Werlich

Cathode Materials For Lithium Ion Batteries – Target actual Comparison: Limitations & Opportunities

Nicolo Brambilla

Silicon-Dominant and NMC Electrodes Through an NMP-free/ PVDF-free Process for High Energy Li-ion Batteries

Serena Mollenhauer

Ultra Barrier Films for Protecting Electronics and Fexible Photovoltaics

Sadok Ben Dkhil

Inkjet printed Flexible and Free Design OPV Modules for Indoor Application

Frankje de Boer

Off-grid and net-zero illuminated signage: Energy harvesting via Luminescent Solar Concentrator principles

Michael Irwin

Towards a Perovskite Tandem Future

Christine Kallmeyer

Technologies and Applications for Wearable e-Textiles

Lucy Dunne

Traditional and Fiber-Based Components: Challenges and Opportunities for E-Textile Garments

Brandon Prior

5G and Its Impact on Semiconductor and Packaging Supply Chain

Ahmed Elasser

Energy Storage: The Next Big Thing – 200 years in the making.

Mike Fanto

Quantum Integrated Photonics: Heterogeneous Integration in Foundry Level Devices

Jarrid Wittkopf

HP 3D Printing: Metal Jet Printing and 3D Printed Electronics

Michael Dickey

Liquid Metals for Soft and Additive Electronics

Manos Tentzeris

Inkjet-/3D-/4D-Printed “Zero-Power” Flexible Wireless Ultrabroadband Modules for IoT, Smart Agriculture and Smart Cities Applications

Babak Sabi

Advanced Packaging Architectures: Opportunities and Challenges

Clemens Türck

Printed Electronics in the Board Game Industry

Santiago Cartamil-Bueno

Graphene displays for AR/VR/HUD applications

Nima Moghimian

First Canadian Gigafactory with Graphene-Silicon Anodes

Simon Ayley

3DCP and Graphene additives for architecture and infrastructure

Sandra Melo

LEIMSA – Lightweight Electronics by Injection Moulding in Seamless Architectures

Hikaru Uno

Metal-complex silver inks for EMI shielding and conformal metal coatings for semiconductor packaging

Philipp Hölzl

Inks for printed Electronics

Abe Masayuki

Introduction of R2R printing technology for submicron resolution electrodes and applied devices

Daniel Haefliger

Molded elastic sensors: from scale-up to commercialization

Nouhad Bachnak

The trend toward miniaturization and functional integration in the electronic industry is unbeaten

Mike Rosenberg

Advantages of a 3-Dimensional, Solid-State, Rechargeable Battery

Denis Pasero

Micro to Giga Scale: Different Materials, Processes and Challenges

Holger Althues

New anode concepts for solid state batteries

Ionel Stefan

Full silicon nanowire anodes: towards highest energy density Lithium-ion batteries

Katharina Gerber

R2R Activated Dry Electrode Process for Cost-Effective Production of Solid-State Batteries

Casper Peeters

Nano-porous silicon for high-energy silicon-dominant batteries

Anjusree Shyla

Perovskite Inks: Inks & Formulation For Printing Perovskite Photovoltaics

Dan Pierpont

Ultra Barrier Films for Protecting Electronics and Fexible Photovoltaics

Miles Barr

Truly Transparent Solar Technology

Elias Stathatos

Piezoelectric drop-on-demand inkjet-printing as a high-throughput technique for the fabrication of large-sized perovskite solar modules.

Mélanie Bertrand

ASCA Activate your Design

Marek Kościelski

Elements of Sustainable Development of Electronics Products

ChenGang Zhuang

Thin, Flexible Alumina Ribbon Ceramic and its Application in 5G mmWave Filter

Eric Cotts

Examination of Electromigration Effects in Sn-Bi Based Solder Joints

Shenqiang Ren

High-Temperature Cu Ink Material and All-Printed Conformal Electronics

Roger Smith

Interconnect Technologies (Printed Circuit Boards) Required to Support Microelectronics Packaging in DoD

Michael Hamilton

Superconducting Interconnect Technologies for Cryogenic and Quantum Systems

Nathaniel Cady

Materials Development and Integration Strategies for Neuromorphic Computing and AI Hardware

Kamal Slkka

Heterogeneous Integration for Al Workloads

Mukesh V. Khare

Opening Remarks

Tobias Holmgaard Stær

Stretchable Printed Sensors for Digital Health Care Solutions in Mass Production